The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers
Keyword(s):
1973 ◽
Vol 31
◽
pp. 150-151
1977 ◽
Vol 35
◽
pp. 688-691
1977 ◽
Vol 35
◽
pp. 126-129
1977 ◽
Vol 35
◽
pp. 124-125
Keyword(s):
1976 ◽
Vol 34
◽
pp. 520-521
1991 ◽
Vol 49
◽
pp. 604-605
1975 ◽
Vol 33
◽
pp. 60-61