Sin2ψ-based residual stress gradient analysis by energy-dispersive synchrotron diffraction constrained by small gauge volumes. I. Theoretical concept

2013 ◽  
Vol 46 (3) ◽  
pp. 610-618 ◽  
Author(s):  
M. Meixner ◽  
M. Klaus ◽  
Ch. Genzel

The influence of the gauge volume size and shape on the analysis of steep near-surface residual stress gradients by means of energy-dispersive synchrotron diffraction is studied theoretically. Cases are considered where the irradiated sample volume is confined by narrow-slit systems, in both the primary and the diffracted beam, to dimensions comparable to the `natural' 1/einformation depth τ1/eof the X-rays. It is shown that the ratio between τ1/e, defined by the material's absorption, and the immersion depthhGVof the gauge volume into the sample is the crucial parameter that shapes thedψhklor ∊ψhklversussin2ψ distributions obtained in the Ψ mode of X-ray stress analysis. Since the actual information depth 〈z〉GVto which the measured X-ray signal has to be assigned is a superposition of geometrical and exponential weighting functions, ambiguities in the conventional plot of the Laplace stressesversus〈z〉GVmay occur for measurements performed using narrow-slit configurations. To avoid conflicts in data analysis in these cases, a modified formalism is proposed for the evaluation of the real space residual stress profiles σ||(z), which is based on a two-dimensional least-squares fit procedure.

2013 ◽  
Vol 46 (3) ◽  
pp. 619-627 ◽  
Author(s):  
M. Meixner ◽  
M. Klaus ◽  
Ch. Genzel

On the basis of the theoretical concept for the use of small gauge volumes to study near-surface residual stress fields with high spatial resolution [Meixner, Klaus & Genzel (2013).J. Appl. Cryst.46, 610–618], the experimental implementation of the approach is demonstrated. It is shown that specifically designed slit systems are required to avoid effects such as diffuse scattering at the slit blades and total external reflection, both giving rise to a reduced resolution. Starting from the characterization of the small gauge volume, practical guidance on how to control the alignment of the sample relative to the gauge volume for different geometrical conditions of energy-dispersive diffraction is given. The narrow-slit configuration as well as the formalism for data evaluation introduced in the first part of this series is applied to the analysis of a very steep in-plane residual stress gradient in a shot-peened Al2O3ceramic sample. The results are compared with those obtained by means of a conventional wide-slit setup using the classical universal plot method for residual stress analysis on the one hand, and with the simulations performed in the first part on the other hand.


2018 ◽  
Vol 51 (3) ◽  
pp. 732-745 ◽  
Author(s):  
Marianna Marciszko ◽  
Andrzej Baczmański ◽  
Manuela Klaus ◽  
Christoph Genzel ◽  
Adrian Oponowicz ◽  
...  

The main focus of the presented work was the investigation of structure and residual stress gradients in the near-surface region of materials studied by X-ray diffraction. The multireflection method was used to measure depth-dependent stress variation in near-surface layers of a Ti sample (grade 2) subjected to different mechanical treatments. First, the multireflection grazing incidence diffraction method was applied on a classical diffractometer with Cu Kα radiation. The applicability of the method was then extended by using a white synchrotron beam during an energy dispersive (ED) diffraction experiment. An advantage of this method was the possibility of using not only more than one reflection but also different wavelengths of radiation. This approach was successfully applied to analysis of data obtained in the ED experiment. There was good agreement between the measurements performed using synchrotron radiation and those with Cu Kα radiation on the classical diffractometer. A great advantage of high-energy synchrotron radiation was the possibility to measure stresses as well as thea0parameter andc0/a0ratio for much larger depths in comparison with laboratory X-rays.


2008 ◽  
Vol 41 (2) ◽  
pp. 377-385 ◽  
Author(s):  
Thomas Erbacher ◽  
Alexander Wanner ◽  
Tilmann Beck ◽  
Otmar Vöhringer

The experimental analysis of near-surface residual stresses by X-ray diffraction methods is based on measuring the spacings of lattice planes while the inclination ψ with respect to the surface plane is changed stepwise. A characteristic feature of conventional techniques is that the penetration depth of the X-rays is altered as inclination is varied. By simultaneously varying three different goniometer angles in a particular fashion, both the penetration depth and the measuring direction can be held constant while ψ is varied. Thus the normal and shear stresses can be derived from the sin2ψ plots by means of standard evaluation procedures developed for gradient-free stress states. The depth profile of residual stress is then obtainedviaLaplace transformation of the results from several stress measurements carried out at different penetration depths. In the present paper, the feasibility of this experimental approach for characterizing the strongly graded, non-equiaxed stress state existing at a machined surface is demonstrated. The results from constant-penetration-depth measurements on the ground surface of an engineering ceramic are compared with those from conventional sin2ψ measurements.


2006 ◽  
Vol 524-525 ◽  
pp. 267-272 ◽  
Author(s):  
Axel Steuwer ◽  
Matthew J. Peel ◽  
Thomas Buslaps

In this paper we discuss certain aspects of residual stress measurements using energy-dispersive synchrotron X-ray diffraction using very high X-ray energies in the range up to 200keV. In particular, we focus on the strain resolution and its relation to the geometric contribution to the instrumental resolution. This energy range together with the brilliance of insertion devices allows measurements in bulk materials with penetration approaching those of neutrons, and the technique is demonstrated to have a high potential for residual stress determination. However, the use of high X-ray energies implies a relatively small diffraction angle and in turn a relatively elongated gauge volume, which favours the application of the technique to essentially 2D problems.


2005 ◽  
Vol 490-491 ◽  
pp. 223-228 ◽  
Author(s):  
S. Ganguly ◽  
Michael E. Fitzpatrick ◽  
Lyndon Edwards

The residual stress field in a VPPA welded AA2024 coupon sample was measured by neutron diffraction. A similar sample was measured using synchrotron X-rays to determine the inplane strain directions. The macrostrain obtained from both sources compares well in spite of the significant difference in gauge volume and diffraction geometry. The result confirms the repeatability of the weld process and also shows good correspondence between the two diffraction processes.


Author(s):  
Marc H. Peeters ◽  
Max T. Otten

Over the past decades, the combination of energy-dispersive analysis of X-rays and scanning electron microscopy has proved to be a powerful tool for fast and reliable elemental characterization of a large variety of specimens. The technique has evolved rapidly from a purely qualitative characterization method to a reliable quantitative way of analysis. In the last 5 years, an increasing need for automation is observed, whereby energy-dispersive analysers control the beam and stage movement of the scanning electron microscope in order to collect digital X-ray images and perform unattended point analysis over multiple locations.The Philips High-speed Analysis of X-rays system (PHAX-Scan) makes use of the high performance dual-processor structure of the EDAX PV9900 analyser and the databus structure of the Philips series 500 scanning electron microscope to provide a highly automated, user-friendly and extremely fast microanalysis system. The software that runs on the hardware described above was specifically designed to provide the ultimate attainable speed on the system.


Author(s):  
Y. Sato ◽  
T. Hashimoto ◽  
M. Ichihashi ◽  
Y. Ueki ◽  
K. Hirose ◽  
...  

Analytical TEMs have two variations in x-ray detector geometry, high and low angle take off. The high take off angle is advantageous for accuracy of quantitative analysis, because the x rays are less absorbed when they go through the sample. The low take off angle geometry enables better sensitivity because of larger detector solid angle.Hitachi HF-2000 cold field emission TEM has two versions; high angle take off and low angle take off. The former allows an energy dispersive x-ray detector above the objective lens. The latter allows the detector beside the objective lens. The x-ray take off angle is 68° for the high take off angle with the specimen held at right angles to the beam, and 22° for the low angle take off. The solid angle is 0.037 sr for the high angle take off, and 0.12 sr for the low angle take off, using a 30 mm2 detector.


2010 ◽  
Vol 64 ◽  
pp. 125-134
Author(s):  
Hanabusa Takao ◽  
Ayumi Shiro ◽  
Tatsuya Okada

Residual stresses of a copper bicrystal were measured by X-ray diffraction and synchrotron radiation. A copper bicrystal specimen with a 90-degree tilt boundary was fabricated by the Brigdman technique. After the plastic extension of 30%, kink bands developed in a deformed matrix along the grain boundary. In this study, we focused on the residual stress distribution along the transverse direction of the specimen surface and the residual stresses in deformed matrix and kink band near the grain boundary. Residual stresses were evaluated by the X-ray single crystal measurement method. Stereographic projections were used to determine crystal orientations of deformed regions. It was found that crystal orientations were different between the deformed matrix and the kink band. Residual stresses in the direction along the grain boundary were compressive in the vicinity of the boundary and tensile in the region apart from the boundary. Residual stresses in the kink band were large in compression in compared with those in the deformation matrix. The difference in the results between X-rays and synchrotron radiation suggests that there is a depth variation in the deformation and therefore the residual stress development.


about chemical bonding and molecular structure. This information can be used to detect th e types of organic materials present on the surface. 4.3.2.2. Raman spectroscopy (RS) [7, 8] It is used to examine the energy levels of molecules that cannot be well character-ized via infrared spectroscopy. Th e two techniques, however, are complimentary. In the RS, a sample is irradiated with a strong monochromatic light source (usu-ally a laser). Most of the radiation will scatter or "reflect off' the sample at the same energy as the incoming laser radiation. However, a small amount will scat-ter from the sample at a wavelength slightly shifted from the original wavelength. It is possible to study the molecular structure or determine the chemical identity of the sample. It is quite straightforward to identify compounds by spectral library search. Due to extensive library spectral information, the unique spectral finger-print of every compound, and the ease with which such analyses can be per-formed, the RS is a very useful technique for various applications. An important application of the RS is the rapid, nondestructive characterization of diamond, diamond-like, and amorphous-carbon films. 4.3.2.3. Scanning electron microscopy (SEM) / energy dispersive X-ra y analysis (EDX) [7, 8] The SEM produce s detailed photographs that provide important information about the surface structure and morphology of almost any kind of sample. Image analy-sis is often the first and most important step in problem solving and failure analy-sis. With SEM, a focused beam of high-energy electrons is scanned over the sur-face of a material, causing a variety of signals, secondary electrons, X-rays, photons, etc. - each of which may be used to characterize the material with re-spect to specific properties . The signals are used to modulate the brightness on a CRT display, thereb y providing a high-resolution map of the selected material property. It is a surface imaging technique, but with Energy Dispersive X-ray (EDX) it can identify elements in the near-surface region. This technique is most useful for imaging particles. 4.3.2.4. X-ray fluorescence (XRF) [7, 8] Incident X-rays are used to excite surface atoms. The atoms relax through the emission of an X-ray with energy characteristic of the parent atoms and the inten-sity proportional to the amount of the element present. It is a bulk or "total mate-rials" characterization technique for rapid, simultaneous, and nondestructive analysis of elements having an atomic number higher than that of boron. Tradi-tional bulk analysis applications include identifying metals and alloys, detecting trace elements in liquids, and identifying residues and deposits. 4.3.2.5. Total-reflection X-ray fluorescence (TXRF) [7, 8] It is a special XRF technique that provides extremely sensitive measures of the elements present in a material's outer surface. Applications include searching for metal contamination in thin films on silicon wafers and detecting picogram-levels o f arsenic, lead, mercury and cadmium on hazardous, chemical fume hoods.

2003 ◽  
pp. 43-45

1986 ◽  
Vol 1 (5) ◽  
pp. 629-634 ◽  
Author(s):  
J.W. McCamy ◽  
M.J. Godbole ◽  
A.J. Pedraza ◽  
D.H. Lowndes

A simple, precise method for obtaining the average thickness of an amorphous layer formed by any surface treatment has been developed. The technique uses an x-ray diffractoeter to measure the reduction in the integrated intensity of several diffracted x-ray lines due to the near surface amorphous layer. The target material for generation of x rays is selected so that the emitted x rays are strongly absorbed by the specimen. This method permits thickness measurements down to ∼ 100 nm. It has been tested on a specimen of Fe80B20 on which an amorphous layer was produced by pulsed XeCl (308 nm) laser irradiation; the amorphous layer thickness was found to be 1.34 (∼0.1) um.


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