scholarly journals Fabrication of Eutectic Ga-In Nanowire Arrays Based on Plateau–Rayleigh Instability

Molecules ◽  
2021 ◽  
Vol 26 (15) ◽  
pp. 4616
Author(s):  
Takashi Ikuno ◽  
Zen Somei
Keyword(s):  
Integrated Circuits ◽  
Substrate Surface ◽  
Three Dimensional ◽  
Average Diameter ◽  
Nanowire Arrays ◽  
Scanning Probe ◽  
Rayleigh Instability ◽  
Simple Method ◽  
Flat Substrate ◽  
Metal Nanowire

We have developed a simple method of fabricating liquid metal nanowire (NW) arrays of eutectic GaIn (EGaIn). When an EGaIn droplet anchored on a flat substrate is pulled perpendicular to the substrate surface at room temperature, an hourglass shaped EGaIn is formed. At the neck of the shape, based on the Plateau–Rayleigh instability, the EGaIn bridge with periodically varying thicknesses is formed. Finally, the bridge is broken down by additional pulling. Then, EGaIn NW is formed at the surface of the breakpoint. In addition, EGaIn NW arrays are found to be fabricated by pulling multiple EGaIn droplets on a substrate simultaneously. The average diameter of the obtained NW was approximately 0.6 μm and the length of the NW depended on the amount of droplet anchored on the substrate. The EGaIn NWs fabricated in this study may be used for three-dimensional wiring for integrated circuits, the tips of scanning probe microscopes, and field electron emission arrays.

scholarly journals The formation of self-assembled structures of C60 in solution and in the volume of an evaporating drop of a colloidal solution

2020 ◽  
Vol 60 (3) ◽  
Author(s):  
Urol Kudratovich Makhmanov ◽  
Abdulmutallib Kokhkharov ◽  
Sagdilla Bakhramov ◽  
Donats Erts
Keyword(s):  
Electron Microscopy ◽  
Colloidal Solution ◽  
Substrate Surface ◽  
Flat Glass ◽  
Dissipative System ◽  
Average Diameter ◽  
Flat Substrate ◽  
Transmission Electron ◽  
Physical Features ◽  
Self Aggregation

The results of experiments on the self-aggregation of C60 fullerene molecules both inside a two-component solvent (xylene/tetrahydrofuran) and in the volume of an evaporating drop of C60 colloidal solution on a flat substrate surface are presented. The investigations of C60 solutions using dynamic light scattering, transmission electron microscopy and UV–Vis absorption spectroscopy methods revealed the possibility of synthesis of fractal nanoaggregates with a diameter of up to ~135 nm at low concentrations of C60 in the solutions. The final geometric dimensions of C60 nanoaggregates were determined by the initial concentration of fullerene in the solvent medium. Using the scanning electron microscopy method, we have shown that in an open dissipative system – in the volume of an evaporating droplet of the colloidal solution of fullerene C60 sessile on the surface of a flat glass substrate, large quasispherical nanoaggregates with an average diameter of ~380–800 nm are formed. The physical features and regularities that characterize the processes of self-aggregation of fullerene particles in the volume of a drying drop were determined.

Island Edge Coverage By Metal Interconnects for Three Dimensional Circuits

2003 ◽  
Vol 769 ◽  
Author(s):  
Rabin Bhattacharya ◽  
Sigurd Wagner
Keyword(s):  
Integrated Circuits ◽  
Spherical Surface ◽  
Three Dimensional ◽  
Maximum Size ◽  
Exciting Field ◽  
Detector Arrays ◽  
Flat Substrate ◽  
Sacrificial Material ◽  
Metal Interconnects ◽  
Dome Shape

AbstractThree-dimensional integrated circuits is a new and exciting field that has been spurred on by the need for conformal displays and detector arrays. These circuits are fabricated by interconnecting rigid sub-circuit islands made on a flat, deformable substrate. To prepare for interconnects, we apply a patterned deformable sacrificial material over the flat substrate. We then deform the substrate, with the sub-circuit islands and the sacrificial pattern on it, to a spherical surface. Following deformation, we evaporate interconnect metal and then liftoff the sacrificial material, leaving only the metal lines that interconnect the islands. The maximum size for a circuit island to remain intact is proportional to the island's thickness. The larger the island has to be, the thicker it must be made to prevent it from cracking. For 50 μm thick Kapton E substrates, it was found that 40 μm square SiNx islandsmust be at least 0.5 μm thick.With such thick islands, sidewall coverage during evaporation of the interconnect metal becomes difficult because of the dome shape of the substrate. Moreover, during substrate deformation, there is delamination that occurs at the island-substrate interface. This delamination forms a gap between the edge of the island, and the substrate. Thick metalization that covers both sidewall and islandsubstrate gap, produces a yield of 97% for 10 micrometer wide aluminum lines.

Flattening Problem of Thermal Sprayed Particles

2004 ◽  
Vol 449-452 ◽  
pp. 1309-1312 ◽  
Author(s):  
Masahiro Fukumoto ◽  
Yasunori Tanaka ◽  
E. Nishioka
Keyword(s):  
Transition Temperature ◽  
Substrate Temperature ◽  
Ambient Pressure ◽  
Substrate Surface ◽  
Three Dimensional ◽  
Critical Conditions ◽  
Thermal Spray Process ◽  
Transition Pressure ◽  
Spray Process ◽  
Flat Substrate

Effect of both substrate temperature and ambient pressure on a flattening behavior of thermal sprayed particles was systematically investigated. In the flattening of the sprayed particles onto the flat substrate surface, critical conditions were recognized both in the substrate temperature and the ambient pressure. That is, the flattening behavior changed transitionally on the critical temperature and pressure range, respectively. A transition temperature, Tt, and a transition pressure, Pt, for those critical conditions were defined and introduced, respectively. Equivalence in the dependence both of transition temperature and transition pressure on the sprayed material’s order indicated that the wetting of the substrate by the molten particle is a common domination in the flattening. Three dimensional transition map by combining both transition behavior in the flattening was proposed as a controlling principle for the thermal spray process

Imaging of platinum-shadowed macromolecular complexes in dark field

1984 ◽  
Vol 42 ◽  
pp. 146-147
Author(s):  
D.W. Andrews ◽  
F.P. Ottensmeyer
Keyword(s):  
Thin Film ◽  
Three Dimensional ◽  
Average Diameter ◽  
Dark Field ◽  
Bright Field ◽  
Field Mode ◽  
Macromolecular Complexes ◽  
Average Mass ◽  
Topological Features ◽  
Projection Images

Shadowing with heavy metals has been used for many years to enhance the topological features of biological macromolecular complexes. The three dimensional features present in directionaly shadowed specimens often simplifies interpretation of projection images provided by other techniques. One difficulty with the method is the relatively large amount of metal used to achieve sufficient contrast in bright field images. Thick shadow films are undesirable because they decrease resolution due to an increased tendency for microcrystalline aggregates to form, because decoration artefacts become more severe and increased cap thickness makes estimation of dimensions more uncertain.The large increase in contrast provided by the dark field mode of imaging allows the use of shadow replicas with a much lower average mass thickness. To form the images in Fig. 1, latex spheres of 0.087 μ average diameter were unidirectionally shadowed with platinum carbon (Pt-C) and a thin film of carbon was indirectly evaporated on the specimen as a support.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

scholarly journals Two-Dimensional Visualization of the Three-Dimensional Planned Sacroiliac Screw Corridor with the Slice Fusion Method

2021 ◽  
Vol 10 (2) ◽  
pp. 184
Author(s):  
Maximilian Kerschbaum ◽  
Siegmund Lang ◽  
Florian Baumann ◽  
Volker Alt ◽  
Michael Worlicek
Keyword(s):  
Pelvic Ring ◽  
Three Dimensional ◽  
Fusion Method ◽  
Two Dimensional ◽  
Posterior Pelvic Ring ◽  
Simple Method ◽  
Sacroiliac Screw ◽  
Screw Insertion ◽  
Multiplanar Reconstructions ◽  
Screw Position

Insertion of sacro-iliac (SI) screws for stabilization of the posterior pelvic ring without intraoperative navigation or three-dimensional imaging can be challenging. The aim of this study was to develop a simple method to visualize the ideal SI screw corridor, on lateral two-dimensional images, corresponding to the lateral fluoroscopic view, used intraoperatively while screw insertion, to prevent neurovascular injury. We used multiplanar reconstructions of pre- and postoperative computed tomography scans (CT) to determine the position of the SI corridor. Then, we processed the dataset into a lateral two-dimensional slice fusion image (SFI) matching head and tip of the screw. Comparison of the preoperative SFI planning and the screw position in the postoperative SFI showed reproducible results. In conclusion, the slice fusion method is a simple technique for translation of three-dimensional planned SI screw positioning into a two-dimensional strict lateral fluoroscopic-like view.

scholarly journals Fish bone-derived interconnected carbon nanofibers for efficient and lightweight microwave absorption

2021 ◽  
Vol 3 (2) ◽  
Author(s):  
Yangyang Gu ◽  
Peng Dai ◽  
Wen Zhang ◽  
Zhanwen Su
Keyword(s):  
Microwave Absorption ◽  
Carbon Nanofibers ◽  
Three Dimensional ◽  
Fish Bone ◽  
Absorption Properties ◽  
Simple Method ◽  
Microwave Absorption Properties ◽  
Absorption Performance ◽  
Microwave Absorption Performance ◽  
Better Than

AbstractIn this work, we demonstrated a simple method for preparing three-dimensional interconnected carbon nanofibers (ICNF) derived from fish bone as an efficient and lightweight microwave absorber. The as-obtained ICNF exhibits excellent microwave absorption performance with a maximum reflection loss of –59.2 dB at the filler content of 15 wt%. In addition, the effective absorption bandwidth can reach 4.96 GHz at the thickness of 2 mm. The outstanding microwave absorption properties can be mainly ascribed to its well-defined interconnected nanofibers architecture and the doping of nitrogen atoms, which are also better than most of the reported carbon-based absorbents. This work paves an attractive way for the design and fabrication of highly efficient and lightweight electromagnetic wave absorbers.

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