A layer prediction method for minimum cost three dimensional integrated circuits

2011 ◽  
Author(s):  
Tsu-Yun Hsueh ◽  
Hsiang-Hui Yang ◽  
Wei-Chieh Wu ◽  
Mely Chen Chi
Keyword(s):  
Integrated Circuits ◽  
Three Dimensional ◽  
Prediction Method ◽  
Minimum Cost

scholarly journals Implicit Euler Method for Three-Dimensional Turbomachinery Flow Calculation

1993 ◽  
Author(s):  
Shih H. Chen ◽  
Anthony H. Eastland
Keyword(s):  
Three Dimensional ◽  
Prediction Method ◽  
Minimum Cost ◽  
Inviscid Flow ◽  
Turnaround Time ◽  
Euler Method ◽  
Second Order ◽  
Approximate Factorization ◽  
Implicit Euler Method ◽  
Numerical Instabilities

A compressible three-dimensional implicit Euler solution method for turbomachinery flows has been developed. The goal of the present study is to develop an efficient and reliable method that can be used to replace the semi-empirical, semi-analytical quasi-three-dimensional turbomachinery flow prediction method currently being used for multi-stage turbomachinery design at early design stages. Currently, a methodology has been developed based on an inviscid flow model (Euler solver) and tested on single blade rows for validation. The method presented here is derived from the Beam and Warming implicit approximate factorization (AF) finite difference algorithm. To avoid high frequency numerical instabilities associated with the use of central differencing schemes to obtain a spatial second order accuracy, a combined explicit and implicit artificial dissipation model is adopted. This model consists of a second order implicit dissipation and mixed second/fourth order explicit dissipation terms. A Cartesian coordinate H-grid generated by a three-dimensional interactive grid generator developed by Beach is used. Results for SSME High Pressure Fuel Turbine are presented and the comparison with experimental data is discussed. The use of the present implicit Euler method and the three-dimensional turbomachinery interactive grid generator shows that turnaround time could be as short as one day using a workstation. This allows the designers to explore optimal design configurations at minimum cost.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Validation of a Belt Model for Prediction of Hub Forces from a Rolling Tire4

2009 ◽  
Vol 37 (2) ◽  
pp. 62-102 ◽  
Author(s):  
C. Lecomte ◽  
W. R. Graham ◽  
D. J. O’Boy
Keyword(s):  
Internal Pressure ◽  
Equations Of Motion ◽  
Three Dimensional ◽  
Prediction Method ◽  
Analytical Models ◽  
Beam Model ◽  
Impedance Boundary ◽  
Bending Waves ◽  
Tire Rotation ◽  
Three Dimensional Models

Abstract An integrated model is under development which will be able to predict the interior noise due to the vibrations of a rolling tire structurally transmitted to the hub of a vehicle. Here, the tire belt model used as part of this prediction method is first briefly presented and discussed, and it is then compared to other models available in the literature. This component will be linked to the tread blocks through normal and tangential forces and to the sidewalls through impedance boundary conditions. The tire belt is modeled as an orthotropic cylindrical ring of negligible thickness with rotational effects, internal pressure, and prestresses included. The associated equations of motion are derived by a variational approach and are investigated for both unforced and forced motions. The model supports extensional and bending waves, which are believed to be the important features to correctly predict the hub forces in the midfrequency (50–500 Hz) range of interest. The predicted waves and forced responses of a benchmark structure are compared to the predictions of several alternative analytical models: two three dimensional models that can support multiple isotropic layers, one of these models include curvature and the other one is flat; a one-dimensional beam model which does not consider axial variations; and several shell models. Finally, the effects of internal pressure, prestress, curvature, and tire rotation on free waves are discussed.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

scholarly journals Fabrication of Eutectic Ga-In Nanowire Arrays Based on Plateau–Rayleigh Instability

Molecules ◽  
2021 ◽  
Vol 26 (15) ◽  
pp. 4616
Author(s):  
Takashi Ikuno ◽  
Zen Somei
Keyword(s):  
Integrated Circuits ◽  
Substrate Surface ◽  
Three Dimensional ◽  
Average Diameter ◽  
Nanowire Arrays ◽  
Scanning Probe ◽  
Rayleigh Instability ◽  
Simple Method ◽  
Flat Substrate ◽  
Metal Nanowire

We have developed a simple method of fabricating liquid metal nanowire (NW) arrays of eutectic GaIn (EGaIn). When an EGaIn droplet anchored on a flat substrate is pulled perpendicular to the substrate surface at room temperature, an hourglass shaped EGaIn is formed. At the neck of the shape, based on the Plateau–Rayleigh instability, the EGaIn bridge with periodically varying thicknesses is formed. Finally, the bridge is broken down by additional pulling. Then, EGaIn NW is formed at the surface of the breakpoint. In addition, EGaIn NW arrays are found to be fabricated by pulling multiple EGaIn droplets on a substrate simultaneously. The average diameter of the obtained NW was approximately 0.6 μm and the length of the NW depended on the amount of droplet anchored on the substrate. The EGaIn NWs fabricated in this study may be used for three-dimensional wiring for integrated circuits, the tips of scanning probe microscopes, and field electron emission arrays.

scholarly journals High-Performance On-Chip Silicon Beamsplitter Based on Subwavelength Metamaterials for Enhanced Fabrication Tolerance

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1304
Author(s):  
Raquel Fernández de Cabo ◽  
David González-Andrade ◽  
Pavel Cheben ◽  
Aitor V. Velasco
Keyword(s):  
Integrated Circuits ◽  
Fundamental Mode ◽  
High Performance ◽  
Three Dimensional ◽  
High Sensitivity ◽  
Power Splitting ◽  
Excess Loss ◽  
Power Splitters ◽  
On Chip ◽  
Efficient Power

Efficient power splitting is a fundamental functionality in silicon photonic integrated circuits, but state-of-the-art power-division architectures are hampered by limited operational bandwidth, high sensitivity to fabrication errors or large footprints. In particular, traditional Y-junction power splitters suffer from fundamental mode losses due to limited fabrication resolution near the junction tip. In order to circumvent this limitation, we propose a new type of high-performance Y-junction power splitter that incorporates subwavelength metamaterials. Full three-dimensional simulations show a fundamental mode excess loss below 0.1 dB in an ultra-broad bandwidth of 300 nm (1400–1700 nm) when optimized for a fabrication resolution of 50 nm, and under 0.3 dB in a 350 nm extended bandwidth (1350–1700 nm) for a 100 nm resolution. Moreover, analysis of fabrication tolerances shows robust operation for the fundamental mode to etching errors up to ± 20 nm. A proof-of-concept device provides an initial validation of its operation principle, showing experimental excess losses lower than 0.2 dB in a 195 nm bandwidth for the best-case resolution scenario (i.e., 50 nm).

Color Reproduction Accuracy Promotion of 3D-Printed Surfaces Based on Microscopic Image Analysis

2019 ◽  
Vol 34 (01) ◽  
pp. 2054004 ◽  
Author(s):  
Xiaochun Wang ◽  
Chen Chen ◽  
Jiangping Yuan ◽  
Guangxue Chen
Keyword(s):  
Surface Roughness ◽  
Image Analysis ◽  
Three Dimensional ◽  
Prediction Method ◽  
Chromatic Aberration ◽  
Optimization Methods ◽  
Experimental Models ◽  
Microscopic Image ◽  
Color Reproduction ◽  
Microscopic Image Analysis

Full-color three-dimensional (3D) printing technology is a powerful process to manufacture intelligent customized colorful objects with improved surface qualities; however, poor surface color optimization methods are the main impeding factors for its commercialization. As such, the paper explored the correlation between microstructure and color reproduction, then an assessment and prediction method of color optimization based on microscopic image analysis was proposed. The experimental models were divided into 24-color plates and 4-color cubes printed by ProJet 860 3D printer, then impregnated according to preset parameters, at last measured by a spectrophotometer and observed using both a digital microscope and a scanning electron microscope. The results revealed that the samples manifested higher saturation and smaller chromatic aberration ([Formula: see text]) after postprocessing. Moreover, the brightness of the same color surface increased with the increasing soaked surface roughness. Further, reduction in surface roughness, impregnation into surface pores, and enhancement of coating transparency effectively improved the accuracy of color reproduction, which could be verified by the measured values. Finally, the chromatic aberration caused by positioning errors on different faces of the samples was optimized, and the value of [Formula: see text] for a black cube was reduced from 8.12 to 0.82, which is undetectable to human eyes.

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