Development of Build-up Dielectric Material that enables High Temp. Low Loss, High Fracture Toughness Advanced FC-BGA Substrates
Keyword(s):
Low Loss
◽
2019 ◽
Vol 776
◽
pp. 166-171
◽
2004 ◽
Vol 19
(11)
◽
pp. 3270-3278
◽
2020 ◽
2009 ◽
pp. 64-64-51
◽
Keyword(s):