An Analytical Model for Steady-State and Transient Temperature Fields in 3-D Integrated Circuits

Author(s):  
Kangjia Wang ◽  
Zhongliang Pan
2008 ◽  
Vol 130 (5) ◽  
Author(s):  
N. Srihari ◽  
Sarit K. Das

Transient analysis helps us to predict the behavior of heat exchangers subjected to various operational disturbances due to sudden change in temperature or flow rates of the working fluids. The present experimental analysis deals with the effect of flow distribution on the transient temperature response for U-type and Z-type plate heat exchangers. The experiments have been carried out with uniform and nonuniform flow distributions for various flow rates. The temperature responses are analyzed for various transient characteristics, such as initial delay and time constant. It is also possible to observe the steady state characteristics after the responses reach asymptotic values. The experimental observations indicate that the Z-type flow configuration is more strongly affected by flow maldistribution compared to the U-type in both transient and steady state regimes. The comparison of the experimental results with numerical solution indicates that it is necessary to treat the flow maldistribution separately from axial thermal dispersion during modeling of plate heat exchanger dynamics.


2021 ◽  
Author(s):  
Sara Sharifian Attar

The goal of this research was to develop a capability for the electrothermal modeling of electronic circuits. The objective of the thermal modeling process was to create a model that represents the thermal behavior of the physical system. The project focuses on electrothermal analysis at devices and chip level. A novel method to perform electrothermal analysis of integrated circuits based on the relaxation approach is proposed in this research. An interface program couples a circuit simulator and a thermal simulator. The developed simulator is capable of performing both steady state and transient analaysis at devices and chip level. The proposed method was applied to perform electrothermal analysis of Silicon Bipolar Junction Transistor (BJT) to predict the temperature distribution and the device performance in a circuit. Thermal nonlinearity due to temperature-dependent material parameters in the context of thermal modeling of the device and circuit has also been considered. The DC characteristics of the device were investigated. The obtained results indicate that the operating point of the device varies while the device reaches its junction temperature. The accuracy of the electrothermal simulator has been evaluated for steady state analysis. The experimental results of a BJT amplifier were compared to the simulator results of the similar circuit. The electrothermal simulation results of BJT amplifier circuit indicate a good agreement with the available experimental results in terms of power dissipation, collector current and base-emitter voltage. The performance of the electrothermal simulator has been evaluated for tansient analysis. A current mirror circuit using Si NPN BJTs was simulated. According to the electrical simulator, the output current follows the reference current immediately. Nonetheless, the electrothermal simulator results depict that the load current has delay to reach a constant value which is not the same as the reference current, due to the influence of thermal coupling and self heating. The obtained results are in agreement with the available results in literature.


2014 ◽  
Vol 6 ◽  
pp. 217584 ◽  
Author(s):  
J. Schilp ◽  
C. Seidel ◽  
H. Krauss ◽  
J. Weirather

Process monitoring and modelling can contribute to fostering the industrial relevance of additive manufacturing. Process related temperature gradients and thermal inhomogeneities cause residual stresses, and distortions and influence the microstructure. Variations in wall thickness can cause heat accumulations. These occur predominantly in filigree part areas and can be detected by utilizing off-axis thermographic monitoring during the manufacturing process. In addition, numerical simulation models on the scale of whole parts can enable an analysis of temperature fields upstream to the build process. In a microscale domain, modelling of several exposed single hatches allows temperature investigations at a high spatial and temporal resolution. Within this paper, FEM-based micro- and macroscale modelling approaches as well as an experimental setup for thermographic monitoring are introduced. By discussing and comparing experimental data with simulation results in terms of temperature distributions both the potential of numerical approaches and the complexity of determining suitable computation time efficient process models are demonstrated. This paper contributes to the vision of adjusting the transient temperature field during manufacturing in order to improve the resulting part's quality by simulation based process design upstream to the build process and the inline process monitoring.


1972 ◽  
Vol 39 (3) ◽  
pp. 723-726 ◽  
Author(s):  
U. Olsson

The influence of the temperature-dependence of the material properties on the free vibrations of transiently heated structures is investigated. Analytical solutions are given for linear, exponential, and harmonic temperature variations when the material damping parameter, Poisson’s ratio, and Young’s modulus depend on the temperature.


1993 ◽  
Vol 115 (3) ◽  
pp. 621-630 ◽  
Author(s):  
G. F. Jones ◽  
J. Cai

We present a numerical study of transient natural convection in a rectangular open thermosyphon having asymmetric thermal boundary conditions. One vertical wall of the thermosyphon is either heated by constant heat flux (“warmup”) or cooled by convection to the surroundings (“cooldown”). The top of the thermosyphon is open to a large reservoir of fluid at constant temperature. The vorticity, energy, and stream-function equations are solved by finite differences on graded mesh. The ADI method and iteration with overrelaxation are used. We find that the thermosyphon performs quite differently during cooldown compared with warmup. In cooldown, flows are mainly confined to the thermosyphon with little momentum and heat exchange with the reservoir. For warmup, the circulation resembles that for a symmetrically heated thermosyphon where there is a large exchange with the reservoir. The difference is explained by the temperature distributions. For cooldown, the fluid becomes stratified and the resulting stability reduces motion. In contrast, the transient temperature for warmup does not become stratified but generally exhibits the behavior of a uniformly heated vertical plate. For cooldown and Ra > 104, time-dependent heat transfer is predicted by a closed-form expression for one-dimensional conduction, which shows that Nu → Bi1/2/A in the steady-state limit. For warmup, transient heat transfer behaves as one-dimensional conduction for early times and at steady state and for Ra* ≥ 105, can be approximated as that for a uniformly heated vertical plate.


2000 ◽  
Author(s):  
Z. C. Feng ◽  
Xiao-Zhang Zhang

Abstract This paper discusses the vibration phenomena of a rotor rubbing with a stator caused by an initial perturbation. The analytical model consists of a simple disc-shaft rotor and a fixed stator. The perturbation is an instantaneous change of the radial velocity when the rotor is rotating in its normal steady state. It is found that under certain conditions, the rotor will remain rubbing with the stator, even if the initial perturbation no longer exists. In the case of no friction on the contact surface between the rotor and the stator, the full rubbing behaves as forward whirling. When friction is present, the full rubbing behaves as backward whirling.


1995 ◽  
Vol 11 (02) ◽  
pp. 102-110 ◽  
Author(s):  
Jon J. Yagla ◽  
Richard S. Haag ◽  
Matthew E. Scott

A "seamless engineering" approach for mechanical design and laser welding manufacturing combines a method for welding analysis with a method for stress analysis through the development of radiant heating models for use in a nonlinear finite-element computer program. Experiments were performed welding steel plates, using a five-axis computer numerical controlled (CNC) workstation to translate welding specimens under a 5-kW CO2 (carbon dioxide) laser. Thermocouples installed near the weld seam were used to measure the transient temperature field during welding. The measured temperatures were compared with the analytical predictions, and the welds were sectioned so that predictions of properties in the heat-affected zone could be compared with experimental data. This paper presents analytical results using classical methods of analysis and includes solutions for temperature fields, heating and cooling rates, and metallurgical properties in heat-affected zones.


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