Liquid Metal Based Mini/Micro Channel Cooling Device

2009 ◽  
Author(s):  
Yue-Guang Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Micro Channel ◽  
Cooling Device ◽  
Heat Transfer Theory ◽  
Cooling Devices ◽  
Cooling Effects

Effective heat dissipation is of great importance in many engineering fields. In this paper, we investigated a newly emerging method to significantly improve the cooling capability of micro channel devices, through implementing liquid metal with low melting point as the powerful coolant. A series of experiments with different working fluids and volume flow were performed, and the different cooling effects between liquid metal and water were compared. In order to better evaluate the cooling capability of liquid metal based micro channel cooling device, the hydrodynamic and heat transfer theory involved was discussed. The results indicated that, when the system operated in a relatively high velocity, micro channel cooling devices with liquid metal as coolant could produce higher convective heat transfer coefficient compared to those with traditional cooling fluids. And under the same pump power, not only the thermal resistance of liquid metal based micro channel could be much smaller, but also the coolant volume flow could be decreased. What is more, the liquid metal can be driven by a highly efficient electromagnetic pump without any noise. Therefore, more compact and energy-saving micro channel cooling devices with better cooling capability may come into reality. This new method is rather practical, and is expected to be important for realizing an extremely high heat dissipation rate.

scholarly journals Designing and Optimising the Parameters of Micro Channels

2020 ◽  
Vol 8 (2S12) ◽  
pp. 71-76
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Flow Rate ◽  
Volume Flow Rate ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Micro Channel ◽  
Micro Channels ◽  
Good Agreement

This paper documents the optimization of different parameters of micro channel heat sink which enhance the heat transfer. The objective is to find the major thermal resistance in micro channel and its effect on other parameters. Water is used as a coolant and the initial values of convective heat transfer coefficient and volume flow rate are 30000 W/m2K and 1 lpm respectively. Different graph are plotted between pressure drop,heat transfer co-efficient, pressure drop,thermal resistance and flow rate to finally achieve the optimized valus of channel width and height, hydraulic diameter, thermal resistance and pressure drop. The result achieved are in good agreement with the previous researches.

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Yuntao Cui ◽  
Yujie Ding ◽  
Shuo Xu ◽  
Yushu Wang ◽  
Wei Rao ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Corrosion Resistance ◽  
Aluminum Alloy ◽  
Liquid Metal ◽  
Effective Thermal Conductivity ◽  
Anodic Oxidation ◽  
Convective Heat Transfer Coefficient ◽  
Total Thickness ◽  
Anodized Aluminum

Gallium-based liquid metal (LM) inherits excellent thermophysical properties and pollution-free characteristics. However, it has long been a fatal problem that LM would cause serious corrosion and embrittlement on the classical substrate made of aluminum alloys in constructing chip cooling device. Here, anodic oxidation treatment was introduced on processing the aluminum alloy aiming to tackle the corrosion issues. The prepared anodic oxidation aluminum (AAO) coatings were composed of nanopore layers and barrier layers on a high-purity alumina matrix that were manufactured electrochemically. According to the measurement, the effective thermal conductivity of the anodized aluminum alloy increases with the total thickness of sample increasing. When the total thickness L exceeds 5 × 10−3 m, effects of the porous media on effective thermal conductivity are negligible via model simulation and calculation. It was experimentally found that aluminum alloy after surface anodization treatment presented excellent corrosion resistance and outstanding heat transfer performance even when exposed in eutectic gallium–indium (E-GaIn) LM over 200 °C. The convective heat transfer coefficient of LM for anodized sample reached the peak when the heat load is 33.3 W.

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

2021 ◽  
Author(s):  
Noriyuki Unno ◽  
Kazuhisa Yuki ◽  
Risako Kibushi ◽  
Rika Nogita ◽  
Atsuyuki Mitani
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Electronic Devices ◽  
High Heat ◽  
Experimental Result ◽  
High Heat Flux ◽  
Promising Technique ◽  
Cooling Device ◽  
Cooling Devices

Abstract Boiling heat transfer (BHT) is a promising technique to remove a high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a big problem in BHT because it restricts the maximum performance of the cooling devices using BHT. Nanofluid has been widely used to improve the CHF. In this study, the authors investigated the BHT of a compact cooling device at low pressure using a special nanofluid: that is made with partially soluble particles in water. The experimental result found that the CHF with the special nanofluid is 170 W/cm2 and is higher than that with nanofluid made with an insoluble nanoparticle.

Design of a Self-Driven Liquid Metal Cooling Device for Heat Dissipation of Hot Chips in a Closed Cabinet

2013 ◽  
Vol 6 (1) ◽  
Author(s):  
Peipei Li ◽  
Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Horizontal Plane ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Cooling Device ◽  
Large Power ◽  
Convective Thermal ◽  
The One ◽  
Liquid Metal Cooling

Tremendous attentions have been focused on thermal management to control the temperature of many advanced integrated electronic devices. The liquid metal cooling has recently been validated as a highly effective method to dissipate heat from hot chips. In this study, a practical design and implementation of a buoyancy effect driven liquid metal cooling device for the automatic thermal management of hot chips in a closed cabinet were demonstrated. The principles, especially the theory for convective thermal resistance of liquid metal cooling was provided for guiding optimization of the device. A model prototype was then fabricated and tested. Experiments were performed when two simulated hot chips in the closed cabinet worked at different heat loads and different angles with the horizontal plane. It was shown that for the one chip case, the cooling device could maintain the chip temperature to below 85.1 °C at the ambient temperature 20 °C when the heat load was about 122 W. The cooling performance of the device could achieve better when the angle between the cabinet and the horizontal plane varied from 0 °C to 90 °C. With two chips working simultaneously, both chips had close temperature and hot spot did not appear easily when subject to large power, which will help reduce thermal stress and enhance reliability of the system. The practical value of the self-driven liquid metal cooling device is rather evident. Given its reliability, simplicity, and efficiency, such device can possibly be used for heat dissipation of multichip in closed space in the future.

Calculation of the Combined Heat Transfer Coefficient of Hot-face on Cast Iron Cooling Stave Based on Thermal Test

2017 ◽  
Vol 36 (3) ◽  
pp. 249-256
Author(s):  
Feng-guang Li ◽  
Jian-liang Zhang ◽  
Hai-bin Zuo ◽  
Xuan Qin ◽  
Cheng-lin Qi
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Heat Transfer Coefficient ◽  
Cast Iron ◽  
Transfer Coefficient ◽  
Thermal Test ◽  
Heat Transfer Theory ◽  
Cooling Effects ◽  
Simulation Results ◽  
Combined Heat Transfer

AbstractCooling effects of the cast iron cooling stave were tested with a specially designed experimental furnace under the conditions of different temperatures of 800 °C, 900 °C, 1,000 °C and 1,100 °C as well as different cooling water velocities of 0.5 m·s–1, 1.0 m·s–1, 1.5 m·s–1 and 2.0 m·s–1. Furthermore, the combined heat transfer coefficient of hot-face on cast iron cooling stave (αh−i) was calculated by heat transfer theory based on the thermal test. The calculated αh−i was then applied in temperature field simulation of cooling stave and the simulation results were compared with the experimental data. The calculation of αh−i indicates that αh−i increases rapidly as the furnace temperature increases while it increases a little as the water velocity increases. The comparison of the simulation results with the experimental data shows that the simulation results fit well with the experiment data under different furnace temperatures.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

Finite Element Simulation of Enhanced Cooling Cutting of Stainless Steel

2013 ◽  
Vol 312 ◽  
pp. 445-449
Author(s):  
Yu Su
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Stainless Steel ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Convective Heat Transfer Coefficient ◽  
Interface Temperature ◽  
Cooling Effects

This paper develops a 2D finite element model for the enhanced cooling cutting of stainless steel. The enhanced cooling effect is modeled with a convective heat transfer coefficient assigned to a heat transfer window of cutting zone. Five convective heat transfer coefficients are defined to simulate different enhanced cooling effects. The simulation results suggest that increase of convective heat transfer coefficient results in a very small reduction of maximum tool-chip interface temperature, even when a very large convective heat transfer coefficient is used. In addition, no significant effect on cutting force and thrust force is observed with the increase of convective heat transfer coefficient.

scholarly journals Experimental study on heat transfer of an engine radiator with TiO2/EG-water nano-coolant

2021 ◽  
Vol 3 (4) ◽  
Author(s):  
Mohd Muzammil Zubair ◽  
Md. Seraj ◽  
Mohd. Faizan ◽  
Mohd Anas ◽  
Syed Mohd. Yahya
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Ethylene Glycol ◽  
Transfer Coefficient ◽  
Convective Heat Transfer ◽  
Flow Rate ◽  
Volume Flow Rate ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Nanoparticle Concentration

AbstractNanofluid as a transport medium displays a great potential in engineering applications involving heat transfer. In this paper, the execution of water and ethylene glycol-based TiO2 nanofluid as a radiator coolant is resolved experimentally. The convective heat transfer coefficient of TiO2/EG-Water nanocoolant has been estimated and contrasted with the information acquired experimentally. Nanocoolant were set up by taking 25% ethylene glycol and 75% water with low volume concentration of TiO2 nanoparticles. All the experiments were led for the distinctive volume flow rates in the range going from 30 to 180 L/h (LPH). The nanocoolant made to flow through curved radiator tubes in every experiment, so that it can exchange heat effectively. Result shows that increasing the volume flow rate of nanocoolant flowing in the radiator tubes, increases the heat transfer as well as the convective heat transfer coefficient of nanocooant. Maximum heat transfer enhancement of 29.5% was recorded for nanocoolant with 0.03% nanoparticle concentration as compared to water at 150 LPH. Apart from this nanoparticle concentration into the base fluid, no further enhancement in heat transfer has been observed at any volume flow rate.

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