Study on Vibration Analysis for Printed Circuit Board of An Electronic Apparatus

Author(s):  
Weibin Tang ◽  
Jianfeng Ren ◽  
Gangying Feng ◽  
Limei Xu
Author(s):  
, Venkat ◽  
P. V. Siva Rao ◽  
Arun Kumar Singh ◽  
, Srikrishna ◽  
, Ranganath

2015 ◽  
Vol 4 (2) ◽  
pp. 70-75
Author(s):  
Şule Atasever ◽  
Pınar A. Bozkurt ◽  
Muammer Canel

Electrical and electronic apparatus and instruments which are obsolete value in use or completion of the life can be defined as e-waste. E-waste is one of the fastest growing types of hazardous waste. Printed circuit boards a major component of this waste. In this study, printed circuit board particles of mobile phone (MPCB) were used as electronic waste. MPCB waste was obtained from a local electronic waste factory. The elemental analysis and ICP-MS analysis were performed on these electronic wastes and thereafter pyrolysis runs were carried out between 500 and 900°C in a horizontal furnace. The liquid yields were determined and compared at different temperatures.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.


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