scholarly journals A Case Study: Implementation of Automated Guided Vehicle Replacing Trollies Transportation in Manufacturing Industry to reduce Motion Waste in Lean Manufacturing practicing factory

2020 ◽  
Vol 5 (1) ◽  
pp. 1-7
Author(s):  
Shamini Janasekaran ◽  
◽  
Eshvinder Singh Mann ◽  
Keyword(s):  
Lean Manufacturing ◽  
Human Error ◽  
Manufacturing Industry ◽  
Industrial Revolution ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Added Value ◽  
Automated Guided Vehicle ◽  
Pcb Assembly ◽  
Study Implementation

This research introduces and demonstrates the procedures and method used to eliminate waste of motion to achieve lean manufacturing which is the starting for Industrial Revolution 4.0. This was conducted in a private manufacturing factory that assembles printed circuit board (PCB). The research done provides an advantage by developing an efficient and effective way to carry out the transportation of PCB magazine trolley. The data collected and results obtained proved the benefits of the utilization of automated guided vehicle. In contrast, result attained for time reduction of transportation of PCB magazine trollies was in the range of 3.39% to 8.08%. Moreover, autonomous guided vehicles also verified the capability to eliminate the occurrence of human error and non-added value activities. In conclusion, the research carried showed a successful method towards optimization of the production in the selected PCB assembly manufacturing company.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

Entrepreneurship and Technopreneurship in Era 4.0

2021 ◽  
pp. 624-639
Author(s):  
Mufrida Zein ◽  
Muhammad Ghalih ◽  
Rina Pebriana
Keyword(s):  
Digital Technology ◽  
Input Data ◽  
Human Error ◽  
Manufacturing Industry ◽  
Industrial Revolution ◽  
Digital Systems ◽  
Micro Manufacturing ◽  
Analytical Work

This chapter discussed that the combination of entrepreneurship and technopreneurship is a crucial factor in the long-term sustainability of e-commerce and e-businesses. The Industrial Revolution 4.0 produced very rapidly, disruption, and exponential changes. The development of digital technology will change and displace traditional industries. Not only traditional industries but also various repetitive jobs such as cashiers, admins, or small and micro-manufacturing industry workers sooner or later will be replaced by machines or automation robots. Even professions and analytical work such as tax consultant, accountant, or translator will be carried out by digital systems that will process input data more quickly, accurately without human error, and precision according to principles. One of the professions that is believed to continue to develop and will continue to exist is technopreneurship that is primarily supported by the increasing number of forms of technology-based entrepreneurship, such GO-JEK.

Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000034-000038 ◽  
Author(s):  
Piers Tremlett ◽  
Phil Elliot ◽  
Pablo Tena
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Real Life ◽  
Circuit Board ◽  
Calibration Data ◽  
Engine Fuel ◽  
Sensors And Actuators ◽  
Pcb Assembly ◽  
Operational Life ◽  
Mems Technology

Printed circuit board (PCB) assemblies must fit into unusual spaces for many real-life, high temperature applications such as sensors and actuators. This paper details the design and manufacture of a complex control circuit for a jet engine fuel flow valve. “Origami” was needed to fit this control circuitry into the tight space in the valve, this was achieved using a high temperature flex rigid PCB assembly. The valve was mounted on a hot section of the engine, and the assembly was tested for its capability to operate at 178°C and withstand multiple thermal cycles of −55°C and 175°C during its operational life. Various component joining media were investigated to extend the life of the assembly. The project also developed a one-time programmable (OTP) memory aimed at up to 300°C operation for on board memory to provide calibration data or boot memory for high temperature microcontrollers or processors. The device was based on Micro-Electro-Mechanical Systems (MEMS) technology.

Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000818-000824
Author(s):  
John Torok ◽  
Shawn Canfield ◽  
Yuet-Ying Yu ◽  
Jiantao Zheng
Keyword(s):  
Form Factor ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Circuit Board ◽  
Bottom Surface ◽  
Mechanical Shock ◽  
Analysis And Evaluation ◽  
Pcb Assembly

Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package multiple modules on a single printed circuit board (PCB) assembly, PCB cross-sections and their corresponding physical properties (e.g., flatness, etc.) as well as module bottom surface metallurgy (BSM) co-planarity require a more detailed understanding of impacts to the compliant as well as the soldered connector interfaces. Lastly, the migration to lead (Pb)-free solders has further complicated the issue given both the change in material properties as well as processing temperatures. In this paper we will discuss the mechanical stress analysis and evaluation tests assessment of a recently developed 50 mm square organic processor module, hybrid LGA attached to a multiple site PCB. The analysis presented will highlight the methodology to identify both connector soldered stress and predicted contact load variation across the module's mated interface. Key parameters discuss will include the PCB flatness, Organic substrate BSM co-planarity (both predicted and measured) and the Hybrid LGA as-soldered contact co-planarity. Corroborating predicted analytical results, we will discuss various evaluation tests performed to validate the design's integrity. Key tests include, pressure sensitive film (PSF) studies and environment stress exposures, including thermal shock, mechanical shock and vibration and seismic exposure. Post test electrical integrity and test sample construction analysis, including 3D x-ray and mechanical cross-section, will also be described. The analysis process and testing described will provide a method to evaluate more challenging hybrid LGA applications as both module sizes and/or number applied per PCB assembly increase and Pb-free assembly is introduced in future applications.

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

A Computable Model for PCB Assembly Optimization Based on Polychromatic Sets

2013 ◽  
Vol 470 ◽  
pp. 173-176
Author(s):  
Xuan Du ◽  
Gang Yu
Keyword(s):  
Printed Circuit Board ◽  
Resource Constraints ◽  
Optimization Problems ◽  
Circuit Board ◽  
Computable Model ◽  
Model Framework ◽  
Pcb Assembly ◽  
Modeling Methodology ◽  
Machine Failure ◽  
Order Change

A modeling methodology is presented for printed circuit board(PCB) assembly optimization based on polychromatic sets(PS) theory. A computable model framework with hierarchical structure includes three layers, which are set layer(SL), logic layer(LL) and numerical layer(NL). Based on the hierarchical model and the mapping relationship among each layer, a computable model is formulated to describe the PCB assembly optimization problem in multiple PCB assembly tasks and multiple machines. The computable model not only involves various computation parameters, complicate constraint relationships such as process constraints, resource constraints and so on in PCB assembly optimization, but also describes the shortage of component, machine failure, order change and other uncertain factors. The optimization problems of PCB assembly in low-volume environment and multiple tasks can be solved efficiently.

Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm

1993 ◽  
Vol 115 (4) ◽  
pp. 424-432 ◽  
Author(s):  
M. C. Leu ◽  
H. Wong ◽  
Z. Ji
Keyword(s):  
Genetic Algorithm ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Assembly Planning ◽  
Genetic Operators ◽  
Printed Circuit Board Assembly ◽  
Component Placement ◽  
Pcb Assembly ◽  
Circuit Board Assembly ◽  
Genetic Algorithm Approach

A new application of the genetic algorithm approach is introduced to solve printed circuit board assembly planning problems. The developed genetic algorithm finds the sequence of component placement/insertion and the arrangement of feeders simultaneously, for achieving the shortest assembly time, for three main types of assembly machines. The algorithm uses links (parents) to represent possible solutions and it applies genetic operators to generate new links (offspring) in an iterative procedure to obtain nearly optimal solutions. Examples are provided to illustrate solutions generated by the algorithm.

Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: Case Study

2005 ◽  
Author(s):  
Frank Toth ◽  
Gary F. Shade
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Circuit Board ◽  
Lead Free ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
New Process ◽  
Solder Pastes

Abstract Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.

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