scholarly journals Reliability Design and Simulation of High Density Packaging T/R Module

2021 ◽  
Vol 2121 (1) ◽  
pp. 012001
Author(s):  
Hailong Zhao ◽  
Yu Zhang ◽  
Honglei Ran ◽  
Hao Peng ◽  
Kui Zhang ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Electrostatic Discharge ◽  
Design Analysis ◽  
High Density ◽  
Reliability Design ◽  
Electro Magnetic ◽  
Requirements Development ◽  
Simulation Scheme ◽  
High Density Packaging ◽  
Electro Magnetic Compatibility

Abstract The requirements, development, packaging characteristics and existing reliability problems of high density packaging T/R modules are introduced, and the importance of reliability design is recognized. Aiming at the reliability problems of Electro Magnetic Compatibility (EMC), heat dissipation and electrostatic discharge, the reliability design and simulation scheme are given, and some cases are provided. Through design analysis and improvement, the reliability of 3D high density packaging T/R modules can be effectively improved.

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

2005 ◽  
Vol 297-300 ◽  
pp. 837-843
Author(s):  
Takashi Hasegawa ◽  
Masumi Saka
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
High Density ◽  
Solder Bumps ◽  
Multi Phase ◽  
High Density Packaging

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

Three-Dimensional Surface in LTCC for a MM-Wave Antenna

2011 ◽  
Vol 2011 (1) ◽  
pp. 000527-000533 ◽  
Author(s):  
Peter Uhlig ◽  
Sybille Holzwarth ◽  
Bahram Sanadgol ◽  
Alexandra Serwa
Keyword(s):  
Antenna Array ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
60 Ghz ◽  
Low Loss ◽  
Wave Antenna ◽  
Signal Path ◽  
Steerable Antenna ◽  
Dimensional Surface ◽  
High Density Packaging

Low loss LTCC (Low Temperature Cofired Ceramics) materials have already demonstrated their virtues for high density packaging of mm-wave modules and their capability to handle the inherent requirements of heat dissipation. A 60 GHz substrate integrated waveguide fed steerable antenna array is one example of the driving applications for new challenges in the LTCC process. This antenna is suitable for transmit and receive in the 60 GHz WPAN frequency band [1]. Integrating antenna array and mm-wave front-end in one module is a consequent way to avoid amplitude and phase uncertainties associated with connectors and cables. A compact module also helps to reduce losses in the signal path by providing short interconnects. This is important for mm-Wave systems, particularly for the receiver. The antenna design presented here requires a three-dimensional surface structure with features like small and precise cavities and grooves. Different methods to fabricate cavities in LTCC modules will be discussed and a new method which proved suitable for the demanding application will be presented in detail.

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