Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics

2012 ◽  
Vol 4 (2) ◽  
Author(s):  
J. H. Choi ◽  
B. H. Sung ◽  
J. H. Yoo ◽  
C. J. Kim ◽  
D.-A. Borca-Tasciuc
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Power Density ◽  
Thermal Performance ◽  
High Power ◽  
Design Stage ◽  
Working Fluid ◽  
High Power Density ◽  
Graphic Processing Units ◽  
Maximum Heat

The implementation of high power density, multicore central and graphic processing units (CPUs and GPUs) coupled with higher clock rates of the high-end computing hardware requires enhanced cooling technologies able to attend high heat fluxes while meeting strict design constrains associated with system volume and weight. Miniature loop heat pipes (mLHP) emerge as one of the technologies best suited to meet all these demands. Nonetheless, operational problems, such as instable behavior during startup on evaporator side, have stunted the advent of commercialization. This paper investigates experimentally two types of mLHP systems designed for workstation CPUs employing disk shaped and rectangular evaporators, respectively. Since there is a strong demand for miniaturization in commercial applications, emphasis was also placed on physical size during the design stage of the new systems. One of the mLHP system investigated here is demonstrated to have an increased thermal performance at a reduced system weight. Specifically, it is shown that the system can reach a maximum heat transfer rate of 170 W with an overall thermal resistance of 0.12 K/W. The corresponding heat flux is 18.9 W/cm2, approximately 30% higher than that of larger size commercial systems. The studies carried out here also suggest that decreasing the thermal resistance between the heat source and the working fluid and maximizing the area for heat transfer are keys for obtaining an enhanced thermal performance.

An Experimental Investigation of the Miniature Loop Heat Pipe Cooling Systems for High Power Density Computer Chips

2011 ◽  
Author(s):  
Jeehoon Choi ◽  
Junghyun Yoo ◽  
Byungho Sung ◽  
Chulju Kim ◽  
Diana-Andra Borca-Tasciuc
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Power Density ◽  
High Power ◽  
Design Stage ◽  
Loop Heat Pipe ◽  
High Power Density ◽  
Graphic Processing Units ◽  
Maximum Heat ◽  
Maximum Heat Transfer

The implementation of high power density, multi-core central and graphic processing units (CPUs and GPUs) coupled with higher clock rates of the high-end computing hardware requires enhanced cooling technologies able to attend high heat fluxes while meeting strict design constrains associated with system volume and weight. Miniature loop heat pipe (mLHP) systems emerge as one of the technologies best suited to meet all these demands. This paper investigates experimentally a mLHP system designed for workstation CPUs. The system incorporates a two-phase flow loop with capillary driving force. Since there is a strong demand for miniaturization in commercial applications, emphasize was also placed on physical size during the design stage of the new system. Hence system weight is reduced to around 450g, significantly smaller than that of commercial coolers consisting of copper heat sinks that weight around 782g. Experimental characterization shows that the system can reach a maximum heat transfer rate of 170W with an overall thermal resistance of 0.12 K/W. The heat flux is 18.9 W/cm2, approximately 30% higher than that of larger size commercial systems. To further miniaturize the evaporator module while maintaining the same heat flux, a new structure for the porous evaporator is proposed, which consist of a porous bi-layer, with nanopores at the top surface. The role of the nanoporous layer is to provide a larger surface area for phase-change, enhancing the evaporation rate.

Transient Heat Transfer in Microscale Porous Materials Heated by Microsecond Laser Pulse of High Power Density

2002 ◽  
Author(s):  
Fangming Jiang ◽  
Dengying Liu ◽  
Jim S.-J. Chen ◽  
Richard S. Cohen
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Laser Pulse ◽  
Power Density ◽  
High Power ◽  
Hyperbolic Model ◽  
Transient Temperature ◽  
Hyperbolic Heat Conduction ◽  
High Power Density ◽  
High Heat Transfer

A novel experimental method was developed to measure the rapid transient temperature variations (heating rate > 107 K/s) of porous samples heated by high surface heat fluxes. With a thin film (0.1 μm thick) resistance thermometer of platinum as the temperature sensor and a super-high speed digital oscilloscope (up to 100 MHz) as the data recorder, rapid transient temperature variation in a porous material heated by a microsecond laser pulse of high power density is measured. Experimental results indicate that for high heat transfer cases (q′ > 109 W/m2) with short durations (5 – 20 μs) of heating, non-Fourier heat conduction behaviors appear. The non-Fourier hyperbolic heat conduction model and the traditional Fourier parabolic model are employed to simulate this thermal case respectively and the FDM is used to perform the numerical analysis. The hyperbolic model predicts thermal wave behavior in qualitative agreement with the experimental data.

Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density

2013 ◽  
Vol 303-306 ◽  
pp. 1902-1907 ◽  
Author(s):  
Yi Bo Wu ◽  
Guo You Liu ◽  
Ning Hua Xu ◽  
Ze Chun Dou
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
High Power ◽  
Resistance Management ◽  
Equivalent Circuit Model ◽  
Element Model ◽  
Equivalent Model ◽  
High Power Density ◽  
Power Module ◽  
Igbt Module

As the IGBT power modules have promising potentials in the application of the field of traction or new energy, the higher power density and higher current rating of the IGBT module become more and more attractive. Thermal resistance is one of the most important characteristics in the application of power semiconductor module. A new 1500A/3300V IGBT module in traction application is developed successfully by Zhuzhou CSR Times Electric Co., Ltd (Lincoln). Thermal resistance management of this IGBT module with high power density is performed in this paper. Based on thermal nodes network, an equivalent circuit model for thermal resistance of power module is highlighted from which the steady state thermal resistance can be optimized by theoretical analysis. Furthermore, thermal numerical simulation of 1500A/3300V IGBT module is accomplished by means of finite element model (FEM). Finally, the thermal equivalent model of the IGBT module is verified by simulation results.

Optimization of Wettability Gradient for Enhancement of Thermal Performance of Micro Heat Pipes

2018 ◽  
Author(s):  
Manjinder Singh ◽  
Naresh Varma Datla ◽  
Supreet Singh Bahga ◽  
Sasidhar Kondaraju
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Variable Mass ◽  
Working Fluid ◽  
Maximum Heat ◽  
Continuous Increase ◽  
Maximum Heat Transfer ◽  
Integration Density ◽  
Heat Transfer Capacity ◽  
Micro Heat Pipes

Continuous increase in the integration density of microelectronic units necessitates the use of MHPs with enhanced thermal performance. Recently, the use of wettability gradients have been shown to enhance the heat transfer capacity of MHPs. In this paper, we present an optimization of axial wettability gradient to maximize the heat transfer capacity of the MHP. We use an experimentally validated mathematical model and interior point method to optimize the wettability gradient. For our analysis, we consider two cases wherein (i) the mass of working fluid is constrained, (ii) mass of working fluid is a design variable. Compared to MHP with uniform high wettability and filled with a fixed mass of working fluid, optimization of the wettability gradient leads to 65% enhancement in heat transfer capacity. Similar comparisons for MHP filled with variable mass of working fluid shows more than 90% increase in the maximum heat transfer capacity due to optimization of wettability gradient.

scholarly journals Thermal performance prediction of heat pipe with TiO2 nanofluids using RSM

2021 ◽  
pp. 199-199
Author(s):  
Lakshmi Reddy ◽  
Srinivasa Bayyapureddy Reddy ◽  
Kakumani Govindarajulu
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Thermal Resistance ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Tilt Angle ◽  
Heat Load ◽  
Maximum Heat ◽  
Maximum Heat Transfer

Heat pipe is a two phase heat transfer device with high effective thermal conductivity and transfer huge amount of heat with minimum temperature gradient in between evaporator and condenser section. This paper objective is to predict the thermal performance in terms of thermal resistance (R) and heat transfer coefficient (h) of screen mesh wick heat pipe with DI water-TiO2 as working fluid. The input process parameters of heat pipe such as heat load (Q), tilt angle (?) and concentration of nanofluid (?) were modeled and optimized by utilizing Response Surface Methodology (RSM) with MiniTab-17 software to attain minimum thermal resistance and maximum heat transfer coefficient. The minimum thermal resistance of 0.1764 0C/W and maximum heat transfer coefficient of 1411.52 W/m2 0C was obtained under the optimized conditions of 200 W heat load, 57.20 tilt angle and 0.159 vol. % concentration of nano-fluid.

Numerical Simulation of Heat Transfer and Fluid Flow of a Flat-Tube High Power Density Solid Oxide Fuel Cell

2004 ◽  
Vol 2 (1) ◽  
pp. 65-69 ◽  
Author(s):  
Yixin Lu ◽  
Laura Schaefer ◽  
Peiwen Li
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Fuel Cell ◽  
Solid Oxide Fuel Cell ◽  
Power Density ◽  
High Power ◽  
Solid Oxide ◽  
High Power Density ◽  
Oxide Fuel ◽  
Flat Tube

To both increase the power density of a tubular solid oxide fuel cell (SOFC) and maintain its beneficial feature of secure sealing, a flat-tube high power density (HPD) solid oxide fuel cell is under development by Siemens Westinghouse, based on their formerly developed tubular model. In this paper, a three dimensional numerical model to simulate the steady state heat transfer and fluid flow of a flat-tube HPD–SOFC is developed. A computer code is programmed using the FORTRAN language to solve the governing equations for continuity, momentum, and energy conservation. The highly coupled temperature and flow fields of the air stream and the fuel stream inside and outside a typical channel of a one-rib flat-tube HPD–SOFC are investigated. This heat transfer and fluid flow results will be used to simulate the overall performance of a flat-tube HPD–SOFC in the near future, and to help optimize the design and operation of a SOFC stack in practical applications.

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