Coarse Resolution Defect Localization Algorithm for an Automated Visual PCB Inspection

2012 ◽  
Author(s):  
Zuwairie Ibrahim ◽  
Syed Abdul Rahman Al-Attas ◽  
Zulfakar Aspar
Keyword(s):  
Manufacturing Industry ◽  
Printed Circuit Board ◽  
Etching Process ◽  
Circuit Board ◽  
Automated System ◽  
Localization Algorithm ◽  
Printing Process ◽  
Coarse Resolution ◽  
Defect Localization ◽  
Pcb Manufacturing

Satu daripada asas utama dalam industri pembuatan elektronik ialah pembuatan papan litar bercetak (PCB). Pembuatan PCB pada masa kini perlu melalui proses kikisan. Ini adalah proses satu hala. Proses cetakan yang dilakukan sebelum proses kikisan adalah penyebab utama kepada kecacatan pada PCB. Setelah PCB dikikis, kecacatan itu, jika ada menyebabkan PCB menjadi tidak berguna lagi. Disebabkan oleh keletihan dan keperluan kecepatan, pemeriksaan secara manual tidak efektif dilakukan untuk memeriksa setiap PCB. Oleh itu, pengilang memerlukan sebuah sistem automatik untuk mengesan kecacatan secara masa nyata yang mungkin berlaku semasa proses percetakan. Kecacatan itu akan dikesan dengan menggunakan algoritma pembezaan imej berasaskan wavelet. Seterusnya, kertas kerja ini mencadangkan satu algoritma untuk pemeriksaan visual PCB secara automatik yang berupaya mengesan dan menyari kecacatan pada PCB. Algoritma ini dijalankan pada resolusi kasar pembezaan imej bertujuan untuk mengesan kawasan kecacatan pada resolusi halus imej PCB yang di periksa. Kata kunci: pengesanan kecacatan; resolusi kasar; wavelets; pemeriksaan PCB One of the backbones in electronic manufacturing industry is the printed circuit board (PCB) manufacturing. Current practice in PCB manufacturing requires an etching process. This process is an irreversible process. Printing process, which is done before the etching process, caused most of the destructive defects found on the PCB. Once the laminate is etched, the defects, if exist would cause the PCB laminate to become useless. Due to the fatigue and speed requirement, manual inspection is ineffective to inspect every printed laminate. Therefore, manufacturers require an automated system to detect the defects online which may occur during the printing process. The defect is detected by utilizing wavelet-based image difference algorithm. Hence, this paper proposes an algorithm for an automated visual PCB inspection that is able to automatically locate and extract any defect on a PCB laminate. The algorithm works on the coarse resolution differenced image in order to locate the defective area on the fine resolution tested PCB image. Key words: defect localization; coarse resolution; wavelets; PCB inspection

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Denglin Fu ◽  
Yanan Wen ◽  
Jida Chen ◽  
Lansi Lu ◽  
Ting Yan ◽  
...  
Keyword(s):  
Corrosion Inhibitor ◽  
Corrosion Inhibitors ◽  
Printed Circuit Board ◽  
Copper Surface ◽  
Etching Process ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Etching Method ◽  
Electrolytic Etching

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

scholarly journals Affordable Thin Lens Using Single Polarized Disparate Filter Arrays for Beyond 5G toward 6G

Sensors ◽  
2019 ◽  
Vol 19 (18) ◽  
pp. 3982
Author(s):  
Inseop Yoon ◽  
Seongwoog Oh ◽  
Jungsuek Oh
Keyword(s):  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Design Procedure ◽  
Circuit Board ◽  
Process Conditions ◽  
60 Ghz ◽  
Thin Lens ◽  
Gain Enhancement ◽  
Unit Cells ◽  
Pcb Manufacturing

This paper proposes a novel design approach for a thin lens with the aim of overcoming fineness limits in the commercial millimeter wave printed circuit board (PCB) manufacturing process. The PCB manufacturing process typically does not allow the fabrication of metallic patterns with a gap and width of less than 100 μm. This hampers expanding thin lens technology to 5G commercial applications, especially when such technology is considered for 60 GHz or higher frequency, which requires a finer gap and width of metallic traces. This paper proposes that problematic process conditions can be mitigated when a lens is designed by establishing single-polarized lumped element models where larger capacitance and inductance values can be obtained for the same patch and grid unit cells. While the proposed design technique is more advantageous at higher target frequencies, a 60 GHz application and a wireless backhaul system is selected because of a limited range of frequencies that can be measured by an available vector network analyzer. The required gap or width of metallic traces can be widened significantly by using the proposed single-polarized unit cells to acquire the same in-plane capacitance or inductance. This enables the lens operating at higher-frequency under the process limits in fabricable fine traces. Finally, the effectiveness of the simulated design procedure is demonstrated by fabricating a 60 GHz thin lens that can achieve a gain enhancement of 16 dB for a 4 × 4 patch antenna array with a gain of 16.5 dBi.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals A Case Study: Implementation of Automated Guided Vehicle Replacing Trollies Transportation in Manufacturing Industry to reduce Motion Waste in Lean Manufacturing practicing factory

2020 ◽  
Vol 5 (1) ◽  
pp. 1-7
Author(s):  
Shamini Janasekaran ◽  
◽  
Eshvinder Singh Mann ◽  
Keyword(s):  
Lean Manufacturing ◽  
Human Error ◽  
Manufacturing Industry ◽  
Industrial Revolution ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Added Value ◽  
Automated Guided Vehicle ◽  
Pcb Assembly ◽  
Study Implementation

This research introduces and demonstrates the procedures and method used to eliminate waste of motion to achieve lean manufacturing which is the starting for Industrial Revolution 4.0. This was conducted in a private manufacturing factory that assembles printed circuit board (PCB). The research done provides an advantage by developing an efficient and effective way to carry out the transportation of PCB magazine trolley. The data collected and results obtained proved the benefits of the utilization of automated guided vehicle. In contrast, result attained for time reduction of transportation of PCB magazine trollies was in the range of 3.39% to 8.08%. Moreover, autonomous guided vehicles also verified the capability to eliminate the occurrence of human error and non-added value activities. In conclusion, the research carried showed a successful method towards optimization of the production in the selected PCB assembly manufacturing company.

scholarly journals Case Study: An Improvement of Inspection Approach of Printed Multilayer Circuit Products Related to Visual Based Inspection Technique

2020 ◽  
Vol 16 (2) ◽  
pp. 1-34
Author(s):  
Yap Wan Yee ◽  
Mohammad Nishat Akhtar ◽  
Elmi Abu Bakar
Keyword(s):  
Product Quality ◽  
Manufacturing Industry ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Inspection Time ◽  
Productivity Analysis ◽  
Flow Process ◽  
Inspection Method ◽  
Inspection Process ◽  
Flexible Printed Circuit

Product quality is an important issue in all manufacturing industry nowadays to meet the customers’ requirement. In this regard, most of the factory has a special department namely Quality Control (QC) Department which control the product quality. The studied factory is a flexible printed circuit board manufacturer which is located in Bayan Lepas, Pulau Pinang, Malaysia. QC Department of the studied factory has high amount of work-in-progress (WIP). Therefore, the products have to be sent out to subcontractors for quality inspection. However, this method is not economically effective. Hence, the objective of this study was to develop an improved inspection method which will reduce the overall inspection time of the current inspection method (CIM). By reducing the inspection time, productivity of the department will increase and subsequently reduce the amount of WIP. This study is focused on the improvement of one product only. Before the improved inspection method (IIM) of the selected product was developed, performance of the CIM was evaluated by using one of the graphical productivity analysis charting techniques which is flow process chart. It was found that the IIM was able to reduce the inspection time of whole inspection process by 85.06 sec for every 12 panels inspected.

Machine Vision-Aided Quality Decision System for Solder Joint Defect Evaluation

2012 ◽  
Vol 268-270 ◽  
pp. 1393-1397
Author(s):  
Chien Chih Wang
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Inspection System ◽  
Defect Classification ◽  
Decision System ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Joint Quality ◽  
Quality Decision

To improve the printed circuit board (PCB) manufacturing process, it is important to have an automatic inspection system that classifies information regarding defects in solder joints. This paper proposes a quality decision system for solder joint defect classification on a PCB. An experiment was conducted to demonstrate the application of the system. The results showed that the inspection accuracy reached 94%, which is superior to the results achieved by other methods. The results of this study provide an effective solution for the inspection of the solder joint quality.

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