Simulation of diffusion controlled phenomena at the interface of steel/nickel diffusion couples

2021 ◽  
pp. 1-8
Author(s):  
Akira Seki ◽  
Kazuhiro Ogawa
1989 ◽  
Vol 148 ◽  
Author(s):  
C. H. Jan ◽  
J. C. Lin ◽  
Y. A. Chang

ABSTRACTBulk diffusion couples of Co/Si were annealed at 800, 900, 1000, 1050 and 1100°C for periods ranging from 24 hours to one month. Growth rates of the intermediate phases, Co2Si, CoSi and CoSi2, as well as the composition profiles across the couples were determined by optical microscopy and electron probe microanalysis (EPMA). Using the solution to the multiphase binary diffusion equations and the experimental data, the interdiffusion coefficients for Co2Si, CoSi and CoSi2 are obtained as a function of temperature. The activation energies obtained are 140, 160 and 190 KJ/mole for Co2Si, CoSi and CoSi2, respectively. The generally small interdiffusion coefficient of CoSi2 and its high activation energy cause the growth rate of CoSi2 to be extremely small at low temperatures.The interdiffusion coefficients for Co2Si, CoSi and CoSi2 at 545°C are obtained by extrapolation of the high-temperatures data. Using these data and solving numerically the diffusion equations with the appropriate boundary conditions, the growth of Co2Si, CoSi and CoSi2 is calculated as a function of time. The calculated results are in good agreement with the experimental data reported in the literature. This study demonstrates clearly that the initial absence of the CoSi2 phase is due to diffusion-controlled rather than nucleation-controlled kinetics. This phenomenon may be quite common in many thin-fiflm metal/Si couples.


1995 ◽  
Vol 10 (5) ◽  
pp. 1134-1145 ◽  
Author(s):  
T. Barge ◽  
P. Gas ◽  
F.M. d'Heurle

The solid state reaction between Co and Si has been studied in bulk diffusion couples between 850 and 1100 °C. At the scale of the observations made, the three phases Co2Si, CoSi, and CoSi2 are found to grow simultaneously, according to diffusion controlled kinetics. The results are analyzed in term of the Nernst-Einstein equation that directly relates diffusion fluxes to the free energy changes driving the formation. The growth rates obtained for CoSi2 at high temperatures, in the present bulk samples, are compared with those determined by others in thin films, at much lower temperatures. The comparison requires that attention should be paid to two factors. The first one is that the laws of growth are slightly different for a phase growing simultaneously with two other ones (bulk) and one phase growing alone (thin films). The second factor is the grain size of the various samples, which varies with the temperature of reaction. Once this is done, excellent agreement is obtained between the two sets of measurements. Moreover it is shown that knowing the grain size, it is possible to calculate quite accurately the growth rate from the respective isotope diffusion coefficients both for lattice and grain boundaries of Co and Si in CoSi2.


2002 ◽  
Vol 753 ◽  
Author(s):  
Ling Pan ◽  
David E. Luzzi

ABSTRACTInterdiffusion in multi-phase diffusion couples of polycrystalline Ti and polysynthetically twinned (PST) Ti-49.3 at.% Al, with the diffusion direction parallel to the lamellar planes, is investigated in the temperature range 973 – 1173 K. A reaction zone (RZ) of the a2-Ti3Al phase forms between the end materials and exhibits deeper penetration in the a2 lamellae than in the primary g lamellae. The mass balance and the lamellar thickness across the RZ / PST interface are believed to be the major factors that lead to the different behaviors in the penetration depth of the RZ. Direct measurements of the RZ thickness reveal a parabolic growth of the RZ, indicating a diffusion-controlled growth macroscopically. Concentration profiles from the Ti, through the RZ, into the PST g and a2 lamellae are measured by x-ray spectroscopy in a transmission electron microscope. Deviations from a diffusion-controlled composition profile indicate some extent of interface-controlled growth. Plateaus are seen in the concentration profiles in the RZ adjacent to the RZ/PST interface, extending through most of the deeply penetrated well region. The interfacial energy and strain energy are possible reasons for the plateaus. The interdiffusion coefficients are found to be largely independent of composition with a temperature dependence that obeys the Arrhenius relationship.


1993 ◽  
Vol 318 ◽  
Author(s):  
Weimin Si ◽  
Pengxing Li ◽  
Renjie Wu

ABSTRACTThe interfacial reactions and interdiffusion between Al2O3 and Ti-24Al-11Nb (at%) alloy have been investigated. Diffusion couples were fabricated by thermal sprayed Al2O3 film onto Ti-24Al-11Nb substrate, and then annealed at 1200°C. Interfacial layers were characterized using electron probe microanalysis (EPMA), X-ray diffraction (XRD), and transmission electron microscopy (TEM). The layered structure of interface region was observed which showed the diffusion controlled characteristics. In the reaction zones, the reaction products consisted mainly of TiO, TiO2, and Al2TiO5. Adjacent to the reaction zones, there existed β phase free zone and β phase lacking zone. The β phase free zone resulted from Nb depletion of this region. The reaction mechanism has been discussed using thermodynamic approach.


Author(s):  
R. M. Anderson ◽  
T. M. Reith ◽  
M. J. Sullivan ◽  
E. K. Brandis

Thin films of aluminum or aluminum-silicon can be used in conjunction with thin films of chromium in integrated electronic circuits. For some applications, these films exhibit undesirable reactions; in particular, intermetallic formation below 500 C must be inhibited or prevented. The Al films, being the principal current carriers in interconnective metal applications, are usually much thicker than the Cr; so one might expect Al-rich intermetallics to form when the processing temperature goes out of control. Unfortunately, the JCPDS and the literature do not contain enough data on the Al-rich phases CrAl7 and Cr2Al11, and the determination of these data was a secondary aim of this work.To define a matrix of Cr-Al diffusion couples, Cr-Al films were deposited with two sets of variables: Al or Al-Si, and broken vacuum or single pumpdown. All films were deposited on 2-1/4-inch thermally oxidized Si substrates. A 500-Å layer of Cr was deposited at 120 Å/min on substrates at room temperature, in a vacuum system that had been pumped to 2 x 10-6 Torr. Then, with or without vacuum break, a 1000-Å layer of Al or Al-Si was deposited at 35 Å/s, with the substrates still at room temperature.


Author(s):  
D.W. Susnitzky ◽  
S.R. Summerfelt ◽  
C.B. Carter

Solid-state reactions have traditionally been studied in the form of diffusion couples. This ‘bulk’ approach has been modified, for the specific case of the reaction between NiO and Al2O3, by growing NiAl2O4 (spinel) from electron-transparent Al2O3 TEM foils which had been exposed to NiO vapor at 1415°C. This latter ‘thin-film’ approach has been used to characterize the initial stage of spinel formation and to produce clean phase boundaries since further TEM preparation is not required after the reaction is completed. The present study demonstrates that chemical-vapor deposition (CVD) can be used to deposit NiO particles, with controlled size and spatial distributions, onto Al2O3 TEM specimens. Chemical reactions do not occur during the deposition process, since CVD is a relatively low-temperature technique, and thus the NiO-Al2O3 interface can be characterized. Moreover, a series of annealing treatments can be performed on the same sample which allows both Ni0-NiAl2O4 and NiAl2O4-Al2O3 interfaces to be characterized and which therefore makes this technique amenable to kinetics studies of thin-film reactions.


Author(s):  
John A. Sutliff

Near-eutectic Pb-Sn alloys are important solders used by the electronics industry. In these solders, the eutectic mixture, which solidifies last, is the important microstructural consituent. The orientation relation (OR) between the eutectic phases has previously been determined for directionally solidified (DS) eutectic alloys using x-ray diffraction or electron chanelling techniques. In the present investigation the microstructure of a conventionally cast, hyper-eutectic Pb-Sn alloy was examined by transmission electron microscopy (TEM) and the OR between the eutectic phases was determined by electron diffraction. Precipitates of Sn in Pb were also observed and the OR determined. The same OR was found in both the eutectic and precipitation reacted materials. While the precipitation of Sn in Pb was previously shown to occur by a discontinuous precipitation reaction,3 the present work confirms a recent finding that volume diffusion controlled precipitation can also occur.Samples that are representative of the solder's cast microstructure are difficult to prepare for TEM because the alloy is multiphase and the phases are soft.


Author(s):  
S. R. Singh ◽  
H. J. Fan ◽  
L. D. Marks

Since the original observation that the surfaces of materials undergo radiation damage in the electron microscope similar to that observed by more conventional surface science techniques there has been substantial interest in understanding these phenomena in more detail; for a review see. For instance, surface damage in a microscope mimics damage in the space environment due to the solar wind and electron beam lithographic operations.However, purely qualitative experiments that have been done in the past are inadequate. In addition, many experiments performed in conventional microscopes may be inaccurate. What is needed is careful quantitative analysis including comparisons of the behavior in UHV versus that in a conventional microscope. In this paper we will present results of quantitative analysis which clearly demonstrate that the phenomena of importance are diffusion controlled; more detailed presentations of the data have been published elsewhere.As an illustration of the results, Figure 1 shows a plot of the shrinkage of a single, roughly spherical particle of WO3 versus time (dose) driven by oxygen desorption from the surface.


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