Impact of HfTaO Buffer Layer on Data Retention Characteristics of Ferroelectric-Gate FET for Nonvolatile Memory Applications

2011 ◽  
Vol 58 (2) ◽  
pp. 370-375 ◽  
Author(s):  
Minghua Tang ◽  
Xiaolei Xu ◽  
Zhi Ye ◽  
Yoshihiro Sugiyama ◽  
Hiroshi Ishiwara
2012 ◽  
Vol 52 (8) ◽  
pp. 1627-1631 ◽  
Author(s):  
Jer-Chyi Wang ◽  
Chih-Ting Lin ◽  
Chi-Hsien Huang ◽  
Chao-Sung Lai ◽  
Chin-Hsiang Liao

2006 ◽  
Vol 9 (7) ◽  
pp. F57 ◽  
Author(s):  
Hung-Yao Chen ◽  
Jen-Po Lin ◽  
Jenn-Ming Wu ◽  
Hsin-Erh Huang ◽  
Hui-Yun Bor

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1316
Author(s):  
Jae-Young Sung ◽  
Jun-Kyo Jeong ◽  
Woon-San Ko ◽  
Jun-Ho Byun ◽  
Hi-Deok Lee ◽  
...  

In this study, the deuterium passivation effect of silicon nitride (Si3N4) on data retention characteristics is investigated in a Metal-Nitride-Oxide-Silicon (MNOS) memory device. To focus on trap passivation in Si3N4 as a charge trapping layer, deuterium (D2) high pressure annealing (HPA) was applied after Si3N4 deposition. Flat band voltage shifts (ΔVFB) in data retention mode were compared by CV measurement after D2 HPA, which shows that the memory window decreases but charge loss in retention mode after program is suppressed. Trap energy distribution based on thermal activated retention model is extracted to compare the trap density of Si3N4. D2 HPA reduces the amount of trap densities in the band gap range of 1.06–1.18 eV. SIMS profiles are used to analyze the D2 profile in Si3N4. The results show that deuterium diffuses into the Si3N4 and exists up to the Si3N4-SiO2 interface region during post-annealing process, which seems to lower the trap density and improve the memory reliability.


2008 ◽  
Vol 93 (2) ◽  
pp. 022101 ◽  
Author(s):  
Man Chang ◽  
Yongkyu Ju ◽  
Joonmyoung Lee ◽  
Seungjae Jung ◽  
Hyejung Choi ◽  
...  

2002 ◽  
Vol 748 ◽  
Author(s):  
Hiroshi Ishiwara ◽  
Byung-Eun Park

ABSTRACTRecent progress in the research of ferroelectric-gate FETs is reviewed mainly from a view-point of the data retention characteristics. First, importance of insulator-inserted gate structures such as an MFIS (M; metal, F; ferroelectric, I; insulator, S; semiconductor) or MFMIS structure is described and the necessary conditions for the insulating buffer layer and the ferroelectric film are discussed. Then, experimental results for the SiO2 and high-k dielectric buffer layers combined with such ferroelectric films as SBT (SrBi2Ta2O9) and BLT ((Bi,La)4Ti3O12) are presented, in which particular attention is paid to the discussion on the induced charge matching between the buffer layer and the ferroelectric film. As an example, it is shown in a Pt/BLT/LaAlO3/Si diode that the high and low capacitance values written by positive and negative pulses can be retained at least for 3 days. Finally, recent experimental results on the data retention characteristics of the ferroelectric-gate FETs are presented.


2002 ◽  
Vol 747 ◽  
Author(s):  
Hiroshi Ishiwara ◽  
Byung-Eun Park

ABSTRACTRecent progress in the research of ferroelectric-gate FETs is reviewed mainly from a view-point of the data retention characteristics. First, importance of insulator-inserted gate structures such as an MFIS (M; metal, F; ferroelectric, I; insulator, S; semiconductor) or MFMIS structure is described and the necessary conditions for the insulating buffer layer and the ferroelectric film are discussed. Then, experimental results for the SiO2 and high-k dielectric buffer layers combined with such ferroelectric films as SBT (SrBi2Ta 2O9) and BLT ((Bi,La)4Ti3O12) are presented, in which particular attention is paid to the discussion on the induced charge matching between the buffer layer and the ferroelectric film. As an example, it is shown in a Pt/BLT/LaAlO3/Si diode that the high and low capacitance values written by positive and negative pulses can be retained at least for 3 days. Finally, recent experimental results on the data retention characteristics of the ferroelectric-gate FETs are presented.


Author(s):  
Somnath Mondal ◽  
Fa-Hsyang Chen ◽  
Tung-Ming Pan

Resistive switching in Ni/Yb2O3/TaN programmable memory cells was investigated. We proposed a rearrangement of oxygen vacancies under electric field plays role in resistive switching. Under negative bias, oxygen vacancies or other metallic defects migrate through Yb2O3 oxide and SET occurs. A reproducible resistance switching behavior was observed with high resistance ratio of about 105 with excellent data retention, and good immunity to read disturbance, are also revealed. In particular, the simple sandwich structure and excellent electrical performance of the memory cell making them ideal for the basis for highspeed, high-density, nonvolatile memory applications.


2013 ◽  
Vol 2013 ◽  
pp. 1-5
Author(s):  
Wen-Chieh Shih ◽  
Chih-Hao Cheng ◽  
Joseph Ya-min Lee ◽  
Fu-Chien Chiu

Charge-trapping devices using multilayered dielectrics were studied for nonvolatile memory applications. The device structure is Al/Y2O3/Ta2O5/SiO2/Si (MYTOS). The MYTOS field effect transistors were fabricated using Ta2O5as the charge storage layer and Y2O3as the blocking layer. The electrical characteristics of memory window, program/erase characteristics, and data retention were examined. The memory window is about 1.6 V. Using a pulse voltage of 6 V, a threshold voltage shift of ~1 V can be achieved within 10 ns. The MYTOS transistors can retain a memory window of 0.81 V for 10 years.


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