Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

EFFECT OF HEAT SPREADING ON THE PERFORMANCE OF HEAT SINK VIA VAPOR CHAMBER

Equipment ◽  
2006 ◽  
Author(s):  
Y. S. Chen ◽  
K. H. Chien ◽  
T. C. Hung ◽  
B. S Pei ◽  
C. C. Wang
Keyword(s):  
Heat Sink ◽  
Vapor Chamber ◽  
Heat Spreading

Micro Channel Vapor Chamber for high heat Spreading

2008 ◽  
Author(s):  
Yasuhiro Horiuchi ◽  
Masataka Mochizuki ◽  
Koichi Mashiko ◽  
Yuji Saito ◽  
Fumitoshi Kiyooka ◽  
...  
Keyword(s):  
High Heat ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Heat Spreading

Heat Transfer Characteristic of Meshed Vapor Chamber

2009 ◽  
Author(s):  
Dong-chuan Mo ◽  
Shu-shen Lu
Keyword(s):  
Heat Transfer ◽  
Transfer Characteristic ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Heated Zone ◽  
Evaporation Heat ◽  
Heat Spreading ◽  
Potential Opportunity

Focus on solving the increasing heat fluxes in the electronic industry, vapor chamber shows its excellent characteristic as an effective heat spreading device. A serial of vapor chambers made of copper-water and using mesh as the wick material had been manufactured in this paper. The dimension of the vapor chambers are all 95mm*70mm*3.2mm. A remote method was used to test the performance of the vapor chambers, where the property of evaporation and vapor transportation will be mainly studied. Results show that the adiabatic resistance (vapor transportation) can be less than 0.05°C/W at high heat flux, which means the temperature is almost uniform on the top wall of the vapor chamber. The evaporation heat transfer coefficient could be higher than 20000W/m2K. But compared with the small size of heated zone, the evaporation thermal resistant might be still the largest one in the vapor chambers. The orientations have no obviously effect on the performance of the vapor chamber. As the vapor chamber is small, the gravity effect is not obvious here. The flatness of the mesh may become worse during the operation. To solve this problem, at least two ways can be performed. One is to use some support to keep the mesh attached closed to the wall, and the other is to use the diffusion banding. Finally, we use the experiment data to estimate the thermal resistance of vapor chamber as a heat sink base, and compare with the solid copper to see the potential opportunity to use the vapor chamber.

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Xiaoling Yu ◽  
Lianghua Zhang ◽  
Enming Zhou ◽  
Quanke Feng
Keyword(s):  
Experimental Data ◽  
Heat Load ◽  
Thermal Modeling ◽  
Copper Plate ◽  
Vapor Chamber ◽  
Transient Time ◽  
Thermal Circuit ◽  
Igbt Modules ◽  
Igbt Module ◽  
Heat Spreading

Presently, many methods are adopted to reduce the junction-to-case thermal resistance (Rjc) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading capability of the base plate (heat spreader) of an IGBT module using a vapor chamber (VC). In this paper, both experimental measurement and thermal modeling are conducted on a VC-based IGBT module and two copper-plate-based IGBT modules. The experimental data show that Rjc of the VC-based IGBT module decreases substantially with the increase in the heat load of the IGBT. Rjc of the VC-based IGBT module is ∼50% of that of the 3 mm copper-plate-based IGBT module after it saturates at a heat load level of ∼200 W. The transient time of the VC-based IGBT module is also shorter than the copper-plate-based IGBT modules since the VC has higher heat spreading capability. The quicker responses of the VC-based IGBT module to reach its saturated temperature during the start-up can avoid a possible power surge. In the thermal modeling, the vapor is substituted as a solid conductor with extremely high thermal conductivity. Hence, the two-phase flow thermal modeling of the VC is simplified as a one-phase thermal conductive modeling. A thermal circuit model is also built for the VC-based IGBT module. Both the thermal modeling and thermal circuit results match well with the experimental data.

Investigation of Two-Phase, Vapor Chamber Based Thermal Management of Multiple Microserver Chips

2014 ◽  
Author(s):  
Mohammad Parhizi ◽  
Ali Akbar Merrikh ◽  
Ankur Jain
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Hot Spot ◽  
Semiconductor Industry ◽  
Single Chip ◽  
Vapor Chamber ◽  
Two Phase ◽  
Lower Power ◽  
The Impact ◽  
Heat Spreading

Thermal management of microserver chips is of much interest to the semiconductor industry due to the significant performance benefits associated with heat spreading, resulting in very effective hot spot cooling in active cooling environments. This paper investigates thermal management of a multi-chip microserver module using two-phase heat transfer in a vapor chamber. A simulation model capturing two-phase flow of H2O in a vapor chamber was developed for understanding the effect of various parameters on thermal performance of the vapor chamber. The performance of a single high power chip is compared with a system of multiple lower power chips. Emphasis is on the impact of using multiple lower power chips instead of a single high power chip on the heat spreading capability of a flat, thin, vapor chamber. Also, it is shown that using a system of multiple low power chips, provides designers with the opportunity for designing vapor chamber with same functionality as single chip but reduced mass. Results highlight the challenges and opportunities involved in such an approach. The results shown in this paper will be useful for the design of two-phase cooling for microserver chips.

A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

2005 ◽  
Vol 128 (4) ◽  
pp. 427-431 ◽  
Author(s):  
Minhua Lu ◽  
Larry Mok ◽  
R. J. Bezama
Keyword(s):  
Thermal Conductivity ◽  
Oxygen Plasma ◽  
High Thermal Conductivity ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Capillary Limit ◽  
Wick Structure ◽  
Overall Performance ◽  
Heat Spreading ◽  
Graphite Foam

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80W∕cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

2017 ◽  
Author(s):  
Anand K. Patel ◽  
Weihuan Zhao
Keyword(s):  
Heat Transfer ◽  
Power Electronics ◽  
Electric Vehicles ◽  
Heat Transfer Performance ◽  
Heat Removal ◽  
Junction Temperature ◽  
Vapor Chamber ◽  
Heat Spreader ◽  
Heat Spreading ◽  
Graphite Foam

The power density of power electronics in electric vehicles (EVs) is expected to be significantly enhanced, which would result in higher heat flux generation. Therefore, it is critical to find an efficient heat spreading and removal technology to reduce the junction temperature for high power density power electronics application. Vapor chamber using evaporation and condensation of the inside working fluid (i.e., water) as a heat spreader can remarkably improve the uniform heat spreading and heat removal for the power electronics compared to the traditional copper heat spreader. Furthermore, high thermal conductivity graphite foam (GF) would be embedded in the vapor core of the vapor chamber to further enhance the heat transfer performance. Numerical heat transfer simulations were performed for copper heat spreader, vapor chambers (with and without the presence of graphite foam) by using ANSYS. Various parametric effects on vapor chamber thermal performance were investigated, including the effects of heat flux from power electronics, heat transfer coefficient at heat sink, vapor chamber thickness, and graphite foam. Through the simulation studies, it was found that thinner vapor chamber (1.35 mm thickness) had better heat transfer performance than thicker vapor chamber (5 mm thickness) because of the extreme high effective thermal conductivities of ultra-thin vapor chamber. Furthermore, the effect of graphite foam on thermal performance improvement was very minor for ultra-thin vapor chamber, but significant for thick vapor chamber. The GF could help reduce the junction temperature by 15–30% in the 5-mm thick vapor chamber. Use of GF embedded vapor chamber could achieve 250–400 W/cm2 local heat removal for power electronics.

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

2007 ◽  
Author(s):  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Fumitoshi Kiyooka ◽  
Thang Nguyen ◽  
Tien Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Metal Plate ◽  
Working Fluid ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Processor Performance ◽  
Heat Spreading

After the introduction of Pentium™ processor in 1993, the trend of the processor performance and power consumption have been increased significantly each year. Heat dissipation has been increased but in contrast the size of die on the processor has been reduced or remained the same size due to nano-size circuit technology and thus the heat flux is critically high. The heat flux was about 10–15 W/cm2 in the year 2000 and had reached 100 W/cm2 in 2006. The processor’s die surface where the heat is generated is usually small, approximately 1 cm2. For effective cooling should required least temperature gradient between the heat source and radiating components. The best known devices for effective heat transfer or heat spreading with lowest thermal resistance is heat pipe and vapor chamber. Basically, heat pipe and vapor chamber are an evacuated and sealed container which contains a small quantity of working fluid which is water. When one side of the container is heated, causing the liquid to vaporize and the vapor to move to the cold side and condensed. Since the latent heat of evaporation is large, considerable quantities of heat can be transported with a very small temperature difference from end to end. The 2-phase heat transfer device has excellent heat spreading and heat transfer characteristics, is the key element in thermal management challenge of ever power-increasing processors. In this paper, authors presented case designs using vapor chamber for cooling computer processors. Proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader. Also included in the paper are ideas and data that showed performance improvement of heat spreading devices.

Sign in / Sign up

Export Citation Format

Share Document