Fabrication of PVD-TiN metal-gate SOI-CMOS integrated circuits using minimal-fab and mega-fab hybrid process

Author(s):  
Yongxun Liu ◽  
Sommawan Khumpuang ◽  
Masayoshi Nagao ◽  
Takashi Matsukawa ◽  
Shiro Hara
1987 ◽  
Vol 34 (6) ◽  
pp. 1769-1774 ◽  
Author(s):  
C. E. Barnes ◽  
J. G. Rollins ◽  
D. Hachey

2021 ◽  
Vol 16 (1) ◽  
Author(s):  
Xiaoshi Jin ◽  
Yicheng Wang ◽  
Kailu Ma ◽  
Meile Wu ◽  
Xi Liu ◽  
...  

AbstractA bilateral gate-controlled S/D symmetric and interchangeable bidirectional tunnel field effect transistor (B-TFET) is proposed in this paper, which shows the advantage of bidirectional switching characteristics and compatibility with CMOS integrated circuits compared to the conventional asymmetrical TFET. The effects of the structural parameters, e.g., the doping concentrations of the N+ region and P+ region, length of the N+ region and length of the intrinsic region, on the device performances, e.g., the transfer characteristics, Ion–Ioff ratio and subthreshold swing, and the internal mechanism are discussed and explained in detail.


1989 ◽  
Vol 25 (17) ◽  
pp. 1133 ◽  
Author(s):  
S.E. Nordquist ◽  
J.W. Haslett ◽  
F.N. Trofimenkoff

2008 ◽  
Vol 9 (1) ◽  
pp. 6-11 ◽  
Author(s):  
Byung-Hyun Lee ◽  
Yong-Il Kim ◽  
Bong-Soo Kim ◽  
Dong-Soo Woo ◽  
Yong-Jik Park ◽  
...  
Keyword(s):  

2011 ◽  
Vol 679-680 ◽  
pp. 726-729 ◽  
Author(s):  
David T. Clark ◽  
Ewan P. Ramsay ◽  
A.E. Murphy ◽  
Dave A. Smith ◽  
Robin. F. Thompson ◽  
...  

The wide band-gap of Silicon Carbide (SiC) makes it a material suitable for high temperature integrated circuits [1], potentially operating up to and beyond 450°C. This paper describes the development of a 15V SiC CMOS technology developed to operate at high temperatures, n and p-channel transistor and preliminary circuit performance over temperature achieved in this technology.


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