Cu Pillar flip chip assembly: Chip attach process failure mode study

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897448 ◽

2014 ◽

Author(s):

Shengmin Wen ◽

Bora Baloglu ◽

Guangfeng Li

Keyword(s):

Failure Mode ◽

Flip Chip ◽

Cu Pillar ◽

Process Failure ◽

Flip Chip Assembly ◽

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Enabling Cu Pillar Flip Chip Assembly with Water Soluble Lead-free Solder Paste

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026676 ◽

2019 ◽

Author(s):

B. Senthil Kumar ◽

Bayaras Abito Danila ◽

Chong Mei Hoe Joanne ◽

Zhang Rui Fen ◽

Santosh Kumar Rath ◽

...

Keyword(s):

Flip Chip ◽

Water Soluble ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Cu Pillar ◽

Flip Chip Assembly ◽

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Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly

Microelectronics Reliability ◽

10.1016/j.microrel.2018.06.004 ◽

2018 ◽

Vol 87 ◽

pp. 97-105

Author(s):

Melina Lofrano ◽

Vladimir Cherman ◽

Mario Gonzalez ◽

Eric Beyne

Keyword(s):

Flip Chip ◽

Pillar Design ◽

Thermomechanical Stress ◽

Cu Pillar ◽

Flip Chip Assembly

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The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40- $\mu$ m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2018.2883670 ◽

2019 ◽

Vol 9 (1) ◽

pp. 10-17

Author(s):

Seyong Lee ◽

Jongho Park ◽

Jae-Hyeong Park ◽

Hanmin Lee ◽

Sangmyung Shin ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Cycle ◽

Flip Chip ◽

Cu Pillar ◽

Thermal Mechanical Properties ◽

Flip Chip Assembly

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Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926236 ◽

2017 ◽

Author(s):

Melina Lofrano ◽

Vladimir Cherman ◽

Mario Gonzalez ◽

Eric Beyne

Keyword(s):

Flip Chip ◽

Thermomechanical Stress ◽

Cu Pillar ◽

Flip Chip Assembly

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A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853452 ◽

2002 ◽

Author(s):

B.S. Smith ◽

R. Thorpe ◽

D.F. Baldwin

Keyword(s):

Failure Mode ◽

Flip Chip ◽

Low Cost ◽

Mode Analysis ◽

Failure Mode Analysis ◽

Flip Chip Assembly

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Co-design/simulation of flip-chip assembly for high voltage IGBT packages

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233847 ◽

2017 ◽

Author(s):

P. Rajaguru ◽

C. Bailey ◽

H. Lu ◽

A. M. Aliyu ◽

A. Castellazzi ◽

...

Keyword(s):

High Voltage ◽

Flip Chip ◽

Flip Chip Assembly

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Reliability of Cu pillar on substrate interconnects in high performance flip chip packages

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898626 ◽

2011 ◽

Author(s):

Rajesh Katkar ◽

Michael Huynh ◽

Laura Mirkarimi

Keyword(s):

High Performance ◽

Flip Chip ◽

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Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248992 ◽

2012 ◽

Author(s):

Jae-Woong Nah ◽

Michael Gaynes ◽

Eric Perfecto ◽

Claudius Feger

Keyword(s):

Flip Chip ◽

Organic Substrates ◽

Wafer Level ◽

Cu Pillar ◽

Flip Chip Packaging ◽

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Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507801 ◽

2008 ◽

Author(s):

R. Durairaj ◽

S. Mallik ◽

A. Seman ◽

A. Marks ◽

N.N. Ekere

Keyword(s):

Viscoelastic Properties ◽

Flip Chip ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Solder Pastes ◽

Flip Chip Assembly

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Indium Bumps Investigation for the Flip-chip Assembly

International Workshops and Tutorials on Electron Devices and Materials ◽

10.1109/sibedm.2006.230301 ◽

2006 ◽

Author(s):

Aidar Biktashov ◽

Nikolai Kuzmin ◽

Andrei Paulish

Keyword(s):

Flip Chip ◽

Indium Bumps ◽

Flip Chip Assembly

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