Morphological Reconstruction Operation for the Detection of Defects in Woven Fabric

2008 ◽  
Author(s):  
Jayanta K. Chandra ◽  
Pradipta K. Banerjee ◽  
Asit K. Datta
Keyword(s):  
Woven Fabric ◽  
Morphological Reconstruction ◽  
Reconstruction Operation ◽  
Detection Of Defects

Cotton and Bast Fiber Image Segmentation Based on Mathematical Morphology

2013 ◽  
Vol 303-306 ◽  
pp. 1590-1594 ◽  
Author(s):  
Ying Zhang ◽  
Sheng Fei Zhou ◽  
Zu Zheng Lin
Keyword(s):  
Image Segmentation ◽  
Mathematical Morphology ◽  
Cross Sectional ◽  
Morphological Reconstruction ◽  
Bast Fiber ◽  
Recognition Efficiency ◽  
Edge Detection Method ◽  
Processing Techniques ◽  
Morphological Image ◽  
Reconstruction Operation

Traditional cotton and bast fiber detection using artificial methods. Image processing techniques have been applied to the fiber detection and improve the automation and recognition efficiency of the detection. Image segmentation is the basic one of the steps for fiber identification. This paper using gradient edge detection method to segment the cotton and bast fiber longitudinal morphological image, and using morphological reconstruction operation method to the cross sectional fiber image. Both two kinds of images can be segmented by mathematical morphology method.

Neural network trained morphological processing for the detection of defects in woven fabric

2010 ◽  
Vol 101 (8) ◽  
pp. 699-706 ◽  
Author(s):  
Jayanta K. Chandra ◽  
Pradipta K. Banerjee ◽  
Asit K. Datta
Keyword(s):  
Neural Network ◽  
Morphological Processing ◽  
Woven Fabric ◽  
Detection Of Defects

Mikania micrantha mixed woven fabric for quick blood clotting and wound healing

2020 ◽  
Vol 6 (5) ◽  
Author(s):  
Shaikh Md Mominul Alam ◽  
Shilpi Akter ◽  
Md Lutfor Rahman
Keyword(s):  
Wound Healing ◽  
Blood Clotting ◽  
Woven Fabric ◽  
Excessive Bleeding ◽  
Sustainable Operations ◽  
Environment Friendly ◽  
Mikania Micrantha ◽  
Leaf Powder ◽  
Medical Textile ◽  
Dressing Materials

The aim of this paper is to introduce novel dressing with Mikania Micrantha for quick blood clotting and wound healing. When epidermis of human skin is cut or scrapped, sometimes too much bleeding occurs. Excessive bleeding may cause death, if bleeding is not stopped immediately. To promote blood clotting & wound healing natural based bio materials are still insufficient in medical textile sector. To fill up this scarcity, woven fabric treated with Mikania micrantha leaf juice & leaf powder was examined. M. micrantha exhibits good blood clotting time in comparison with available dressing materials. Woven fabric (bandage) that contains M. micrantha can be used for cut wounds healing purpose. The experiments were carried out in environment friendly way which indicates the production & processing of these dressing materials can have enormous contribution to sustainable operations and products.

Effect of Shape of Fiber Bundle on Damage Development of Woven Fabric Composities

2006 ◽  
Vol 55 (2) ◽  
pp. 224-229 ◽  
Author(s):  
Takao OTA ◽  
Hikaru YOSHIZUMI ◽  
Hirokazu TSUCHIHASHI ◽  
Takashi MATSUOKA ◽  
Kazuhiko SAKAGUCHI
Keyword(s):  
Fiber Bundle ◽  
Woven Fabric ◽  
Damage Development

Thermal Imaging Product Power-up: Metrology for Capturing Thermal Defects on Live Units Not Visible on Any Other Technique

2005 ◽  
Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta
Keyword(s):  
Thermal Imaging ◽  
Thermal Response ◽  
Recent Application ◽  
Ir Camera ◽  
Thermal Failure ◽  
Response Data ◽  
Startup Process ◽  
Customer Returns ◽  
Actual Computer ◽  
Detection Of Defects

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

Failure and Stress Analysis of Cu TSVs Using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy

2015 ◽  
Author(s):  
Ingrid De Wolf ◽  
Ahmad Khaled ◽  
Martin Herms ◽  
Matthias Wagner ◽  
Tatjana Djuric ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Stress Analysis ◽  
Rayleigh Waves ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Through Silicon Vias ◽  
Stress Anisotropy ◽  
Silicon Vias ◽  
Ic Technology ◽  
Detection Of Defects

Abstract This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.

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