Formation of defects in boron-implanted PEPBLT structures
Variations on LOCOS (local-oxidation of silicon) are being explored for device-isolation, to implement further miniaturization of VLSI devices. One such variation involves poly-encapsulated poly-buffered LOCOS + trench-isolation (PEPBLT). The method provides a means to support device scaling and to create self-aligned shallow field-oxide elements with minimal encroachment into active regions. In an earlier study, dislocations were observed to be associated with a combination of high-dose ∼1E15 cm−2 phosphorus implants and PEPBLT isolation. The present study investigates the effect of boron implants on similar PEPBLT structures. The effect of fabrication-related stresses in the structures is of interest because extended-defects, if formed, could electrically degrade transistors.PEPBLT structures were exposed to varied processing conditions to build high-performance bipolar transistors. Isolated active-device regions from the above structures were characterized using TEM. Some of the active regions were (i) implanted with 80 keV-8.5E15 cm−2 boron with no anneal, (ii) implanted with 80 keV- 8.5E15 cm−2 boron and annealed at 900°C/90’/N2 plus 1050°C/30” RTA during the course of processing, (iii) not implanted.