scholarly journals Determining the input reflection coefficient of integrated antennas using over-the-air measurements under near-field conditions

2020 ◽  
pp. 1-7
Author(s):  
A.J. van den Biggelaar ◽  
D.P.P. Daverveld ◽  
A.C.F. Reniers ◽  
A.B. Smolders ◽  
U. Johannsen
Keyword(s):  
Reflection Coefficient ◽  
Integrated Circuit ◽  
Near Field ◽  
Cost Effective ◽  
High Volume ◽  
Testing Procedure ◽  
Field Conditions ◽  
Integrated Antennas ◽  
Measurement Results ◽  
On Chip

Abstract One of the current trends in the integrated circuit (IC) development is the integration of antennas on-chip or in the package of the IC. This poses challenges in the production testing process of the packaged IC, as the antenna functionality has to be included and at least one of the signal ports cannot be accessed at a conducted manner. In order to measure the reflection coefficient of an integrated antenna, a contactless characterization method (CCM) can be used. In this paper, the practicality of a CCM is assessed, having the application of a cost-effective high-volume testing procedure for integrated antennas in mind. It is shown that the CCM yields accurate results for different imperfections in the measurement setup. Moreover, measurement results around 33 GHz using a connectorized patch antenna are shown, which experimentally verify the validity of using the CCM under near-field conditions.

scholarly journals Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

IoT ◽  
2020 ◽  
Vol 1 (2) ◽  
pp. 309-319
Author(s):  
Atefeh Kordzadeh ◽  
Dominik Holzmann ◽  
Alfred Binder ◽  
Thomas Moldaschl ◽  
Johannes Sturm ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Power Efficiency ◽  
Power Transmission ◽  
Near Field ◽  
Transmission Efficiency ◽  
Sensory Data ◽  
On Chip Antenna ◽  
On Chip ◽  
Asic Chip ◽  
Screen Printed

With the ongoing trend toward miniaturization via system-on-chip (SoC), both radio-frequency (RF) SoCs and on-chip multi-sensory systems are gaining significance. This paper compares the inductance of a miniaturized on-chip near field communication (NFC) antenna versus the conventional screen-printed on-substrate ones that have been used for the transfer of sensory data from a chip to a cell phone reader. Furthermore, the transferred power efficiency in a coupled NFC system is calculated for various chip coil geometries and the results are compared. The proposed NFC antenna was fabricated via a lithography process for an application-specific integrated circuit (ASIC) chip. The chip had a small area of 2.4 × 2.4 mm2, therefore a miniaturized NFC antenna was designed, whereas the screen-printed on-substrate antennas had an area of 35 × 51 mm2. This paper investigates the effects of different parameters such as conductor thickness and materials, double layering, and employing ferrite layers with different thicknesses on the performance of the on-chip antennas using full-wave simulations. The presence of a ferrite layer to increase the inductance of the antenna and mitigate the interactions with backplates has proven useful. The best performance was obtained via double-layering of the coils, which was similar to on-substrate antennas, while a size reduction of 99.68% was gained. Consequently, the coupling factors and maximum achievable power transmission efficiency of the on-chip antenna and on-substrate antenna were studied and compared.

Immobilization of Radionuclides on Iron Canister Material at Simulated Near-field Conditions

2008 ◽  
Author(s):  
Daqing Cui ◽  
Ylva Ranebo ◽  
Jeanett Low ◽  
Vincenzo Rondinella ◽  
Jinshan Pan ◽  
...  
Keyword(s):  
Near Field ◽  
Field Conditions

The Radio Probe™: A New Measurement Tool for High Speed Integrated Circuits

2005 ◽  
Author(s):  
Mark Kimball
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
High Speed ◽  
Attenuation Factor ◽  
Cost Effective ◽  
Frequency Measurement ◽  
Single Frequency ◽  
Measurement Tool ◽  
Probe Design ◽  
Differential Measurement

Abstract This article presents a novel tool designed to allow circuit node measurements in a radio frequency (RF) integrated circuit. The discussion covers RF circuit problems; provides details on the Radio Probe design, which achieves an input impedance of 50Kohms and an overall attenuation factor of 0 dB; and describes signal to noise issues in the output signal, along with their improvement techniques. This cost-effective solution incorporates features that make it well suited to the task of differential measurement of circuit nodes within an RF IC. The Radio Probe concept offers a number of advantages compared to active probes. It is a single frequency measurement tool, so it complements, rather than replaces, active probes.

Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology

2014 ◽  
Author(s):  
H.H. Yap ◽  
P.K. Tan ◽  
G.R. Low ◽  
M.K. Dawood ◽  
H. Feng ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Cost Effective ◽  
Tetraethyl Orthosilicate ◽  
Ic Design ◽  
Advance Technology ◽  
Defect Identification ◽  
Technology Scaling ◽  
And Function ◽  
Metal Layers

Abstract With technology scaling of semiconductor devices and further growth of the integrated circuit (IC) design and function complexity, it is necessary to increase the number of transistors in IC’s chip, layer stacks, and process steps. The last few metal layers of Back End Of Line (BEOL) are usually very thick metal lines (>4μm thickness) and protected with hard Silicon Dioxide (SiO2) material that is formed from (TetraEthyl OrthoSilicate) TEOS as Inter-Metal Dielectric (IMD). In order to perform physical failure analysis (PFA) on the logic or memory, the top thick metal layers must be removed. It is time-consuming to deprocess those thick metal and IMD layers using conventional PFA workflows. In this paper, the Fast Laser Deprocessing Technique (FLDT) is proposed to remove the BEOL thick and stubborn metal layers for memory PFA. The proposed FLDT is a cost-effective and quick way to deprocess a sample for defect identification in PFA.

Integrated Circuit Device Repair Using FIB System: Tips, Tricks, and Strategies

1999 ◽  
Author(s):  
K. N. Hooghan ◽  
K. S. Wills ◽  
P.A. Rodriguez ◽  
S.J. O’Connell
Keyword(s):  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Dead Reckoning ◽  
Physical Damage ◽  
Art Form ◽  
Metal Levels ◽  
Potential Damage ◽  
On Chip ◽  
Beam Currents

Abstract Device repair using Focused Ion Beam(FIB) systems has been in use for most of the last decade. Most of this has been done by people who have been essentially self-taught. The result has been a long learning curve to become proficient in device repair. Since a great deal of the problem is that documentation on this “art form” is found in papers from many different disciplines, this work attempts to summarize all of the available information under one title. The primary focus of FIB device repair is to ensure and maintain device integrity and subsequently retain market share while optimizing the use of the instrument, usually referred to as ‘beam time’. We describe and discuss several methods of optimizing beam time. First, beam time should be minimized while doing on chip navigation to reach the target areas. Several different approaches are discussed: dead reckoning, 3-point alignment, CAD-based navigation, and optical overlay. Second, after the repair areas are located and identified, the desired metal levels must be reached using a combination of beam currents and gas chemistries, and then filled up and strapped to make final connections. Third, cuts and cleanups must be performed as required for the final repair. We will discuss typical values of the beam currents required to maintain device integrity while concurrently optimizing repair time. Maintaining device integrity is difficult because of two potentially serious interactions of the FIB on the substrate: 1) since the beam consists of heavy metal ions (typically Gallium) the act of imaging the surface produces some physical damage; 2) the beam is positively charged and puts some charge into the substrate, making it necessary to use great care working in and around capacitors or active areas such as transistors, in order to avoid changing the threshold voltage of the devices. Strategies for minimizing potential damage and maximizing quality and throughput will be discussed.

scholarly journals 3D printed microfluidic lab-on-a-chip device for fiber-based dual beam optical manipulation

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Haoran Wang ◽  
Anton Enders ◽  
John-Alexander Preuss ◽  
Janina Bahnemann ◽  
Alexander Heisterkamp ◽  
...  
Keyword(s):  
Optical Fibers ◽  
Single Cells ◽  
Lab On A Chip ◽  
Cost Effective ◽  
Optical Manipulation ◽  
Hydrodynamic Focusing ◽  
Trapping Region ◽  
Dual Beam ◽  
3D Printed ◽  
On Chip

Abstract3D printing of microfluidic lab-on-a-chip devices enables rapid prototyping of robust and complex structures. In this work, we designed and fabricated a 3D printed lab-on-a-chip device for fiber-based dual beam optical manipulation. The final 3D printed chip offers three key features, such as (1) an optimized fiber channel design for precise alignment of optical fibers, (2) an optically clear window to visualize the trapping region, and (3) a sample channel which facilitates hydrodynamic focusing of samples. A square zig–zag structure incorporated in the sample channel increases the number of particles at the trapping site and focuses the cells and particles during experiments when operating the chip at low Reynolds number. To evaluate the performance of the device for optical manipulation, we implemented on-chip, fiber-based optical trapping of different-sized microscopic particles and performed trap stiffness measurements. In addition, optical stretching of MCF-7 cells was successfully accomplished for the purpose of studying the effects of a cytochalasin metabolite, pyrichalasin H, on cell elasticity. We observed distinct changes in the deformability of single cells treated with pyrichalasin H compared to untreated cells. These results demonstrate that 3D printed microfluidic lab-on-a-chip devices offer a cost-effective and customizable platform for applications in optical manipulation.

scholarly journals A Review on Terahertz Technologies Accelerated by Silicon Photonics

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1646
Author(s):  
Jingya Xie ◽  
Wangcheng Ye ◽  
Linjie Zhou ◽  
Xuguang Guo ◽  
Xiaofei Zang ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Silicon Photonics ◽  
Large Scale ◽  
Cost Effective ◽  
Single Chip ◽  
Photonic Integrated Circuit ◽  
Hybrid Silicon ◽  
The Cost ◽  
Silicon Based ◽  
Thz Applications

In the last couple of decades, terahertz (THz) technologies, which lie in the frequency gap between the infrared and microwaves, have been greatly enhanced and investigated due to possible opportunities in a plethora of THz applications, such as imaging, security, and wireless communications. Photonics has led the way to the generation, modulation, and detection of THz waves such as the photomixing technique. In tandem with these investigations, researchers have been exploring ways to use silicon photonics technologies for THz applications to leverage the cost-effective large-scale fabrication and integration opportunities that it would enable. Although silicon photonics has enabled the implementation of a large number of optical components for practical use, for THz integrated systems, we still face several challenges associated with high-quality hybrid silicon lasers, conversion efficiency, device integration, and fabrication. This paper provides an overview of recent progress in THz technologies based on silicon photonics or hybrid silicon photonics, including THz generation, detection, phase modulation, intensity modulation, and passive components. As silicon-based electronic and photonic circuits are further approaching THz frequencies, one single chip with electronics, photonics, and THz functions seems inevitable, resulting in the ultimate dream of a THz electronic–photonic integrated circuit.

scholarly journals Multi-Probe Measurement System Based on Single-Cut Transformation for Fast Testing of Linear Arrays

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1744
Author(s):  
Fernando Rodríguez Varela ◽  
Manuel José López Morales ◽  
Rubén Tena Sánchez ◽  
Alfonso Tomás Muriel Barrado ◽  
Elena de la Fuente González ◽  
...  
Keyword(s):  
Measurement System ◽  
Near Field ◽  
Linear Measurement ◽  
Complete Characterization ◽  
Linear Arrays ◽  
Full Characterization ◽  
X Band ◽  
Measurement Results ◽  
The Many ◽  
3D Information

This paper introduces a near-field measurement system concept for the fast testing of linear arrays suited for mass production scenarios where a high number of nominally identical antennas needs to be measured. The proposed system can compute the radiation pattern, directivity and gain on the array plane, as well as the array complex feeding coefficients in a matter of seconds. The concept is based on a multi-probe antenna array arranged in a line which measures the near field of the antenna under test in its array plane. This linear measurement is postprocessed with state-of-the-art single-cut transformation techniques. To compensate the lack of full 3D information, a previous complete characterization of a “Gold Antenna” is performed. This antenna is nominally identical to the many ones that will be measured with the proposed system. Therefore, the data extracted from this full characterization can be used to complement the postprocessing steps of the single-cut measurements. An X-band 16-probe demonstrator of the proposed system is implemented and introduced in this paper, explaining all the details of its architecture and operation steps. Finally, some measurement results are given to compare the developed demonstrator with traditional anechoic measurements, and show the potential capabilities of the proposed concept to perform fast and reliable measurements.

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