High performance copper-water heat pipes with nanoengineered evaporator sections

Author(s):  
Ahmed A. Abdulshaheed ◽  
Pengtao Wang ◽  
Guanghan Huang ◽  
Chen Li
Author(s):  
Pramod Chamarthy ◽  
H. Peter J. de Bock ◽  
Boris Russ ◽  
Shakti Chauhan ◽  
Brian Rush ◽  
...  

Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick’s capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.


Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


Author(s):  
Jie Wei

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.


Author(s):  
Yiding Cao ◽  
Jian Ling

In this study, three copper-water rotating heat pipes having inner diameters of 1.5, 2, and 3 mm, respectively, are fabricated and tested. The effectiveness of the copper-water heat pipe is first validated by comparing its performance with that of a copper bar having the same inner and outer diameters. The heat pipes are then tested to prove their reliability, high effective thermal conductance, and critical working limitation. The experimental data shows that the critical limitation may be reached when the inner diameter of the heat pipe is below 1.5 mm under the condition of a low rotating speed. The tests of these water heat pipes could also explore potential applications of radially rotating heat pipes in disks/blades of a high-pressure compressor.


1999 ◽  
Vol 121 (07) ◽  
pp. 64-65
Author(s):  
Calvin C. Silverstein

This article reviews heat pipes that address thermal management problems inside high-performance aircraft engines. Higher performance engines demand that compressors develop higher pressure ratios which, in turn, result in higher temperatures at the entrance to the combustor. CCS Associates of Bethel Park, PA, proposes tackling the problem by using pipes to distribute heat more effectively throughout the combustor. The heat pipe liner must handle both acceleration and vibration. The heat pipe arrays, including half-thickness webs, can be fabricated into gas-side and air-side halves by extrusion, forging, stamping, chemical milling, or some combination of methods. The liquid flow channel would be formed as an integral part of the gas-side valves.


Volume 3 ◽  
2004 ◽  
Author(s):  
Mark M. Weislogel ◽  
Michael A. Bacich

Over the past decade, the search for and development of high performance thermal transport systems for a variety of cooling and thermal control applications have intensified. One approach employs a new semi-passive oscillatory heat transport system called the Pulse Thermal Loop (PTL). The PTL, which has only recently begun to be characterized, exploits large pressure differentials from coupled evaporators to force (pulse) fluid through the system. Driving pressures of over 1.8MPa (260psid) have been demonstrated. Other passive cooling systems, such as heat pipes and Loop Heat Pipes, are limited by capillary driving forces, typically less than 70kPa (10psid). Large driving forces can be achieved by a mechanically pumped loop, however, at the expense of increased power consumption, increased total mass, and increased system cost and complexity. The PTL can be configured in either active or semi-passive modes, it can be readily designed for large ∼ O(100kW) or small ∼ O(10W) heat loads, and it has a variety of unique performance characteristics. For low surface tension dielectric fluids such as R-134a, the PTL system has over a 10-fold heat carrying capacity in comparison to high performance heat pipes. Data accumulated thus far demonstrate that the PTL can meet many of the requirements of advanced terrestrial and spacecraft cooling systems: a system that is robust, ‘semi-passive,’ high flux, and offers high heat transport thermal control while remaining flexible in design, potentially lightweight, and cost competitive.


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