“Volume-point” heat conduction constructal optimization based on minimization of maximum thermal resistance with triangular element at micro and nanoscales

2016 ◽  
Vol 89 (2) ◽  
pp. 302-312 ◽  
Author(s):  
H.J. Feng ◽  
L.G. Chen ◽  
Z.H. Xie ◽  
F.R. Sun
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.


2019 ◽  
Vol 30 (5) ◽  
pp. 2655-2668 ◽  
Author(s):  
Wojciech Piotr Adamczyk ◽  
Marcin Gorski ◽  
Ziemowit Ostrowski ◽  
Ryszard Bialecki ◽  
Grzegorz Kruczek ◽  
...  

Purpose Large structural objects, primarily concrete bridges, can be reinforced by gluing to their stretched surface tapes of fiber-reinforced polymer (FRP). The condition for this technology to work requires the quality of the bonding of FRP and the concrete to be perfect. Possible defects may arise in the phase of construction but also as a result of long-term fatigue loads. These defects having different forms of voids and discontinuities in the bonding layer are difficult to detect by optical inspection. This paper aims to describe the development of a rapid and nondestructive method for quantitative assessment of the debonding between materials. Design/methodology/approach The applied technique belongs to the wide class of active infrared (IR) thermography, the principle of which is to heat (or cool) the investigated object, and determine the properties of interest from the recorded, by an IR camera, temperature field. The methodology implemented in this work is to uniformly heat for a few seconds, using a set of halogen lamps, the FRP surface attached to the concrete. The parameter of interest is the thermal resistance of the layer separating the polymer tape and the concrete. The presence of voids and debonding will result in large values of this resistance. Its value is retrieved by solving an inverse transient heat conduction problem. This is accomplished by minimizing, in the sense of least squares, the difference between the recorded and simulated temperatures. The latter is defined as a solution of a 1D transient heat conduction problem with the already mentioned thermal resistance treated as the only decision variable. Findings A general method has been developed, which detects debonding of the FRP tapes from the concrete. The method is rapid and nondestructive. Owing to a special selection of the compared dimensionless measured and simulated temperatures, the method is not sensitive to the surface quality (roughness and emissivity). Measurements and calculation may be executed within seconds. The efficiency of the technique has been shown at a sample, where the defects have been artificially introduced in a controlled manner. Originality/value A quantitative assessment procedure which can be used to determine the extent of the debonding has been developed. The procedure uses inverse technique whose result is the unknown thermal resistance between the member and the FRP strip.


Author(s):  
Xingang Liang ◽  
Bao Yue

Heat conduction rectifier is attracting more attention due to its potential application to process thermal currents independently and convert them into electronic signals. This work reports an investigation by molecular dynamics simulation on the heat conduction rectification effect in the nanostructure whose cross-section have step change along the heat flux. It is found that thermal resistance is different with reversed heat flux direction, which is called the heat conduction rectification. The heat conduction rectification depends on the temperature difference. By reducing temperature difference across the nanostructure, the rectification could be reversed. When the temperature difference is small enough, the thermal resistance is larger when the heat flux flows from the thick part to the thin part when the length of the structure is about 10 nm. The larger variation in the cross-section leads the larger difference in the thermal resistance with opposite heat flux. The mechanism of the rectification is discussed. If we take phonons as liquid particles and consider the case of a liquid flowing through a channel with step expansion in cross-section, the flow resistance is less with liquid flowing from the narrow part to the wide part than that in the case with contrary flow direction. In fact, the scattering of phonons at the step face reduces the mean free path of phonon when heat flux conducts from the narrow end to the wide end.


Entropy ◽  
2020 ◽  
Vol 22 (11) ◽  
pp. 1206
Author(s):  
Shuhuan Wei ◽  
Huijun Feng ◽  
Lingen Chen ◽  
Yanlin Ge

With the aid of constructal theory and entransy theory, a Tau-shaped fin (TAUSF) is investigated in this paper, and the widths of the bend end and elemental fins are assumed to be different. The construct of the TAUSF is optimized by the minimum equivalent thermal resistance (ETR) obtained by entransy dissipation rate. The constraints of total enveloping volume and fin material volume are considered. The results show that in the specified range of width ratio, the twice minimum ETR of the TAUSF can be yielded by an optimal width ratio and an optimal length ratio. In addition, comparing the optimal performance of the TAUSF with the counterpart of a T-shaped fin, the former sacrifices a small amount of heat transfer performance and its stiffness increases due to its structure with the bend end. The optimal structure of the TAUSF yielded from ETR minimization is conspicuously different with the counterpart yielded from maximum thermal resistance minimization. Comparing the thermal performances of the two optimal constructs, the ETR of the former optimal construct is declined by 10.58%, whereas the maximum thermal resistance is augmented by 5.22%. The former optimal construct can lead to the uniformity of temperature gradient and the reduction in thermal stress, and can guide the engineering designs of practical fins.


Entropy ◽  
2019 ◽  
Vol 21 (12) ◽  
pp. 1200 ◽  
Author(s):  
David Jou ◽  
Liliana Restuccia

We consider heat conduction in a superlattice with mobile defects, which reduce the thermal conductivity of the material. If the defects may be dragged by the heat flux, and if they are stopped at the interfaces of the superlattice, it is seen that the effective thermal resistance of the layers will depend on the heat flux. Thus, the concentration dependence of the transport coefficients plus the mobility of the defects lead to a strongly nonlinear behavior of heat transport, which may be used in some cases as a basis for thermal transistors.


1987 ◽  
Vol 12 (4) ◽  
pp. 239-250 ◽  
Author(s):  
R. A. Tatara

A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve for three-dimensional heat conduction. Effects of voids in the solder regions are included. A sample case is analyzed, and a comparison is made to a recent study.


2021 ◽  
Author(s):  
Jun Zhou ◽  
Qing Xi ◽  
Jixiong He ◽  
Xiangfan Xu ◽  
Tsuneyoshi Nakayama ◽  
...  

Author(s):  
Murat Barisik ◽  
Ziyuan Shi ◽  
Ali Beskok

Heat conduction between two parallel solid walls separated by liquid argon is investigated using three-dimensional molecular dynamics (MD) simulations. Liquid argon molecules confined in silver and graphite nano-channels are examined separately. Heat flux and temperature distribution within the nano-channels are calculated by maintaining a fixed temperature difference between the two solid surfaces. Temperature profiles are linear sufficiently away from the walls, and heat transfer in liquid argon obeys the Fourier law. Temperature jump due to the interface thermal resistance (i.e., Kapitza length) is characterized as a function of the wall temperature. MD results enabled development of a phenomenological model for the Kapitza length, which is utilized as the coefficient of a Navier-type temperature jump boundary condition using continuum heat conduction equation. Analytical solution of this model results in successful predictions of temperature distribution in liquid-argon confined in silver and graphite nano-channels as thin as 7 nm and 3.57 nm, respectively.


Sign in / Sign up

Export Citation Format

Share Document