Structure design and optimization of SOI high-temperature pressure sensor chip

2021 ◽  
pp. 105245
Author(s):  
Xin Tang ◽  
Junwang Tian ◽  
Jiafeng Zhao ◽  
Zhong Jin ◽  
Yunpeng Liu ◽  
...  
Symmetry ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 2098
Author(s):  
Hongying Guo ◽  
Jiang Chen ◽  
Zhumei Tian ◽  
Aizhen Wang

For the requirement of pressure detection in high temperature environments, this paper presents a fiber Bragg grating (FBG) based pressure sensor with a simple structure. The structural model of the sensor has been established with the consideration of a sensing principle and a small deflection effect of the circular membrane. The finite element analysis has been employed to validate the rationality of the sensor structure design and realize the digital simulation of the theoretical model. Through the analysis, the selection of packaging materials, the design of structural parameters and the pressure and temperature calibration of the developed sensor has been performed. The encapsulation of the sensor at high temperatures has been improved based on the theoretical analysis, simulation and testing, which proves the effectiveness of the sensor for pressure measurement at high temperatures of 100 °C~250 °C. The study provides a feasible sensing device for high-temperature pressure detection.


2010 ◽  
Vol 437 ◽  
pp. 397-401 ◽  
Author(s):  
Zhuang De Jiang ◽  
Li Bo Zhao ◽  
Yu Long Zhao ◽  
Yuan Hao Liu ◽  
Philip D. Prewett ◽  
...  

In order to solve pressure measurement problems in the fields of aerospace, petroleum and chemical industry, mobile and military industry, a oil-filled isolated piezoresistive high pressure sensor has been developed with the range of 0~100 MPa, and was able to work reliably under high temperature of above 200 °C. Based on MEMS (Micro Electro-Mechanical System) and SIMOX (Separation by Implantation of Oxygen) technology, the piezoresistive sensor chip has been developed. By high temperature packaging process, the oil-filled isolated high pressure sensor was fabricated with the sensor chip and corrugated diaphragm. The experimental results showed that the oil-filled isolated high pressure sensor had good performances under high temperature of 200 °C, such as linearity error of 0.07%FS, repeatability error of 0.04%FS, hysteresis error of 0.03%FS.


2012 ◽  
Vol 591-593 ◽  
pp. 1260-1264
Author(s):  
Ling Cao

The differential stress distribution of rectangular diaphragm with different sizes is simulated and analyzed using ANSYS. The results show that the maximal differential stress region on the rectangular diaphragm is located at the diaphragm center and the long side center, and also it gradually increases as the length-width ratio decrease. When the ratio is less than 1:2.2, the increase degree is not obvious and even falls slightly. According to this, the length-width ratio of the rectangular strain diaphragm was optimized as 1:2.2. Furthermore, the influence of stain diaphragm with different thicknesses and temperatures in differential stress distribution is discussed. It proves that the differential stress of the diaphragm is less affected by temperature, when the diaphragm thickness is properly chosen. The present results will provide the prerequisite for the design of miniature high-temperature pressure sensor in the future.


Sensor Review ◽  
2014 ◽  
Vol 34 (3) ◽  
pp. 312-318 ◽  
Author(s):  
Zhongliang Yu ◽  
Yulong Zhao ◽  
Lili Li ◽  
Cun Li ◽  
Xiawei Meng ◽  
...  

Purpose – The purpose of this study is to develop a piezoresistive absolute micro-pressure sensor for altimetry. For this application, both high sensitivity and high overload resistance are required. To develop a piezoresistive absolute micro-pressure sensor for altimetry, both high sensitivity and high-overload resistance are required. The structure design and optimization are critical for achieving the purpose. Besides, the study of dynamic performances is important for providing a solution to improve the accuracy under vibration environments. Design/methodology/approach – An improved structure is studied through incorporating sensitive beams into the twin-island-diaphragm structure. Equations about surface stress and deflection of the sensor are established by multivariate fittings based on the ANSYS simulation results. Structure dimensions are determined by MATLAB optimization. The silicon bulk micromachining technology is utilized to fabricate the sensor prototype. The performances under both static and dynamic conditions are tested. Findings – Compared with flat diaphragm and twin-island-diaphragm structures, the sensor features a relatively high sensitivity with the capacity of suffering atmosphere due to the introduction of sensitive beams and the optimization method used. Originality/value – An improved sensor prototype is raised and optimized for achieving the high sensitivity and the capacity of suffering atmosphere simultaneously. A general optimization method is proposed based on the multivariate fitting results. To simplify the calculation, a method to linearize the nonlinear fitting and optimization problems is presented. Moreover, a differential readout scheme attempting to decrease the dynamic interference is designed.


2021 ◽  
Vol 26 (2) ◽  
pp. 43
Author(s):  
Constantino Grau Grau Turuelo ◽  
Cornelia Breitkopf

The prediction and control of the transformation of void structures with high-temperature processing is a critical area in many engineering applications. In this work, focused on the void shape evolution of silicon, a novel algebraic model for the calculation of final equilibrium structures from initial void cylindrical trenches, driven by surface diffusion, is introduced. This algebraic model provides a simple and fast way to calculate expressions to predict the final geometrical characteristics, based on linear perturbation analysis. The obtained results are similar to most compared literature data, especially, to those in which a final transformation is reached. Additionally, the model can be applied in any materials affected by the surface diffusion. With such a model, the calculation of void structure design points is greatly simplified not only in the semiconductors field but in other engineering fields where surface diffusion phenomenon is studied.


2013 ◽  
Vol 771 ◽  
pp. 159-162
Author(s):  
Li Feng Qi ◽  
Zhi Min Liu ◽  
Xing Ye Xu ◽  
Guan Zhong Chen ◽  
Xue Qing

The relative research of low range and high anti-overload piezoresistive pressure sensor is carried out in this paper and a new kind of sensor chip structure, the double ends-four beam structure, is proposed. Trough the analysis, the sensor chip structure designed in this paper has high sensitivity and linearity. The chip structure is specially suit for the micro-pressure sensor. The theoretical analysis and finite element analysis is taken in this paper, which provide important scientific basis for the pressure sensor development.


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