Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
F Sun ◽  
Zhen Pan ◽  
Yang Liu ◽  
Xiang Li ◽  
Haoyu Liu ◽  
...  
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Microstructure Evolution ◽  
Composite Solder ◽  
Growth Behavior ◽  
Composite Joints ◽  
Content Type ◽  
Composite Joint ◽  
Cu Substrates ◽  
Copper Composite

Purpose The purpose of this paper is to quickly manufacture full Cu3Sn-microporous copper composite joints for high-temperature power electronics applications and study the microstructure evolution and the shear strength of Cu3Sn at different bonding times. Design/methodology/approach In this paper, a novel structure of Cu/composite solder sheet/Cu was designed. The composite solder sheet was made of microporous copper filled with Sn. The composite joint was bonded by thermo-compression bonding under pressure of 0.6 MPa at 300°C. The microstructure evolution and the growth behavior of Cu3Sn at different bonding times were observed by electron microscope and metallographic microscope. The shear strength of the joint was measured by shear machine. Findings At initial bonding stage the copper atoms in the substrate and the copper atoms in the microporous copper dissolved into the liquid Sn. Then the scallop-liked Cu6Sn5 phases formed at the interface of liquid Sn/microporous copper and liquid Sn/Cu substrates. During the liquid Sn changing to Cu6Sn5 phases, Cu3Sn phases formed and grew at the interface of Cu6Sn5/Cu substrates and Cu6Sn5/microporous copper. After that the Cu3Sn phases continued to grow and the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained. The growth rule of Cu3Sn was parabolic growth. The shear strength of the composite joints was about 155 MPa. Originality/value This paper presents a novel full Cu3Sn-microporous copper composite joint with high shear strength for high-temperature applications based on transient liquid phase bonding. The microstructure evolution and the growth behavior of Cu3Sn in the composite joints were studied. The shear strength and the fracture mechanism of the composite joints were studied.

Cu3Sn-microporous copper composite joint for high-temperature die-attach applications

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Zhen Pan ◽  
Fenglian Sun
Keyword(s):  
Thermal Conductivity ◽  
Shear Strength ◽  
High Temperature ◽  
Transient Liquid Phase ◽  
Content Type ◽  
Composite Joint ◽  
Die Attach ◽  
Aging Property ◽  
Copper Composite ◽  
Temperature Aging

Purpose The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated. Design/methodology/approach The composite joint was made of microporous copper and Cu3Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa. Findings After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu3Sn with high remelting temperatures. A large shear strength could be achieved with the Cu3Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C. Originality/value This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xinmeng Zhai ◽  
Yue Chen ◽  
Yuefeng Li
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Solder Joints ◽  
Layer Growth ◽  
Nano Particles ◽  
Content Type ◽  
Aging Conditions ◽  
Multi Walled Carbon Nanotubes ◽  
Reliability Of Solder Joints ◽  
Effects Of Aging

Purpose The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated. Design/methodology/approach In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C. Findings The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength. Originality/value In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

2017 ◽  
Vol 29 (2) ◽  
pp. 92-98 ◽  
Author(s):  
Gaofang Ban ◽  
Fenglian Sun ◽  
Yang Liu ◽  
Shaonan Cong
Keyword(s):  
Microstructure Evolution ◽  
Composite Solder ◽  
Microstructural Analysis ◽  
Bulk Solder ◽  
Solder Paste ◽  
Mechanical Mixing ◽  
Nano Composite ◽  
Content Type ◽  
Sac Solder ◽  
Nanocomposite Solder

Purpose The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging. Design/methodology/approach Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints. Findings It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added. Originality/value The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.

Numerical Analysis of Test Methods for Evaluating Shear Strength of Ceramic Composite Joints Using Interface Element

2007 ◽  
Vol 539-543 ◽  
pp. 2143-2148 ◽  
Author(s):  
Hisashi Serizawa ◽  
Charles Lewinsohn ◽  
Mrityunjay Singh ◽  
Hidekazu Murakawa
Keyword(s):  
Shear Strength ◽  
Surface Energy ◽  
Tensile Test ◽  
Test Methods ◽  
Bending Test ◽  
Interface Element ◽  
Composite Joints ◽  
Compressive Test ◽  
Composite Joint ◽  
Calculation Results

As examples of the most typical methods to determine the shear strength of SiC/SiC composite joints, the asymmetrical four point bending test of butt joined composite, the tensile test of lap joined composite and the compressive test of double-notched composite joint were analyzed by using finite element method with the interface element. From the calculation results, it was found that the shear strength in the asymmetrical bending test was controlled by both the surface energy and the shear strength at the interface regardless of their combination although the strength in the tensile test or the compressive test was governed by the surface energy when the shear strength was large. Also, it was revealed that the apparent shear strength of the composite joint obtained experimentally might be affected by the combination of the surface energy and the shear strength at the interface.

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

2019 ◽  
Vol 31 (4) ◽  
pp. 227-232
Author(s):  
Mengjiao Guo ◽  
F. Sun ◽  
Zuozhu Yin
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Growth Behavior ◽  
Bonding Process ◽  
Effect Of Temperature ◽  
Content Type ◽  
Interfacial Imcs ◽  
Short Time ◽  
Cu Dissolution ◽  
Bonding Technique

Purpose This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu joints). The purpose of the study is to form high-melting-point IMC joints for high-temperature power electronics applications. The study also investigated the effect of temperature gradient on the microstructure evolution and the growth behavior of IMCs. Design/methodology/approach In this paper, the thermo-compression bonding technique was used to form full Cu3Sn joints. Findings Experimental results indicated that full Cu/Cu3Sn/Cu solder joints with the thickness of about 5-6 µm are formed in a short time of 9.9 s and under a low pressure of 0.016 MPa at 450°C by thermo-compression bonding technique. During the bonding process, Cu6Sn5 grew with common scallop-like shape at Cu/SAC105 interfaces, which was followed by the growth of Cu3Sn with planar-like shape between Cu/Cu6Sn5 interfaces. Meanwhile, the morphology of Cu3Sn transformed from a planar-like shape to wave-like shape until full IMCs solder joints were eventually formed during thermo-compression bonding process. Asymmetrical growth behavior of the interfacial IMCs was also clearly observed at both ends of the Cu/SAC105 (Sn-1.0Ag-0.5Cu)/Cu solder joints. Detailed reasons for the asymmetrical growth behavior of the interfacial IMCs during thermo-compression bonding process are given. The compound of Ag element causes a reduction in Cu dissolution rate from the IMC into the solder solution at the hot end, inhibiting the growth of IMCs at the cold end. Originality/value This study used the thermo-compression bonding technique and Sn-1.0Ag-0.5Cu to form full Cu3Sn joints.

On the fire performance of unbraced composite frames

2018 ◽  
Vol 9 (4) ◽  
pp. 300-318 ◽  
Author(s):  
Oliver Bahr
Keyword(s):  
Numerical Model ◽  
Large Scale ◽  
Composite Joints ◽  
Fire Tests ◽  
Fire Performance ◽  
Structural Behaviour ◽  
Content Type ◽  
Composite Frames ◽  
Composite Joint ◽  
Fire Design

Purpose The purpose of this study is to gain a deeper understanding of the structural behaviour of fire-exposed unbraced composite frames. Designers to date paid little attention to unbraced one-bay composite frames as structural system. There are two main reasons for this. First, codes lack simplified methods for the fire design of these frames due to their sway and the linked P-Δ effects when subjected to fire, which complicates the design. Second, it is demanding to construct external composite joints for the regarded one-bay frames. Thus, external joints in composite constructions are mostly constructed as steel joints. Nevertheless, these frames offer advantages. These include increased usable space and flexibility in the building’s use, large spans, fast construction times and inherent fire resistance. Design/methodology/approach To profit from these benefits, two different external semi-rigid composite joint were developed for the considered one-bay composite frames. The first solution based on concrete-filled steel tube columns and the second on concrete-filled double skin tube columns. Furthermore, a numerical model was established to study the fire performance of unbraced composite frames. The model was validated against four fire tests on isolated composite joints and two large-scale fire tests on unbraced composite frames. Findings Overall, the predictions of the numerical model were in good agreement with the test results. Thus, the numerical model is appropriate for further investigations on the fire performance of unbraced composite frames. Originality/value The sequence of construction results in significant stresses in the steel section, which creates difficulties in numerical modelling and may account for the relatively few studies carried out at room temperature. For the fire design, there was, to the best knowledge of the author, to date no numerical model available that was capable of considering the sequence of construction.

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

2017 ◽  
Vol 29 (3) ◽  
pp. 121-132 ◽  
Author(s):  
Roman Kolenak
Keyword(s):  
Shear Strength ◽  
Bond Formation ◽  
Copper Substrate ◽  
Metallic Materials ◽  
Ultrasonic Activation ◽  
Content Type ◽  
Lower Shear ◽  
Sic Ceramics ◽  
Cu Substrates ◽  
Ultrasonic Soldering

Purpose This paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates. Design/methodology/approach Bi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation. Findings It was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics. Originality/value The addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa.

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