Highly compact wideband double-section rat-race hybrid with harmonic suppression using series and shunt stepped impedance transmission lines

2016 ◽  
Vol 9 (4) ◽  
pp. 797-803 ◽  
Author(s):  
Kanaparthi V. Phani Kumar ◽  
S. S. Karthikeyan
Keyword(s):  
Transmission Line ◽  
Transmission Lines ◽  
Communication Systems ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Harmonic Suppression ◽  
Quarter Wavelength ◽  
Bonding Wires ◽  
Via Holes ◽  
Lumped Elements

This paper presents the design of a size miniaturized and harmonic suppressed wideband double-section rat-race coupler (RRC). Series and shunt stepped-impedance transmission line units are proposed to replace the quarter wavelength transmission lines in the conventional design of wideband (50% fractional bandwidth) two-stage rat-race coupler. Design equations are derived using the lossless transmission line model. The proposed double-section RRC occupies only 14% area of the conventional coupler, with good return loss and isolation performances. In addition, the full-wave simulation and measured responses exhibit harmonic suppression up to at least fifth harmonic. The proposed design can be easily implemented using the standard printed circuit board etching process without any via-holes, bonding wires, and lumped elements, which make it very useful for wireless communication systems

Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet

2005 ◽  
Vol 2 (3) ◽  
pp. 189-196 ◽  
Author(s):  
Yasushi Sawada ◽  
Keiichi Yamazaki ◽  
Noriyuki Taguchi ◽  
Tetsuji Shibata
Keyword(s):  
Atmospheric Pressure ◽  
Printed Circuit Board ◽  
Formation Rate ◽  
Plasma Processing ◽  
Atmospheric Pressure Plasma ◽  
Plasma Jet ◽  
Circuit Board ◽  
Bottom Surface ◽  
Printed Circuit ◽  
Via Holes

The effectiveness of atmospheric pressure (AP) plasma preprocessing before Ni/Au or Cu plating has been examined by applying it to a build-up printed circuit board (FR-4 grade) and polyimide-based flexible circuit film, both with blind via-holes (BVHs). The AP plasma applied with a dielectric barrier discharge is generated inside a 56 mm wide quartz vessel by an RF power generator using Ar-O2 gas mixture. One side of the vessel is open and the plasma jet is blown on the sample substrate transported 5 mm downward from the outlet of the vessel. The deposit failure rate of Ni/Au electroless deposit to 50 μm-diameter BVHs formed on a photo resist on the printed circuit board is 12.5% without preprocessing but is decreased to 0% after applying the AP plasma processing. As for 50 μm-diameter BVHs formed with a YAG laser on a polyimide-based flexible circuit film, the bump formation using electrolytic copper plating fails without preprocessing, but a 100% bump formation rate is achieved after applying AP plasma processing. It is presumed that the AP plasma processing improves the wetting property of the BVH walls and allows the plating solution to uniformly cover the entire wall surfaces without generating bubbles. The removal of organic substances attached to the BVH bottom surface also helps to improve the adherence of metal plating.

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

2016 ◽  
Vol 2016 (1) ◽  
pp. 000358-000363 ◽  
Author(s):  
Qianfei Su ◽  
A. Ege Engin ◽  
Jerry Aguirre
Keyword(s):  
Surface Roughness ◽  
Cross Sections ◽  
Transmission Lines ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Electrical Characterization ◽  
Cavity Resonator ◽  
Circuit Board ◽  
Low Profile ◽  
Measure Surface Roughness

Abstract Signal attenuation in transmission lines is a major issue for reliable transmission in high frequency range. Knowledge of the electrical parameters of printed circuit board (PCB), including dielectric constant and loss tangent, is critical. Moreover, surface roughness has a great effect on loss in high frequency. This paper demonstrates an effective simulation fitting method for electrical material characterization. Cavity resonator is chosen as the circuit for characterization. A methodology is presented to measure surface roughness from cross sections, and compared with values extracted from resonator measurements. Several materials and copper foils treatments, including low-profile, are analyzed in this paper.

Transmission Line

2020 ◽  
pp. 43-71
Keyword(s):  
Transmission Line ◽  
Transmission Lines ◽  
Magnetic Energy ◽  
Propagation Constant ◽  
Characteristic Impedance ◽  
Electric Energy ◽  
Electromagnetic Energy ◽  
The Other ◽  
Electrical Characteristics ◽  
Lumped Elements

A transmission line (TL) is simply a medium that is capable of guiding or propagating electromagnetic energy. The transmission line stores the electric (E) and magnetic (M) energies and distributes them in space by alternating them between the two forms. This means that at any point along a TL, energy is stored in a mixture of E and M forms and, for an alternating signal at any point on the TL, converted from one form to the other as time progresses. Transmission line is usually modelled using lumped elements (i.e., inductors for magnetic energy, capacitors for electric energy, and resistors for modelling losses). The electrical characteristics of a TL such as the propagation constant, the attenuation constant, the characteristic impedance, and the distributed circuit parameters can only be determined from the knowledge of the fields surrounding the transmission line. This chapter gives a brief overview of various transmission lines, with more detailed discussions on the microstrip and the SIW.

scholarly journals Design Impedance Mismatch Physical Unclonable Functions for IoT Security

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Xiaomin Zheng ◽  
Yuejun Zhang ◽  
Jiaweng Zhang ◽  
Wenqi Hu
Keyword(s):  
Transmission Line ◽  
Printed Circuit Board ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Circuit Board ◽  
Physical Factors ◽  
Current Feedback ◽  
Impedance Mismatch ◽  
Feedback Amplifier ◽  
Current Feedback Amplifier

We propose a new design, Physical Unclonable Function (PUF) scheme, for the Internet of Things (IoT), which has been suffering from multiple-level security threats. As more and more objects interconnect on IoT networks, the identity of each thing is very important. To authenticate each object, we design an impedance mismatch PUF, which exploits random physical factors of the transmission line to generate a security unique private key. The characteristic impedance of the transmission line and signal transmission theory of the printed circuit board (PCB) are also analyzed in detail. To improve the reliability, current feedback amplifier (CFA) method is applied on the PUF. Finally, the proposed scheme is implemented and tested. The measure results show that impedance mismatch PUF provides better unpredictability and randomness.

Crosstalk Simulation Based on Full Wave S-Parameter Extraction Method between High-Speed Signals

2012 ◽  
Vol 433-440 ◽  
pp. 3514-3520
Author(s):  
Hong Tao Sun ◽  
Shu Guo Xie ◽  
Yan Liu ◽  
Bang Jun Chen
Keyword(s):  
Transmission Lines ◽  
High Speed ◽  
Printed Circuit Board ◽  
Simulation Method ◽  
Parameter Extraction ◽  
Circuit Board ◽  
Frequency Domain Method ◽  
Coupling Mechanism ◽  
Full Wave ◽  
S Parameter

Crosstalk between high speed parallel bus signals is one of the most important signal integrity(SI) issues. In this article, a crosstalk simulation method based on full-wave scattering parameters extraction for transmission lines is researched. First, the coupling mechanism between transmission lines is analyzed using S-Parameter network theory and a fast frequency-domain method for crosstalk calculation is introduced. Then based on this method, some basic rules of crosstalk are studied in details and the method is validated by simulation results which agree well with those of RLGC model. At the end of this paper, a practical crosstalk simulation example between high speed data bus signals on a 8-layered printed circuit board is demonstrated step by step.

A K-band delay line based on parasitic reduced artificial left-handed transmission line

2013 ◽  
Vol 5 (6) ◽  
pp. 709-711
Author(s):  
Hyun-Seung Lee ◽  
Eun-Gyu Lee ◽  
Choul-Young Kim
Keyword(s):  
Transmission Line ◽  
Return Loss ◽  
Printed Circuit Board ◽  
Delay Line ◽  
Circuit Board ◽  
Printed Circuit ◽  
Left Handed ◽  
24 Ghz ◽  
K Band ◽  
Interdigital Capacitors

A K-band microstrip delay line based on parasitic reduced left-handed transmission line (LHTL) with interdigital capacitors and shunt inductors is demonstrated with the aid of printed circuit board technology. The proposed delay line has ground slots under the interdigital capacitors to reduce the parasitic capacitance. The time delay of the proposed LHTLs is approximately 2.6 times larger than that of the conventional LHTLs. The input return loss of the proposed LHTL at 24 GHz is −16.9 dB and less than −10 dB from 20.5 to 26.1 GHz.

404 Modeling Method of the Printed Circuit Board with Some Kind of Arrangements of Thermal Via Holes

2010 ◽  
Vol 2010.47 (0) ◽  
pp. 129-130
Author(s):  
Sadakazu TAKAKUWA ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA ◽  
Tomoyuki HATAKEYAMA
Keyword(s):  
Printed Circuit Board ◽  
Modeling Method ◽  
Circuit Board ◽  
Printed Circuit ◽  
Via Holes

Bare die connections via aerosol jet technology for millimeter wave applications

2019 ◽  
Vol 11 (5-6) ◽  
pp. 441-446
Author(s):  
Franz Xaver Röhrl ◽  
Johannes Jakob ◽  
Werner Bogner ◽  
Robert Weigel ◽  
Stefan Zorn
Keyword(s):  
Printed Circuit Board ◽  
Mechanical Stability ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Circuit Board ◽  
Silver Ink ◽  
Measurement Results ◽  
Bonding Wires ◽  
Technology Transitions ◽  
Rf Performance

AbstractThis paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

scholarly journals Novel Low-Cost Power Divider for 5.8 GHz

Electronics ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 699
Author(s):  
Tso-Jung Chang ◽  
Krishna Pande ◽  
Heng-Tung Hsu
Keyword(s):  
Transmission Lines ◽  
Insertion Loss ◽  
Printed Circuit Board ◽  
Characteristic Impedance ◽  
Past Research ◽  
Size Reduction ◽  
Circuit Board ◽  
Superior Performance ◽  
Published Data ◽  
Coupled Line

This paper presents a new capacitive lump-free structure for power dividers using a printed-circuit board, while maintaining size reduction and physical isolation. The conventional lumped capacitors approach has self-resonant problem and cause worse S 22 and isolation at high frequencies. To overcome such technical issues, the coupled-line structures were introduced in the isolation network. After optimizing the distance between output ports and position of the isolation network, tuning the characteristic impedance and electrical length of transmission lines can decide the value of the lump resistor. The first example was designed at 1 GHz, and the resistor in the isolation network was 330 ohm, having 0.2-dB insertion loss and 19% total bandwidth, while maintaining 80-degree distance between split ports and 180-degree total length, providing 21% to 67% size reduction. The second example was designed at 5.8 GHz, which was five times greater than in past research, using an RO4003C substrate while maintaining a 0.24-dB insertion loss, 17% total bandwidth, and 0.06 dB amplitude imbalance, which was only 0.01 dB more than in recent research. Such superior performance is mainly attributed to the coupled transmission lines in the isolation network featuring a capacitive lump-free isolation network. Our data indicate that amplitude imbalance, bandwidth, and miniaturization are superior to any published data.

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