Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

2019 ◽  
Vol 31 (4) ◽  
pp. 227-232
Author(s):  
Mengjiao Guo ◽  
F. Sun ◽  
Zuozhu Yin
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Growth Behavior ◽  
Bonding Process ◽  
Effect Of Temperature ◽  
Content Type ◽  
Interfacial Imcs ◽  
Short Time ◽  
Cu Dissolution ◽  
Bonding Technique

Purpose This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu joints). The purpose of the study is to form high-melting-point IMC joints for high-temperature power electronics applications. The study also investigated the effect of temperature gradient on the microstructure evolution and the growth behavior of IMCs. Design/methodology/approach In this paper, the thermo-compression bonding technique was used to form full Cu3Sn joints. Findings Experimental results indicated that full Cu/Cu3Sn/Cu solder joints with the thickness of about 5-6 µm are formed in a short time of 9.9 s and under a low pressure of 0.016 MPa at 450°C by thermo-compression bonding technique. During the bonding process, Cu6Sn5 grew with common scallop-like shape at Cu/SAC105 interfaces, which was followed by the growth of Cu3Sn with planar-like shape between Cu/Cu6Sn5 interfaces. Meanwhile, the morphology of Cu3Sn transformed from a planar-like shape to wave-like shape until full IMCs solder joints were eventually formed during thermo-compression bonding process. Asymmetrical growth behavior of the interfacial IMCs was also clearly observed at both ends of the Cu/SAC105 (Sn-1.0Ag-0.5Cu)/Cu solder joints. Detailed reasons for the asymmetrical growth behavior of the interfacial IMCs during thermo-compression bonding process are given. The compound of Ag element causes a reduction in Cu dissolution rate from the IMC into the solder solution at the hot end, inhibiting the growth of IMCs at the cold end. Originality/value This study used the thermo-compression bonding technique and Sn-1.0Ag-0.5Cu to form full Cu3Sn joints.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Feng Wang ◽  
Fangfang Zhang ◽  
Qixiang Huang ◽  
Mohammad Salmani
Keyword(s):  
Random Vibration ◽  
Solder Joints ◽  
Experimental Tests ◽  
Electronic Systems ◽  
Lifetime Estimation ◽  
Content Type ◽  
Comprehensive Method ◽  
Vibration Fatigue ◽  
Short Time ◽  
Good Agreement

Purpose The purpose of this paper is to propose a method with capability of short-time implementation. Design/methodology/approach This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints. Findings A new method with good agreement with experimental tests has been proposed. Originality/value It is confirmed that paper is original.

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

2020 ◽  
Vol 33 (1) ◽  
pp. 35-46 ◽  
Author(s):  
Guang Chen ◽  
Xinzhan Cui ◽  
Yaofeng Wu ◽  
Wei Li ◽  
Fengshun Wu
Keyword(s):  
Solder Joint ◽  
Composite Solder ◽  
Solder Joints ◽  
Experimental Results ◽  
High Current ◽  
Sac305 Solder ◽  
Content Type ◽  
Interfacial Imcs ◽  
Current Stressing ◽  
Isothermal Ageing

Purpose The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical-migration (EM) stressing. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% FNS was prepared via the powder metallurgy method. A sandwich-like sample and a U-shaped sample were designed and prepared to conduct an isothermal ageing test and an EM test. The isothermal ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were comparatively studied. Findings A growth of Ag3Sn intermetallic compounds (IMCs) in solder matrix and Cu-Sn interfacial IMCs in composite solder joints was notably suppressed under isothermal ageing condition, whereas the hardness and shear strength of composite solder joints significantly outperformed those of non-reinforced solder joints throughout the ageing period. The EM experimental results showed that for the SAC305 solder, the interfacial IMCs formulated a protrusion at the anode after 360 h of EM stressing, whereas the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, whereas the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/FNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode sides; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, whereas the hardness data showed a relatively homogeneous distribution in the SAC305/FNS solder joint. Originality/value The experimental results showed that the FNS reinforcement could effectively mitigate the failure risk in solder joints under isothermal ageing and high-current stressing. Specifically, the FNS particles in solder joints can work as a barrier to suppress the diffusion and migration of Sn and Cu atoms. In addition, the nanoidentation results also indicated that the addition of the FNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high-current densities.

Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xu Han ◽  
Xiaoyan Li ◽  
Peng Yao ◽  
Dalong Chen
Keyword(s):  
Design Methodology ◽  
Solder Joints ◽  
Nucleation And Growth ◽  
Content Type ◽  
Reaction Stage ◽  
Interfacial Imcs ◽  
Soldering Process ◽  
Liquid Reaction ◽  
Ultrasonic Assisted ◽  
Solid Liquid

Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm. Findings Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s. Originality/value The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.

Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
F Sun ◽  
Zhen Pan ◽  
Yang Liu ◽  
Xiang Li ◽  
Haoyu Liu ◽  
...  
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Microstructure Evolution ◽  
Composite Solder ◽  
Growth Behavior ◽  
Composite Joints ◽  
Content Type ◽  
Composite Joint ◽  
Cu Substrates ◽  
Copper Composite

Purpose The purpose of this paper is to quickly manufacture full Cu3Sn-microporous copper composite joints for high-temperature power electronics applications and study the microstructure evolution and the shear strength of Cu3Sn at different bonding times. Design/methodology/approach In this paper, a novel structure of Cu/composite solder sheet/Cu was designed. The composite solder sheet was made of microporous copper filled with Sn. The composite joint was bonded by thermo-compression bonding under pressure of 0.6 MPa at 300°C. The microstructure evolution and the growth behavior of Cu3Sn at different bonding times were observed by electron microscope and metallographic microscope. The shear strength of the joint was measured by shear machine. Findings At initial bonding stage the copper atoms in the substrate and the copper atoms in the microporous copper dissolved into the liquid Sn. Then the scallop-liked Cu6Sn5 phases formed at the interface of liquid Sn/microporous copper and liquid Sn/Cu substrates. During the liquid Sn changing to Cu6Sn5 phases, Cu3Sn phases formed and grew at the interface of Cu6Sn5/Cu substrates and Cu6Sn5/microporous copper. After that the Cu3Sn phases continued to grow and the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained. The growth rule of Cu3Sn was parabolic growth. The shear strength of the composite joints was about 155 MPa. Originality/value This paper presents a novel full Cu3Sn-microporous copper composite joint with high shear strength for high-temperature applications based on transient liquid phase bonding. The microstructure evolution and the growth behavior of Cu3Sn in the composite joints were studied. The shear strength and the fracture mechanism of the composite joints were studied.

Pivoting in a COVID-19 teaching environment: developing interactive teaching approaches and online assessments to improve students’ experiences

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Kate L. Morgan ◽  
Wei Chen
Keyword(s):  
Online Teaching ◽  
Sudden Change ◽  
Course Delivery ◽  
Financial Accounting ◽  
Content Type ◽  
Face To Face ◽  
Course Materials ◽  
Accounting Courses ◽  
Online Assessments ◽  
Short Time

Purpose The purpose of this paper is to discuss the changes made to course delivery, course materials and assessment approaches required in response to the COVID-19 pandemic which forced many changes to occur in a very short time. Design/methodology/approach It is a case study of the changes made to content, teaching methods and assessment in a postgraduate introductory financial accounting course of approximately 350 students across two terms. Findings The key findings are that the sudden change from face-to-face to online teaching to address government regulations, social distancing expectations and students’ needs required immediate changes to how content was delivered, how to interact with students (many of who were studying outside of Australia), and how to adapt to online assessments. Many of the innovations the authors describe will continue to be used in the course going forward both in face-to-face and online formats. That is, the need to change resulted in innovations that can be implemented in a post-pandemic environment. Originality/value The key value of this paper is to provide instructors with insights into the innovations the authors made to address the changed circumstances, which can be incorporated into other accounting courses in the future.

Microwave synthesis, photophysical properties of novel fluorescent iminocoumarins and their application in textile printing

2015 ◽  
Vol 44 (2) ◽  
pp. 87-93 ◽  
Author(s):  
G.H. Elgemeie ◽  
K.A. Ahmed ◽  
E.A. ahmed ◽  
M.H. helal ◽  
D.M. Masoud
Keyword(s):  
Blue Light ◽  
Microwave Synthesis ◽  
Photophysical Properties ◽  
Ethyl Cyanoacetate ◽  
High Yield ◽  
The Novel ◽  
Dioxane Solution ◽  
Content Type ◽  
Textile Printing ◽  
Short Time

Purpose – This paper aims to synthesise coumarine flourescent dyes from a cheap material in a very short time with a very high yield, and by using a clean green chemistry. Design/methodology/approach – Efficient microwave synthesis for some novel iminocoumarins starts from the reaction of p-phenyl-enediamine and ethyl cyanoacetate followed by cyclocondensation with salicylaldehyde derivatives. Findings – The synthesized iminocoumarine compounds were characterized by spectroscopic methods. Absorption and fluorescence spectra of the compounds were also recorded. All compounds were fluorescent in 1,4-dioxane solution, they all emitted blue light (440-460 nm). The printing properties were studied, and their applications on printing polyester and polyamide fabrics were studied by silk screen printing. Originality/value – The authors designed efficient microwavel synthesis for some novel iminocoumarine derivatives; The novel procedure features short-reaction time, moderate yields and simple workup; All compounds were fluorescent in 1,4-dioxane solution, and they all emitted blue light; The authors studied their application in printing polyester and polyamide fabrics.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Microstructure evolution and growth behavior of rod-shaped ZrB2 in situ preparation of ZrB2-SiC composite powders

2019 ◽  
Vol 45 (3) ◽  
pp. 4016-4021 ◽  
Author(s):  
Yuehua Lin ◽  
Jinghang Liu ◽  
Shaolei Song ◽  
Jingbo Liu ◽  
Sajid Bashir ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Growth Behavior ◽  
Composite Powders ◽  
In Situ Preparation
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