IVB-3 Fowler-Nordheim tunneling in MIS structures

1981 ◽  
Vol 28 (10) ◽  
pp. 1237-1238
Author(s):  
G. Krieger ◽  
R.M. Swanson
1997 ◽  
Vol 473 ◽  
Author(s):  
Heng-Chih Lin ◽  
Edwin C. Kan ◽  
Toshiaki Yamanaka ◽  
Simon J. Fang ◽  
Kwame N. Eason ◽  
...  

ABSTRACTFor future CMOS GSI technology, Si/SiO2 interface micro-roughness becomes a non-negligible problem. Interface roughness causes fluctuations of the surface normal electric field, which, in turn, change the gate oxide Fowler-Nordheim tunneling behavior. In this research, we used a simple two-spheres model and a three-dimensional Laplace solver to simulate the electric field and the tunneling current in the oxide region. Our results show that both quantities are strong functions of roughness spatial wavelength, associated amplitude, and oxide thickness. We found that RMS roughness itself cannot fully characterize surface roughness and that roughness has a larger effect for thicker oxide in terms of surface electric field and tunneling behavior.


1982 ◽  
Vol 73 (2) ◽  
pp. K179-K183 ◽  
Author(s):  
S. A. Asimov ◽  
D. A. Aronov ◽  
D. K. Isamukhamedova ◽  
Yu. M. Yuabov

2009 ◽  
Vol 30 (2) ◽  
pp. 171-173 ◽  
Author(s):  
C. Sandhya ◽  
U. Ganguly ◽  
N. Chattar ◽  
C. Olsen ◽  
S.M. Seutter ◽  
...  

1979 ◽  
Vol 26 (11) ◽  
pp. 1831-1832
Author(s):  
D.J. DiMaria ◽  
D.W. Dong
Keyword(s):  

1985 ◽  
Vol 28 (7) ◽  
pp. 717-720 ◽  
Author(s):  
Y. Nissan-Cohen ◽  
J. Shappir ◽  
D. Frohman-Bentchkowsky

2000 ◽  
Vol 622 ◽  
Author(s):  
Margarita P. Thompson ◽  
Gregory W. Auner ◽  
Changhe Huang ◽  
James N. Hilfiker

ABSTRACTAlN films with thicknesses from 53 to 79 nm were deposited on 6H-SiC substrates via Plasma Source Molecular Beam Epitaxy (PSMBE). The influence of deposition temperature on the growth mode and film roughness was assessed. The optical constants of the films in the range 0.73-8.75 eV were determined using spectroscopic ellipsometry. Pt/AlN/6H-SiC MIS structures were created and current-voltage (I-V) and capacitance-voltage (C-V) measurements were performed at room temperature and at 250°C. Most of the MIS structures showed rectifying I-V characteristics regardless of growth temperature. A 120-nm-thick AlN film was deposited at 500°C. MIS structures created on this film showed a very low leakage current densities of 6×10−8 A/cm2. The dielectric constant of the film was estimated at approximately 9. The relation between film structure and electrical properties of the films is discussed.


2014 ◽  
Vol 105 (14) ◽  
pp. 142108 ◽  
Author(s):  
Patrick Fiorenza ◽  
Alessia Frazzetto ◽  
Alfio Guarnera ◽  
Mario Saggio ◽  
Fabrizio Roccaforte

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