Longitudinal-Fin Heat Sink Optimization Capturing Conjugate Effects Under Fully Developed Conditions

2016 ◽  
Vol 8 (4) ◽  
Author(s):  
Georgios Karamanis ◽  
Marc Hodes
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Transfer Problem ◽  
Optimization Method ◽  
Conjugate Problem ◽  
Temperature Fields ◽  
Microchannel Cooling ◽  
Fin Thickness

We develop a method requiring minimal computations to optimize the fin thickness and spacing in a fully shrouded longitudinal-fin heat sink (LFHS) to minimize its thermal resistance under conditions of hydrodynamically and thermally developed laminar flow. Prescribed quantities are the density, viscosity, thermal conductivity and specific heat capacity of the fluid, the thermal conductivity and height of the fins, the width and length of the heat sink, and the pressure drop across it. Alternatively, the length of the heat sink may be optimized as well. The shroud of the heat sink is assumed to be adiabatic and its base isothermal. Our results are relevant to, e.g., microchannel cooling applications where base isothermality can be achieved by using a heat spreader or a vapor chamber. The present study is distinct from the previous work because it does not assume a uniform heat transfer coefficient, but fully captures the velocity and temperature fields by numerically solving the conjugate heat transfer problem in dimensionless form using an existing approach. We develop a dimensionless formulation and compute a dense tabulation of the relevant parameters that allows the thermal resistance to be calculated algebraically over a relevant range of dimensionless parameters. Hence, the optimization method does not require the time-consuming solution of the conjugate problem. Once the optimal dimensionless fin thickness and spacing are obtained, their dimensional counterparts are computed algebraically. The optimization method is illustrated in the context of direct liquid cooling.

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

2015 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Specific Heat ◽  
Thermal Management ◽  
Heat Sink ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Pumping Power

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.

Method of Lines to Solve 2-D Steady Temperature Field of FGM

2007 ◽  
Vol 353-358 ◽  
pp. 2003-2006 ◽  
Author(s):  
Wei Tan ◽  
Chang Qing Sun ◽  
Chun Fang Xue ◽  
Yao Dai
Keyword(s):  
Thermal Conductivity ◽  
Temperature Field ◽  
Transfer Problem ◽  
Method Of Lines ◽  
Main Idea ◽  
Functionally Graded ◽  
Temperature Fields ◽  
Steady Temperature ◽  
Thermal Transfer ◽  
Steady Temperature Field

Method of Lines (MOLs) is introduced to solve 2-Dimension steady temperature field of functionally graded materials (FGMs). The main idea of the method is to semi–discretized the governing equation of thermal transfer problem into a system of ordinary differential equations (ODEs) defined on discrete lines by means of the finite difference method. The temperature field of FGM can be obtained by solving the ODEs with functions of thermal properties. As numerical examples, six kinds of material thermal conductivity functions, i.e. three kinds of polynomial functions, an exponent function, a logarithmic function, and a sine function are selected to simulate spatial thermal conductivity profile in FGMs respectively. The steady-state temperature fields of 2-D thermal transfer problem are analyzed by the MOLs. Numerical results show that different material thermal conductivity function has obvious different effect on the temperature field.

scholarly journals The inverse coefficient problem of heat transfer in layered nanostructures

2017 ◽  
Vol 20 (3) ◽  
pp. 213-219
Author(s):  
K. K. Abgarian ◽  
R. G. Noskov ◽  
D. L. Reviznikov
Keyword(s):  
Heat Transfer ◽  
Inverse Problem ◽  
Thermal Resistance ◽  
Transfer Problem ◽  
Dominant Role ◽  
Rapid Development ◽  
Problem Solution ◽  
Microwave Range ◽  
Contact Thermal Resistance ◽  
Resistance Coefficients

The rapid development of electronics leads to the creation and use of electronic components of small dimensions, including nanoelements of complex, layered structure. The search for effective methods for cooling electronic systems dictates the need for the development of methods for the numerical analysis of heat transfer in nanostructures. A characteristic feature of energy transfer in such systems is the dominant role of contact thermal resistance at interlayer interfaces. Since the contact resistance depends on a number of factors associated with the technology of heterostructures manufacturing, it is of great importance to determine the corresponding coefficients from the results of temperature measurements.The purpose of this paper is to evaluate the possibility of reconstructing the thermal resistance coefficients at the interfaces between layers by solving the inverse problem of heat transfer.The complex of algorithms includes two major blocks — a block for solving the direct heat transfer problem in a layered nanostructure and an optimization block for solving the inverse problem. The direct problem was formulated in an algebraic (finite difference) form under the assumption of a constant temperature within each layer, which is due to the small thickness of the layers. The inverse problem was solved in the extreme formulation, the optimization was carried out using zero-order methods that do not require the calculation of the derivatives of the optimized function. As a basic optimization algorithm, the Nelder—Mead method was used in combination with random restarts to search for a global minimum.The results of the identification of the contact thermal resistance coefficients obtained in the framework of a quasi-real experiment are presented. The accuracy of the identification problem solution is estimated as a function of the number of layers in the heterostructure and the «measurements» error.The obtained results are planned to be used in the new technique of multiscale modeling of thermal regimes of the electronic component base of the microwave range, when identifying the coefficients of thermal conductivity of heterostructure.

scholarly journals The Influence of Burial Depth and Soil Thermal Conductivity on Heat Transfer in Buried CO2 Pipelines for CCS: A Parametric Study

2020 ◽  
Author(s):  
Babafemi Olugunwa ◽  
Julia Race ◽  
Tahsin Tezdogan
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Steady State ◽  
Thermal Resistance ◽  
Parametric Study ◽  
Flow Assurance ◽  
Burial Depth ◽  
Soil Thermal Conductivity ◽  
Dense Phase ◽  
Pipeline Transportation

Abstract Pipeline heat transfer modelling of buried pipelines is integral to the design and operation of onshore pipelines to aid the reduction of flow assurance challenges such as carbon dioxide (CO2) gas hydrate formation during pipeline transportation of dense phase CO2 in carbon capture and storage (CCS) applications. In CO2 pipelines for CCS, there are still challenges and gaps in knowledge in the pipeline transportation of supercritical CO2 due to its unique thermophysical properties as a single, dense phase liquid above its critical point. Although the design and operation of pipelines for bulk fluid transport is well established, the design stage is incomplete without the heat transfer calculations as part of the steady state hydraulic and flow assurance design stages. This paper investigates the steady state heat transfer in a buried onshore dense phase CO2 pipelines analytically using the conduction shape factor and thermal resistance method to evaluate for the heat loss from an uninsulated pipeline. A parametric study that critically analyses the effect of variation in pipeline burial depth and soil thermal conductivity on the heat transfer rate, soil thermal resistance and the overall heat transfer coefficient (OHTC) is investigated. This is done using a one-dimensional heat conduction model at constant temperature of the dense phase CO2 fluid. The results presented show that the influence of soil thermal conductivity and pipeline burial depth on the rate of heat transfer, soil thermal resistance and OHTC is dependent on the average constant ambient temperature in buried dense phase CO2 onshore pipelines. Modelling results show that there are significant effects of the ambient natural convection on the soil temperature distribution which creates a thermal influence region in the soil along the pipeline that cannot be ignored in the steady state modelling and as such should be modelled as a conjugate heat transfer problem during pipeline design.

Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000062-000066 ◽  
Author(s):  
T. Welker ◽  
S. Günschmann ◽  
N. Gutzeit ◽  
J. Müller
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Junction Temperature ◽  
Large Area ◽  
Heat Spreader ◽  
Integration Density ◽  
Heat Spreaders ◽  
Cte Mismatch ◽  
Pattern Resolution

The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands on the substrate technology which is used for the first level interconnect between the semiconductor and the device package. Higher pattern resolution is required to connect more functions on a smaller chip. Also the thermal performance of the substrate is a crucial issue. The increased integration density leads to an increased power density, what means that more heat has to dissipate on a smaller area. Thus, substrates with a high thermal conductivity (e. g. direct bonded copper (DBC)) are utilized which spread the heat over a large area. However, the reduced pattern resolution caused by thick metal layers is disadvantageous for this substrate technology. Alternatively, low temperature co-fired ceramic (LTCC) can be used. This multilayer technology provides a high pattern resolution in combination with a high integration grade. The poor thermal conductivity of LTCC (3 … 5 W*m−1*K−1) requires thermal vias made of silver paste which are placed between the power chip and the heat sink and reduce the thermal resistance of the substrate. The via-pitch and diameter is limited by the LTCC technology, what allows a maximum filling grade of approx. 20 to 25 %. Alternatively, an opening in the ceramic is created, to bond the chip directly to the heat sink. This leads to technological challenges like the CTE mismatch between the chip and the heat sink material. Expensive materials like copper molybdenum composites with matched CTE have to be used. In the presented investigation, a thick silver tape is used to form a thick silver heat spreader through the LTCC substrate. An opening is structured by laser cutting in the LTCC tape and filled with a laser cut silver tape. After lamination, the substrate is fired using a constraint sintering process. The bond strength of the silver to LTCC interface is approx. 5.6 MPa. The thermal resistance of the silver structure is measured by a thermal test chip (Delphi PST1, 2.5 mm × 2.5 mm) glued with a high thermal conducting epoxy to the silver structure. The chip contains a resistor and diodes to generate heat and to determine the junction temperature respectively. The backside of the test structure is temperature stabilized by a temperature controlled heat sink. The resulting thermal resistance is in the range of 1.1 K/W to 1.5 K/W depending on the length of silver structure (5 mm to 7 mm). Advantages of the presented heat spreader are the low thermal resistance and the good embedding capability in the co-fire LTCC process.

Optimum Fin Parameters of Radial Heat Sinks Subjected to Natural Convection

2019 ◽  
Vol 11 (5) ◽  
Author(s):  
S. Manna ◽  
S. K. Ghosh ◽  
S. C. Haldar
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Sinks ◽  
Computational Domain ◽  
Active Length ◽  
Vorticity Vector ◽  
Radial Heat ◽  
In The Beginning ◽  
Opposing Effects ◽  
Fin Thickness

Free convection from an upward facing radial heat sink with fins at an equal angular gap attached to an isothermal base has been investigated numerically. The governing equations in primitive variables were changed to vorticity-vector potential formulation, and an in-house code was developed using finite difference technique. To close the computational domain, two pseudo boundaries were considered. Length, height, and number of fins strongly influence the rate of heat transfer while the fin thickness has a marginal role. As the fin length increases, the rate of heat transfer first increases and then remains almost unaffected. However, the active length of the fins depends on the strength of buoyancy. Heat transfer continuously increases with fin height but with diminishing effect. Adding more number of fins has two opposing effects. It provides more surface area for convection, but at the same time, the induced air is unable to reach the interior of the heat sink making the inner portion of the fins inoperative. As a result of these two opposing influences, heat transfer increases in the beginning and then decreases as more fins are added. This article suggests various fin parameters to achieve maximum cooling. In addition, one can estimate the rate of cooling to be achieved by any radial heat sink.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

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