Self-promoted phthalimide-containing phthalonitrile resins with sluggish curing process and excellent thermal stability

RSC Advances ◽  
2015 ◽  
Vol 5 (21) ◽  
pp. 16199-16206 ◽  
Author(s):  
Jianghuai Hu ◽  
Yancui Liu ◽  
Yan Jiao ◽  
Suchun Ji ◽  
Rui Sun ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Nucleophilic Addition ◽  
Curing Process ◽  
Excellent Thermal Stability

A novel unsymmetrical phthalimide-containing phthalonitrile was synthesized and showed excellent thermal properties. A nucleophilic addition mechanism was introduced to explain the different reactivities of active H-containing heterocyclic structures toward phthalonitrile.

Synthesis and Thermal Properties of a Boron-Containing Bisphenol-S Formaldehyde Resin

2011 ◽  
Vol 239-242 ◽  
pp. 2905-2908 ◽  
Author(s):  
Jun Gang Gao ◽  
Wei Hong Wu ◽  
Xing Li
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Thermal Properties ◽  
Degradation Rate ◽  
Formaldehyde Resin ◽  
Curing Process ◽  
Bisphenol S ◽  
Coordinate Structure ◽  
H Nmr ◽  
Degradation Temperature

Boron-containing bisphenol-S formaldehyde resin (BBPSFR) was synthesized by formalin method. The structure and thermal properties of BBPSFR were characterized by 1H NMR, FTIR, torsional braid analysis (TBA) and thermogravimetric analysis (TGA), respectively. The results showed that the borate had formed, and the six-member ring containing boron-oxygen coordinate structure also formed during the curing process. The glass transition temperature (Tg) of BBPSFR is higher 104°C than that of bisphenol-S formaldehyde resins (BPSFR); the initial degradation temperature (Ti ) increases about 43°C; thermal degradation rate decrease and thermal stability increase significantly.

scholarly journals Multi-wavelength excited white-emitting K2Gd(1−x)(PO4)(WO4):xDy3+ phosphors with satisfactory thermal properties for UV-LEDs

RSC Advances ◽  
2017 ◽  
Vol 7 (37) ◽  
pp. 23083-23092 ◽  
Author(s):  
Yue Guo ◽  
Byung Kee Moon ◽  
Byung Chun Choi ◽  
Jung Hyun Jeong ◽  
Jung Hwan Kim
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Excellent Thermal Stability ◽  
Multi Wavelength ◽  
Uv Leds

Luminescent multi-wavelength excited K2Gd(1−x)(PO4)(WO4):xDy3+ phosphors have excellent thermal stability and warm white emissions.

Study on the thermal stability of Controlled Permeability Formwork

2011 ◽  
Vol 374-377 ◽  
pp. 1426-1429
Author(s):  
Xiao Meng Guo ◽  
Jian Qiang Li ◽  
Xian Sen Zeng ◽  
De Dao Hong
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Dynamic Mechanical Analysis ◽  
Thermo Gravimetric Analysis ◽  
Mechanical Analysis ◽  
Gravimetric Analysis ◽  
Construction Work ◽  
Thermo Gravimetric ◽  
Excellent Thermal Stability ◽  
Thermal Stability Of

In this study, the thermal properties of a kind of new geotextile materials, so called controlled permeable formwork (CPF), were studied. Thermo-gravimetric analysis showed that the weight of CPF didn’t change much between 0~350 °C. Dynamic mechanical analysis showed that the storage modulus of CPF reduced from 25 MPa to around 10 MPa when the temperature rose to above 100 °C. The strength of sample decreased slightly with the increase of the temperature. The breaking elongation changed slightly with a maximum at 80 °C. The CPF showed excellent thermal stability and was suitable for general use in construction work.

Research on Hybrid UV-Curing G-POSS/Epoxy Resin /Unsaturated Polyester Insulation Nanocomposites

2013 ◽  
Vol 380-384 ◽  
pp. 4344-4347
Author(s):  
Jun Gang Gao ◽  
Gui Xiang Hou
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Electrical Resistivity ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Cationic Polymerization ◽  
Unsaturated Polyester ◽  
Uv Curing ◽  
Curing Process ◽  
Polyhedral Oligomeric Silsesquioxanes

Polyhedral oligomeric silsesquioxanes epoxy resin (G-POSS) was prepared from 2,3-glycidyloxypropyl-trimethoxysilane (GTMS) by hydrolytic condensation. Thermal properties and electrical properties and UV-curing gel rate of G-POSS/epoxy resin (ER)/unsaturated polyester (UP) nanocomposites using diphenyliodide hexafluorophosphate (DPI·PF6) as initiator of curing reaction were investigated. The results showed that curing process of G-POSS/ER/UP is the double hybrid free radical/cationic polymerization. The gel rate of all the samples is more than 90%. G-POSS would decrease the electrical resistivity and increases the dielectric constant of the complex curing materials. Thermal stability is increased with the addition of G-POSS.

Synthesis and characterization of novel benzoxazines containing nitrile and allyl groups and their polymers

e-Polymers ◽  
2010 ◽  
Vol 10 (1) ◽  
Author(s):  
Hongchun Zhang ◽  
Zaijun Lu
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Ring Opening ◽  
Synthesis And Characterization ◽  
Curing Process ◽  
Oxazine Ring ◽  
Thermal Stability Of

AbstractA p-cyanophenol and allylamine based benzoxazine has been synthesized and characterized. This benzoxazine has nitrile and allyl functionalities that can polymerize, resulting in a highly crosslinked material. The DSC spectra of novel benzoxazine monomer reveal that incorporation of the nitrile and allyl group greatly decreases the ring-opening temperature of oxazine rings (140°C). The IR spectra of curing process indicate that the polymerization of oxazine ring accompany with the curing reaction of allyl and nitrile groups. Benzoxazine monomers with one or none of the two functionalities were also prepared to study structure effect on thermal properties of resulted polymer. The comparison of results confirms that introducing the two functionalities improved glass transition temperature (238 °C), thermal stability of polybenzoxazine (T5%=340 °C), and char yield (57%).

Search for a Suitable Ohmic Metallization Scheme to GaN/AlGaN Heterostructures for Sub-Micron Devices

2010 ◽  
Vol 159 ◽  
pp. 81-86 ◽  
Author(s):  
Lilyana Kolaklieva ◽  
Roumen Kakanakov ◽  
V. Chitanov ◽  
Polina Dulgerova ◽  
Volker Cimalla
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Surface Morphology ◽  
Barrier Layer ◽  
Contact Structure ◽  
Annealing Temperature ◽  
Contact Resistivity ◽  
Initial Composition ◽  
Excellent Thermal Stability ◽  
Au Film

Ohmic properties, thermal stability and surface morphology of Al-based and non-aluminium metallizations are investigated in dependence on the annealing temperature and initial composition. Non-aluminium contacts show poor ohmic properties, while contact resistivity of 3.47x10-5 Ω.cm2 is achieved for Ti/Al/Ti/Au metallization with a former-Ti/Al ratio of (30 wt.% /70 wt.%). Thermal properties of the Al-based metallization are improved by application of Mo layer as a barrier under the upper Au film of the contact structure. These contacts show excellent thermal stability at operating temperatures as high as 400oC. The less Al amount in the contact composition and Mo barrier layer contribute to the smoother surface and better edge acuity.

scholarly journals Impact of Spherical Anatase TiO2 Nanoparticles on Thermal Properties of Polypropylene Resin

2021 ◽  
Author(s):  
Ahlem Bendaoued ◽  
Mouna Messaoud ◽  
Omar Harzallah ◽  
Sophie Bistac ◽  
Rached Salhi
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Sol Gel ◽  
Thermal Characterization ◽  
Degree Of Crystallinity ◽  
Molar Ratio ◽  
Excellent Thermal Stability ◽  
Energy Applications ◽  
Production Of Hydrogen ◽  
Thermal Stability Of

Abstract Ceramics nanometric reinforced polymer composite is a significant material for catalysis, solar cells, production of hydrogen and energy applications, etc. In order to take benefit from the interesting mechanical properties and thermal stability of TiO2, these ceramic nanomaterials was synthesized by the Sol-Gel process in attempt to study the thermal stability, structure, and morphology of the resulting nanoparticles powders. The obtained results revealed that, the sphere is composed of 20-30 nm nanoparticles with excellent thermal stability of nano-TiO2. This work focused on the thermal characterization and the study of nanocomposite xWt. %TiO2/PP (x=0, 2.5, 5, 7.5 mol%). In this study, the obtained results revealed that the molar ratio of TiO2 influences the final thermal stability and degree of crystallinity of the composite. It was found that the use of TiO2 seems to be an effective and very promising way to increase the thermal properties of the resulting composite. The greatest degree of crystallinity (54.80%) and thermal degradation stability are obtained for composite reinforced by 7.5Wt. %TiO2.

Facile preparation of a phenyl-reinforced flexible silica aerogel with excellent thermal stability and fire resistance

2021 ◽  
Author(s):  
Yu Zhang ◽  
Qianqian Shen ◽  
Xuesha Li ◽  
Lili Wang ◽  
Chaoyin Nie
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
Fire Resistance ◽  
Silica Aerogel ◽  
Mechanical And Thermal Properties ◽  
Excellent Thermal Stability ◽  
Facile Preparation

A phenyl-reinforced flexible silica aerogel was synthesized using PTES as a reinforcer; the membrane-like structure derived from PTES improved the mechanical and thermal properties of the flexible silica aerogel.

scholarly journals The Influence of Substituents in Phosphazene Catalyst-Flame Retardant on the Thermochemistry of Benzoxazine Curing

Polymers ◽  
2021 ◽  
Vol 13 (18) ◽  
pp. 3111
Author(s):  
Natalia V. Bornosuz ◽  
Roman F. Korotkov ◽  
Alexander A. Kolenchenko ◽  
Alexey V. Shapagin ◽  
Alexey V. Orlov ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Catalytic Activity ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Curing Process ◽  
Flame Resistance ◽  
Dispersion Phase ◽  
Thermal Stability Of ◽  
Influence Of Substituents

This work is devoted to the influence of phosphazene modifiers with different substituents on the curing process, thermal properties and flammability of benzoxazine resin. Novel catalysts with m-toluidine substituents were introduced. The catalytic activity of studied phosphazene compounds decreased in the row: hexachlorocyclotriphosphazene (HCP) > tetra m-toluidine substituted phosphazene PN-mt (4) > hexa m-toluidine substituted phosphazene PN-mt (6) > hexaphenoxycyclotriphosphazene (HPP), where HPP is totally inactive. Two types of catalysis: basic and acid were proposed. A brief study of resulting properties of polybenzoxazines was presented. The addition of any studied modifier caused the decrease of glass transition temperature and thermal stability of polymers. The morphology of cured compositions was characterized by matrix-dispersion phase structure. All phosphazene containing polybenzoxazines demonstrated the improved flame resistance.

Formation and Characterization of Nanolayered Pd-Based Metal/p-4H SiC Systems with Ohmic Behaviour

2010 ◽  
Vol 10 ◽  
pp. 77-85 ◽  
Author(s):  
Lilyana Kolaklieva ◽  
Roumen Kakanakov ◽  
Efstathios K. Polychroniadis ◽  
Eleni Pavlidou ◽  
Ioannis Tsiaousis ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Surface Roughness ◽  
Thermal Properties ◽  
Structural Analysis ◽  
Surface Morphology ◽  
Barrier Height ◽  
Contact Resistivity ◽  
Excellent Thermal Stability

Three types of nanolayered Pd-based metal/p-4H SiC systems, Au/Pd, Au/Pd/Al and Au/Pd/Ti/Pd have been investigated and compared to Pd monolayered metallization regarding the electrical and thermal properties. The lowest contact resistivity of 2.8x10-5 .cm2 has been achieved with the Au/Pd/Ti/Pd contact. This contact exhibits excellent thermal stability during long-term heating at temperature of 700oC and at operating temperatures up to 450oC. The surface morphology investigation has shown that despite the observed decrease, the palladium agglomeration has been not avoided completely in the same contact. The dominated surface roughness was measured to be 75 nm. However, the formation of dendrites in certain places leads to increase the surface roughness to 125 nm. The structural analysis revealed that palladium silicides are formed at the interface metal/p-4H SiC which affects on decrease of the barrier height in more than two times and conversion of the contact from Schottky into ohmic.

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