Ultra low power: Emerging devices and their benefits for integrated circuits

Author(s):  
Adrian M. Ionescu ◽  
Luca De Michielis ◽  
Nilay Dagtekin ◽  
Giovanni Salvatore ◽  
Ji Cao ◽  
...  
2006 ◽  
Vol 16 (02) ◽  
pp. 421-436 ◽  
Author(s):  
HIDEKI HASEGAWA ◽  
SEIYA KASAI ◽  
TAKETOMO SATO

In an attempt to realize tiny "knowledge vehicles" called intelligent quantum (IQ) chips for use in the coming ubiquitous network society, this paper presents the present status and future prospects of ultra-small-size and ultra-low-power III-V quantum logic large scale integrated circuits based on a novel hexagonal binary-decision diagram (BDD) quantum circuit architecture. Here, quantum transport in path switching node devices formed on III-V semiconductor-based hexagonal nanowire networks is controlled by nanometer scale Schottky wrap gates (WPGs) to realize arbitrary combinational logic function. Feasibility of the approach is shown through fabrication of basic node devices and various small-scale circuits, and approaches for higher density integration and larger scale circuits are discussed.


Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 256
Author(s):  
Youngbae Kim ◽  
Shreyash Patel ◽  
Heekyung Kim ◽  
Nandakishor Yadav ◽  
Kyuwon Ken Choi

Power consumption and data processing speed of integrated circuits (ICs) is an increasing concern in many emerging Artificial Intelligence (AI) applications, such as autonomous vehicles and Internet of Things (IoT). Existing state-of-the-art SRAM architectures for AI computing are highly accurate and can provide high throughput. However, these SRAMs have problems that they consume high power and occupy a large area to accommodate complex AI models. A carbon nanotube field-effect transistors (CNFET) device has been reported as a potential candidates for AI devices requiring ultra-low power and high-throughput due to their satisfactory carrier mobility and symmetrical, good subthreshold electrical performance. Based on the CNFET and FinFET device’s electrical performance, we propose novel ultra-low power and high-throughput 8T SRAMs to circumvent the power and the throughput issues in Artificial Intelligent (AI) computation for autonomous vehicles. We propose two types of novel 8T SRAMs, P-Latch N-Access (PLNA) 8T SRAM structure and single-ended (SE) 8T SRAM structure, and compare the performance with existing state-of-the-art 8T SRAM architectures in terms of power consumption and speed. In the SRAM circuits of the FinFET and CNFET, higher tube and fin numbers lead to higher operating speed. However, the large number of tubes and fins can lead to larger area and more power consumption. Therefore, we optimize the area by reducing the number of tubes and fins without compromising the memory circuit speed and power. Most importantly, the decoupled reading and writing of our new SRAMs cell offers better low-power operation due to the stacking of device in the reading part, as well as achieving better readability and writability, while offering read Static Noise Margin (SNM) free because of isolated reading path, writing path, and greater pull up ratio. In addition, the proposed 8T SRAMs show even better performance in delay and power when we combine them with the collaborated voltage sense amplifier and independent read component. The proposed PLNA 8T SRAM can save 96%, while the proposed SE 8T SRAM saves around 99% in writing power consumption compared with the existing state-of-the-art 8T SRAM in FinFET model, as well as 99% for writing operation in CNFET model.


2021 ◽  
Author(s):  
komal swami ◽  
Ritu Sharma

Abstract Energy conservation and delay minimization are the two major goals while designing ultra-low-power digital integrated circuits at lower technology nodes. Here, silicon based carbon nanotube field effect transistor (CNTFET) has been explored as a novel material for future electronics design applications (EDA). In this paper, two energy-efficient switching activity minimization techniques have been applied with proposed designs. First technique detects the completion of sensing stage operation known as transition completion detection (TCD) technique. TC signal generated from NAND operation of complementary outputs of sensing stage which minimizes glitches in the complementary outputs of the latch stage. Another clock gating mechanism applied at the latch stage to smoothen the output waveforms Q and . The proposed and existing designs simulated using 32nm CMOS and 32nm CNTFET technology, indicating that the CNTFET based design reduces power by 45% and 36% respectively in comparison with conventional CMOS. Proposed Low Power Sense Amplifier Flip Flop with transition control detection (TCD-LPSAFF) and Ultra Low Energy Sense Amplifier Flip Flop (ULESAFF) give optimum power delay product (PDP) which is 35.7x10-18 J and 29.6x10-18 J respectively. Also, the effect of process variation has been analyzed at specified corners (FF, TT and SS) in the temperature range of -40º C to 120º C. The performance of all designs has been validated by functionality testing with variation in diameter, number of tubes and pitch respectively.


2019 ◽  
Vol 92 (4) ◽  
pp. 59-69
Author(s):  
Shinichi Takagi ◽  
Kimihiko Kato ◽  
Dae-Hwan Ahn ◽  
Takahiro Gotow ◽  
Ryotaro Takaguchi ◽  
...  

Author(s):  
Jorge Semião ◽  
Ruben Cabral ◽  
Hugo Cavalaria ◽  
Marcelino Santos ◽  
Isabel C. Teixeira ◽  
...  

Ultra-low-power strategies have a huge importance in today's integrated circuits designed for internet of everything (IoE) applications, as all portable devices quest for the never-ending battery life. Dynamic voltage and frequency scaling techniques can be rewarding, and the drastic power savings obtained in subthreshold voltage operation makes this an important technique to be used in battery-operated devices. However, unpredictability in nanoscale chips is high, and working at reduced supply voltages makes circuits more vulnerable to operational-induced delay-faults and transient-faults. The goal is to implement an adaptive voltage scaling (AVS) strategy, which can work at subthreshold voltages to considerably reduce power consumption. The proposed strategy uses aging-aware local and global performance sensors to enhance reliability and fault-tolerance and allows circuits to be dynamically optimized during their lifetime while prevents error occurrence. Spice simulations in 65nm CMOS technology demonstrate the results.


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