scholarly journals Coefficients of thermal expansion of single crystalline β-Ga2O3 and in-plane thermal strain calculations of various materials combinations with β-Ga2O3

APL Materials ◽  
2019 ◽  
Vol 7 (2) ◽  
pp. 022517 ◽  
Author(s):  
Michael E. Liao ◽  
Chao Li ◽  
Hsuan Ming Yu ◽  
Eva Rosker ◽  
Marko J. Tadjer ◽  
...  
2017 ◽  
Vol 23 (5) ◽  
pp. 943-953 ◽  
Author(s):  
Anthony A. D’Amico ◽  
Analise Debaie ◽  
Amy M. Peterson

Purpose The aim of this paper is to examine the impact of layer thickness on irreversible thermal expansion, residual stress and mechanical properties of additively manufactured parts. Design/methodology/approach Samples were printed at several layer thicknesses, and their irreversible thermal expansion, tensile strength and flexural strength were determined. Findings Irreversible thermal strain increases with decreasing layer thickness, up to 22 per cent strain. Tensile and flexural strengths exhibited a peak at a layer thickness of 200 μm although the maximum was not statistically significant at a 95 per cent confidence interval. Tensile strength was 54 to 97 per cent of reported values for injection molded acrylonitrile butadiene styrene (ABS) and 29 to 73 per cent of those reported for bulk ABS. Flexural strength was 18 to 41 per cent of reported flexural strength for bulk ABS. Practical implications The large irreversible thermal strain exhibited that corresponding residual stresses could lead to failure of additively manufactured parts over time. Additionally, the observed irreversible thermal strains could enable thermally responsive shape in additively manufactured parts. Variation in mechanical properties with layer thickness will also affect manufactured parts. Originality/value Tailorable irreversible thermal strain of this magnitude has not been previously reported for additively manufactured parts. This strain occurs in parts made with both high-end and consumer grade fused deposition modeling machines. Additionally, the impact of layer thickness on tensile and flexural properties of additively manufactured parts has received limited attention in the literature.


MRS Bulletin ◽  
1997 ◽  
Vol 22 (2) ◽  
pp. 51-57 ◽  
Author(s):  
F.A. Ponce

The recent developments in III-V-nitride thin-film technology has produced significant advances in high-performance devices operating in the blue and green range of the visible spectrum. These materials are grown by metalorganic chemical vapor deposition (MOCVD) on (0001) sapphire substrates. Highly specular surfaces are possible by use of low-temperature buffer layers following the method developed by Akasaki et al. The thin films thus grown have an interesting microstructure, quite different from other known semiconductors. In particular, epilayers with high optoelectronic performance are characterized by high dislocation densities, several orders of magnitude above those found in other optoelectronic semiconductor films. The lattice mismatch between sapphire and GaN is ∼14%, and the thermal-expansion difference is close to 80%. In spite of these large differences, little thermal strain is measurable at room temperature in epilayers grown at temperatures above 1000°C. Epitaxy on other systems, like SiC, with much better similarity in lattice parameter and thermal-expansion characteristics, has failed to produce better performance than films grown on sapphire. The origin of these puzzling properties of nitrides on sapphire rests in its microstructure. This article presents a survey of the microstructure associated with epitaxy of nitrides by MOCVD.


2014 ◽  
Vol 1054 ◽  
pp. 17-21 ◽  
Author(s):  
Dana Koňáková ◽  
Veronika Špedlová ◽  
Monika Čáchová ◽  
Eva Vejmelková ◽  
Robert Černý

The influence of basalt fibres and aggregates on the thermal expansion of cement composites is analyzed. Four different composite mixes based on aluminous cement are designed and tested. Experimental results show that the application of basalt components leads to the reduction of the increase of open porosity after high temperature loading from 47% to 36%, as compared with the reference mix. The matrix densities exhibit almost similar values for all studied composites; the differences are only up to 16%. The thermal strain is more than 50% lower when basalt aggregates are used instead of silica sand.


1990 ◽  
Vol 163 (1-3) ◽  
pp. 557-560 ◽  
Author(s):  
Gendo Oomi ◽  
Tomoko Kagayama ◽  
Yoshichika Ōnuki ◽  
Takemi Komatsubara

1990 ◽  
Vol 67 (9) ◽  
pp. 5212-5214 ◽  
Author(s):  
A. Lacerda ◽  
A. de Visser ◽  
L. Puech ◽  
P. Lejay ◽  
P. Haen ◽  
...  

Author(s):  
Yan Xie ◽  
Dengfeng Lu ◽  
Jingjun Yu

This paper mainly concentrates on the design and analysis of the annulus with zero thermal expansion coefficient (ZTE) aiming to solve the heat generation and deformation in high speed bearing. First, a fork-like lattice cell inspired by the basic triangular cell is put forward and further applied to construct an annulus. The stretch-dominated lattice cell utilizes the Poisson’s contraction effect to achieve the tailorable thermal expansion coefficient (CTE). The thermal behaviors differences between the continuous interfaces and lattice cells will lead to the internal stress. Thus, the CTE of the annulus consisting of the lattice cell can be tailored to zero even negative values through the offset between the thermal-strain and force-strain. Then a theoretical model is established with some appropriate assumptions to reveal the quantitative relations among the geometrical parameters, material properties and equivalent CTEs thoroughly. The prerequisites for realizing a zero CTE are further derived in terms of material limitations and geometric constraints. Finally, FEA method is implemented to verify and analyze the thermal behaviors of annulus. The proposed annulus design characterized by the CTE tunability, structure efficiency and continuous interfaces is hopefully to be applied in the high speed bearings, adapters between the shaft and collar and fastener screws.


2010 ◽  
Vol 44-47 ◽  
pp. 2148-2151
Author(s):  
Xie Quan Liu ◽  
Xin Hua Ni ◽  
Shu Qin Zhang ◽  
Wan Heng He

Ni base alloy composite coating containing spheroidal ceramic grains can be fabricated by a vacuum fusion sintering method. Composite coating was mainly composed of Ni base alloy and spheroidal ceramic grains with random orientation. The three-phase model is used to determine the thermal expansion coefficient of the composite coating. First, Eshebly-Mori-Tanaka method was used to determine thermal disturbance strain in two-phase cell aroused thermal inconsistency. Then, average thermal strain in the two-phase cell aroused by thermal inconsistency is gained by the means of volume equilibration. The two-phase cell is transverse isotropy and has two independent thermal expansion coefficients. Finely, based on mean strain of Ni base alloy ceramic composite coating containing spheroidal ceramic grains, the effective thermal expansion coefficient of the composite coating is obtained by considering random orientation of two-phase cells. Ni base alloy composite coating containing spheroidal ceramic grains is isotropy and has one independent thermal expansion coefficient.


2007 ◽  
Vol 311 (2) ◽  
pp. 489-493 ◽  
Author(s):  
M. Schneider ◽  
A. Gladun ◽  
A. Kreyssig ◽  
J. Wosnitza ◽  
D. Souptel ◽  
...  

1992 ◽  
Vol 114 (1) ◽  
pp. 88-92 ◽  
Author(s):  
Yifan Guo ◽  
Charles G. Woychik

Low cycle fatigue of solder joints is one of the major kinds of failures in second level interconnections of an electronic package. The fatigue failure is caused by thermal strains which are created from a mismatch of coefficients of thermal expansion (CTE) that occurs between two levels of packaging. As the package approaches smaller dimensions, measurements of thermal strains in the solder interconnections become very difficult. In this paper, moire interferometry technique was applied to evaluate the thermal strains in the second level interconnections for both conventional pin-in-hole (PIH) packages and surface mount components. The coefficient of thermal expansion of each component was measured. Thermal strain distributions in the solder interconnections were determined, and reliability issues were discussed. The strains in solder joints of the PIH components were much higher than those of the stacked surface mount components. Even though the surface mount components had a lower inherent strength, their overall mechanical reliability was much higher since they had practically no localized strain concentrations.


2019 ◽  
Vol 88 (9) ◽  
pp. 094709 ◽  
Author(s):  
Liran Wang ◽  
Binh Tran ◽  
Mingquan He ◽  
Christoph Meingast ◽  
Mahmoud Abdel-Hafiez ◽  
...  

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