High performance sub-half micron CMOS using rapid thermal processing

Author(s):  
R.A. Chapman ◽  
J.W. Kuehne ◽  
P.S.-H. Ying ◽  
W.F. Richardson ◽  
A.R. Paterson ◽  
...  
1987 ◽  
Vol 92 ◽  
Author(s):  
R. S. Hockett

ABSTRACTRapid Thermal Processing is being evaluated in the IC industry as a way to meet the thermal budget requirements of reduced scaling in high performance Si IC's. As scaling is reduced and alternative processing is used, the study of low level interfacial impurities is expected to become more important. An example is presented here for the redistribution of interfacial impurities under RTP for polysilicon capped silicon similar to that proposed for shallow junction bipolar transistors.


1991 ◽  
Vol 224 ◽  
Author(s):  
Mehrdad M. Moslehi ◽  
John Kuehne ◽  
Richard Yeakley ◽  
Lino Velo ◽  
Habib Najm ◽  
...  

AbstractAdvanced rapid thermal processing (RTP) equipment and sensors have been developed for in-situ fabrication of semiconductor devices. High-performance multi-zone lamp modules have been applied to various processes including rapid thermal oxidation (RTO), chemicalvapor deposition (CVD) of tungsten and amorphous/polycrystalline silicon, silicide formation, as well as high-temperature rapid thermal annealing (RTA). Concurrent use of multizone lamps and multi-point temperature sensors allows real-time wafer temperature control and process uniformity optimization. Specific experimental results will be presented on the multi-zone lamp modules, in-situ process control sensors, and single-wafer fabrication processes.


1993 ◽  
Vol 29 (25) ◽  
pp. 2178 ◽  
Author(s):  
T. Hayashi ◽  
Y. Kawazu ◽  
H. Fukuda ◽  
T. Iwabuchi

2010 ◽  
Vol 49 (46) ◽  
pp. 8699-8703 ◽  
Author(s):  
Won Cheol Yoo ◽  
Jared A. Stoeger ◽  
Pyung-Soo Lee ◽  
Michael Tsapatsis ◽  
Andreas Stein

2010 ◽  
Vol 122 (46) ◽  
pp. 8881-8885 ◽  
Author(s):  
Won Cheol Yoo ◽  
Jared A. Stoeger ◽  
Pyung-Soo Lee ◽  
Michael Tsapatsis ◽  
Andreas Stein

2019 ◽  
Vol 8 (1) ◽  
pp. P35-P40 ◽  
Author(s):  
Haruo Sudo ◽  
Kozo Nakamura ◽  
Susumu Maeda ◽  
Hideyuki Okamura ◽  
Koji Izunome ◽  
...  

1994 ◽  
Vol 141 (11) ◽  
pp. 3200-3209 ◽  
Author(s):  
Charles D. Schaper ◽  
Mehrdad M. Moslehi ◽  
Krishna C. Saraswat ◽  
Thomas Kailath

1990 ◽  
Vol 29 (Part 2, No. 1) ◽  
pp. L137-L140 ◽  
Author(s):  
Hisashi Fukuda ◽  
Akira Uchiyama ◽  
Takahisa Hayashi ◽  
Toshiyuki Iwabuchi ◽  
Seigo Ohno

Sign in / Sign up

Export Citation Format

Share Document