Orientation relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

2010 ◽  
Author(s):  
Pan-Ju Shang ◽  
Zhi-Quan Liu ◽  
Douxing Li ◽  
Jian-Ku Shang
Keyword(s):  
Solder Joint ◽  
Orientation Relationships

Use of 2½ D imaging in analysis of NiTi martensite

1978 ◽  
Vol 36 (1) ◽  
pp. 610-611
Author(s):  
G. M. Michal
Keyword(s):  
Memory Effect ◽  
Monoclinic Phase ◽  
Reaction Path ◽  
Structural Characteristics ◽  
Salient Feature ◽  
Martensite Phase ◽  
Orientation Relationships ◽  
Low Symmetry ◽  
Hydride Phases ◽  
Unusual Shape

Several TEM investigations have attempted to correlate the structural characteristics to the unusual shape memory effect in NiTi, the consensus being the essence of the memory effect is ostensible manifest in the structure of NiTi transforming martensitic- ally from a B2 ordered lattice to a low temperature monoclinic phase. Commensurate with the low symmetry of the martensite phase, many variants may form from the B2 lattice explaining the very complex transformed microstructure. The microstructure may also be complicated by the enhanced formation of oxide or hydride phases and precipitation of intermetallic compounds by electron beam exposure. Variants are typically found in selfaccommodation groups with members of a group internally twinned and the twins themselves are often observed to be internally twinned. Often the most salient feature of a group of variants is their close clustering around a given orientation. Analysis of such orientation relationships may be a key to determining the nature of the reaction path that gives the transformation its apparently perfect reversibility.

Moire Fringes on Precipitates in Quenched and Aged Beryllium

1968 ◽  
Vol 26 ◽  
pp. 426-427
Author(s):  
F. J. Fraikor ◽  
A. W. Brewer
Keyword(s):  
Ternary Phase ◽  
Volume Fraction ◽  
Age Hardening ◽  
Orientation Relationships ◽  
Solute Content ◽  
Moiré Fringes ◽  
Moire Patterns ◽  
Total Volume Fraction ◽  
Diffraction Patterns ◽  
Moiré Patterns

A number of investigators have examined moire patterns on precipitate particles in various age-hardening alloys. For example, Phillips has analyzed moire fringes at cobalt precipitates in copper and Von Heimendahl has reported on moire fringes in the system Al-Au. Recently, we have observed moire patterns on impurity precipitates in beryllium quenched in brine from 1000°C and aged at various temperatures in the range of 500-800°C. This heat treatment of beryllium rolled from vacuum cast ingots produces the precipitation of both an fee ternary phase, AlFeBe4, and an hcp binary phase, FeBe11. However, unlike a typical age-hardening alloy, the solute content of this material is low (less than 1000 ppm of Fe and 600 ppm of Al) and hence the total volume fraction of precipitates is small. Therefore there is some difficulty in distinguishing the precipitates and their orientation relationships with the beryllium matrix since the weak precipitate spots generally do not appear on the diffraction patterns.

Lattice imaging of precipitates in Al-Zn-Mg alloy

1986 ◽  
Vol 44 ◽  
pp. 412-413
Author(s):  
C. K. Wu
Keyword(s):  
Grain Boundaries ◽  
Homogeneous Nucleation ◽  
Alloy System ◽  
Mg Alloy ◽  
List Type ◽  
Lattice Structures ◽  
Type Number ◽  
Orientation Relationships ◽  
Lattice Imaging ◽  
The Matrix

The precipitation phenomenon in Al-Zn-Mg alloy is quite interesting and complicated and can be described in the following categories:(i) heterogeneous nucleation at grain boundaries;(ii) precipitate-free-zones (PFZ) adjacent to the grain boundaries;(iii) homogeneous nucleation of snherical G.P. zones, n' and n phases inside the grains. The spherical G.P. zones are coherent with the matrix, whereas the n' and n phases are incoherent. It is noticed that n' and n phases exhibit plate-like morpholoay with several orientation relationship with the matrix. The high resolution lattice imaging techninue of TEM is then applied to study precipitates in this alloy system. It reveals the characteristics of lattice structures of each phase and the orientation relationships with the matrix.

In situ TEM observations of melting in nanosized eutectic Pb-Cd inclusions embedded in Al

1996 ◽  
Vol 54 ◽  
pp. 986-987
Author(s):  
S. Hagège ◽  
U. Dahmen ◽  
E. Johnson ◽  
A. Johansen ◽  
V.S. Tuboltsev
Keyword(s):  
Electron Microscope ◽  
Melt Spinning ◽  
Ternary Alloys ◽  
Solid Matrix ◽  
Eutectic System ◽  
In Situ Tem ◽  
In Situ Observation ◽  
Orientation Relationships ◽  
Transmission Electron

Small particles of a low-melting phase embedded in a solid matrix with a higher melting point offer the possibility of studying the mechanisms of melting and solidification directly by in-situ observation in a transmission electron microscope. Previous studies of Pb, Cd and other low-melting inclusions embedded in an Al matrix have shown well-defined orientation relationships, strongly faceted shapes, and an unusual size-dependent superheating before melting.[e.g. 1,2].In the present study we have examined the shapes and thermal behavior of eutectic Pb-Cd inclusions in Al. Pb and Cd form a simple eutectic system with each other, but both elements are insoluble in solid Al. Ternary alloys of Al (Pb,Cd) were prepared from high purity elements by melt spinning or by sequential ion implantation of the two alloying additions to achieve a total alloying addition of up to lat%. TEM observations were made using a heating stage in a 200kV electron microscope equipped with a video system for recording dynamic behavior.

Direct imaging of order-disorder and antiphase domain structures in Ti3Al intermetallic compound

1990 ◽  
Vol 48 (4) ◽  
pp. 480-481
Author(s):  
H. Q. Ye ◽  
T.S. Xie ◽  
D. Li
Keyword(s):  
Intermetallic Compound ◽  
Volume Fraction ◽  
Fundamental Problem ◽  
Antiphase Domain ◽  
Atomic Scale ◽  
Orientation Relationships ◽  
Domain Structures ◽  
Α Phase ◽  
Diffraction Patterns ◽  
Two Phases

The Ti3Al intermetallic compound has long been recognized as potentially useful structural materials. It offers attractive strength to weight and elastic modulus to weight ratios. Recent work has established that the addition of Nb to Ti3Al ductilized this compound. In this work the fundamental problem of this alloy, i.e. order-disorder and antiphase domain structures was investigated at the atomic scale.The Ti3Al+10at%Nb alloys used in this study were treated at 1060°C and then aged at 700°C for 2 hours. The specimens suitable for TEM were prepared by standard jet electrolytic-polishing technique. A JEM-200CX electron microscope with an interpretable resolution of about 0.25 nm was used for HREM.The [100] and [001] projections of the α2 phase were shown in Fig.l.The alloy obtained consist of at least two phases-α2(Ti3Al) and β0 structures. Moreover, a disorder α phase with small volume fraction was also observed. Fig.2 gives [100] and [001] diffraction patterns of the α2 phase. Since lattice parameters of the ordered α2 (a=0.579, c=0.466 nm) and disorder α phase (a0=0.294≈a/2, c0=0.468 nm) are almost the same, their diffraction patterns are difficult to be distinguished when they are overlapped with epitaxial orientation relationships.

Ultrasonic Wave Scattering by a Line Crack in a Solder Joint

1999 ◽  
Vol 11 (1) ◽  
pp. 117-135
Author(s):  
P. Dineva ◽  
D. Gross ◽  
T. Rangelov
Keyword(s):  
Solder Joint ◽  
Ultrasonic Wave ◽  
Wave Scattering ◽  
Line Crack

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

2010 ◽  
Vol 48 (11) ◽  
pp. 1035-1040 ◽  
Author(s):  
Young-Chul Lee ◽  
Kwang-Seok Kim ◽  
Ji-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Min-Kwan Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Mechanical Reliability

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

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