A dual core oxide 8T SRAM cell with low Vccmin and dual voltage supplies in 45nm triple gate oxide and multi Vt CMOS for very high performance yet low leakage mobile SoC applications
ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.
Abstract
Alloy C688 is a high-performance copper alloy with very high conductivity. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming and joining. Filing Code: Cu-867. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.
Abstract
Alloy KHP 7025 (UNS C70250) is a high-performance copper alloy with very high conductivity. Uses include connector springs, tabs, contact springs, switches, relays, and leadframes. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming, machining, and joining. Filing Code: Cu-865. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.
In recent years, there has been increased world-wide concern over residual (carry-over) activity of mostly high temperature (HT) and very high temperature (VHT) stable amylases in white, refined sugars from refineries to various food and end-user industries. HT and VHT stable amylases were developed for much larger markets than the sugar industry with harsher processing conditions. There is an urgent need in the sugar industry to be able to remove or inactivate residual, active amylases either in factory or refinery streams or both. A survey of refineries that used amylase and had activated carbon systems for decolorizing, revealed they did not have any customer complaints for residual amylase. The use of high performance activated carbons to remove residual amylase activity was investigated using a Phadebas® method created for the sugar industry to measure residual amylase in syrups. Ability to remove residual amylase protein was dependent on the surface area of the powdered activated carbons as well as mixing (retention) time. The activated carbon also had the additional benefit of removing color and insoluble starch.
RETRACTED ARTICLE: Research on Dual-Core Lock Step Mechanism and Its Application for Commercial High Performance APSoC