Assessment of Influence and Analysis of Mechanism on the Reliability for Solder Joints of Electronic Device

2005 ◽  
Author(s):  
Qiang Yu ◽  
Jae-Chul Jin ◽  
Hirokazu Abe ◽  
Takahiro Koyama ◽  
Tadahiro Shibutani ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Advanced Technology ◽  
Circuit Board ◽  
Design Stage ◽  
Concept Design ◽  
Fatigue Reliability ◽  
Design Engineers ◽  
Design Factors

In recent years, the development of the electronic device using the semiconductor is remarkable. In current advanced technology, it has succeeded in making the package which size is almost equal to the IC chip. Moreover for miniaturization and high integration of the electronic device, it has been fined in soldered joints divisions. As a result, the strength reliability become an important problem, since the thermal fatigue fracture is generated by thermal expansion difference between package and printed-circuit board. However, it is difficult to guarantee quality during the design stage, because it is hard to know which design factors will prolong the fatigue life. So it is needed that a quantitative evaluation technique of the relation between the design change and the thermal fatigue reliability. The authors introduced a simple approach to help solving the design and development of a package system by using the SDSS (statistical design support system) and FEM (Finite Element Method) analysis. In this study, in order to improve the reliability, evaluations of the influence of various design factors on the reliability of BGA (Ball Grid Array) soldered joints were carried out. By using the total equivalent inelastic strain range obtained by FEM analysis, the sensitivity is calculated and the authors got the influence of each design factor. With the results, the design engineers can know the rate of each factors’ effect on the reliability of solder joints and they can use the results to assess the reliability of their design from the concept design stage. Consequently, it can be expected that almost reliability problems can be avoided at the beginning, and it will lead a great advantage of shortening design period and slashing costs. And this will lead design engineers to come up with more new ideas.

The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints

2005 ◽  
Vol 297-300 ◽  
pp. 1822-1827 ◽  
Author(s):  
Jae Chul Jin ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Hirokazu Abe ◽  
Masaki Shiratori
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design Stage ◽  
Concept Design ◽  
Design Engineers ◽  
Thermal Fatigue Life ◽  
Almost All ◽  
Design Factors

In recent years, package downsizing has become one of biggest trends in packaging technologies because of miniaturization and the high integration of electronic devices. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. But, the reliability of thermal fatigue life may be lowered by the dispersion of design factors such as the dimensions, shapes, and material properties of package systems. Also, the fracture modes (fatigue fracture, brittle destruction in the interface, and compound destruction, and so on) will be affected by these dispersion factors. Although this dispersion should be reduced in order to improve the reliability, reducing all dispersion is inefficient and time-consuming. So, the factors that greatly contribute to thermal fatigue life have to be reduced. In this study, evaluations of the influence of various design factors on the reliability of soldered joints of a BGA (Ball Grid Array) were carried out, and got each influence. With the results, design engineers can rate each factor’s effect on reliability and assess the reliability of their design beginning at the concept design stage. Consequently, it will be possible to avoid almost all reliability problems from the beginning. Also, by rating the factors, the design period can be shortened

Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle

2004 ◽  
Author(s):  
Qiang Yu ◽  
Masaki Shiratori ◽  
Kimimasa Murayama ◽  
Kazuhiro Igarashi ◽  
Takashi Nakanishi
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Time Estimation ◽  
Initial Crack ◽  
Fatigue Reliability ◽  
Electric Device ◽  
Long Time ◽  
Reliability Of Solder Joints ◽  
Improve Reliability

In recent years many electric equipments have come to be used for cars. Solder joints in electric device utilizing car are exposed to harder environment and required higher reliability than that in electric household appliances. Because of this reason, thermal fatigue reliability of solder joints has become one of the most important issues in car electronics. Generally thermal fatigue reliability is estimated by thermal cycle examination, but it needs long time. Estimation by FEM enables it to improve reliability and to reduce time. Analysis of solder life generally can predict only initial crack. But it is important to predict crack propagation and solder joints break down, considering that a function of solder joints is electric connection. In this study, the authors proposed a method to predict break down life by analytical approach.

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

2013 ◽  
Vol 135 (4) ◽  
Author(s):  
Guofeng Xia ◽  
Fei Qin ◽  
Cha Gao ◽  
Tong An ◽  
Wenhui Zhu
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Design Of Experiment ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Fe Model ◽  
Fatigue Reliability ◽  
Original Design ◽  
Factor Combination

A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, structural geometries, and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(38) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Analysis of variance (ANOVA) is carried out to examine the influence of factors on the thermal fatigue reliability and to find the significant factors. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element (FE) model. The modified Coffin–Manson model is employed to predict the fatigue life of solder joints. Results indicate that the coefficients of thermal expansion (CTE) of printed circuit board (PCB), the height of solder joint, and CTE of epoxy molding compound (EMC) have critical influence on thermal fatigue life of solder joints. The fatigue life of multirow QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after the optimized factor combination design based on the presented method.

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

2007 ◽  
Author(s):  
Satoshi Kondo ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Masaki Shiratori
Keyword(s):  
Printed Circuit Board ◽  
Evaluation Method ◽  
Electronic Devices ◽  
Circuit Board ◽  
Design Stage ◽  
Concept Design ◽  
Design Factor ◽  
Assessment Approach ◽  
And Cluster Analysis ◽  
Design Factors

The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. It is demanded a long-life product which has short development time. However, it is difficult because of the interaction between each design factor. The authors have investigated the influence of design factors on the reliability of soldered joints in BGA model by using response surface method and cluster analysis. By using these methods, the interaction of all design factors was clarified. Based upon these analytical results, design engineers can rate each factor’s effect on reliability and assess the reliability of their basic design plan at the concept design stage.

scholarly journals Evaluation for Thermal Fatigue Life of Electronic Device Solder Joints utilizing Car

2003 ◽  
Vol 2003.16 (0) ◽  
pp. 699-700
Author(s):  
Qiang YU ◽  
Masaki SHIRATORI ◽  
Hae Ki NAM ◽  
Kazuhiru HIYAKE ◽  
Kazuhiro IGARASHI ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Thermal Fatigue Life

Study on Design Support Method Considering the Interaction Among Multi-Variables

2008 ◽  
Author(s):  
Junya Noda ◽  
Qiang Yu
Keyword(s):  
Graphical Model ◽  
Simulation Models ◽  
Hierarchical Cluster ◽  
Design Stage ◽  
Concept Design ◽  
Design Quality ◽  
Detailed Design ◽  
Design Support ◽  
Characteristic Values ◽  
Design Factors

Recently, a remarkable shortening of the development and design period becomes possible by the development of CAE and the optimization technologies, and efficient improvement of design quality in the detailed design stage has been achieved. Nevertheless, it is thought that there is a limit to for this kind of improvement in the near future, no matter how much the upgrade of the detailed design stage will be attempted. Therefore, the technology requested in the next step should be a new approach that can improve the quality of design concept and the efficiency of the concept design processes. For the engineers to improve concept design efficiency, they are requested that they should have very good understanding about the physics of their objectives and special experience about know-how for forming the answers to a very complicated problems. Thus, it is necessary to know the complicated physical relation between the design factors and the evaluation characteristic values to upgrade the concept design stage. It is thought that it can make a further improvement on the efficiency of design process if the technique, which can help the engineers to grip this relation, is established. However, it is very difficult for the engineers to understand a real complicated problem by few experiences. There are a lot of reasons for this kind of problems. For example, there will be a various patterns of design factors that achieve the similar design results, if the design factors have strong interacting relation between each other. In this study, the authors proposed a design support method for extracting the relation between the design factors and the evaluation characteristic values by using the results obtained by simulation models, and it was applied to the vehicle design problems in considering the interaction among the multi-variables by using a hierarchical cluster analysis and a graphical model. It was shown that the results given by the proposed approach can help the engineers to find and understand the essence of the phenomena involved.

Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads

2007 ◽  
Author(s):  
Akihiko Tosaka ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Satoshi Kondo ◽  
Masaki Shiratori
Keyword(s):  
Solder Joints ◽  
Electronic Device ◽  
Cyclic Fatigue ◽  
Reliability Evaluation ◽  
Test Method ◽  
Bending Test ◽  
Fatigue Reliability ◽  
Bending Load ◽  
Reliability Of Solder Joints ◽  
Free Solder

The miniaturization and the high integration of electronic device parts were progressed by the advance in technology, and it leads the problems of warpage of high-integrated component during mounting processes. This kind mismatch would be released slowly after the components are assembled. Therefore, it is concerned that the deformation of the solder joints caused by the warpage should give some impact on the thermal fatigue reliability of solder joints, because the solder joints are subjected not only to the cyclic thermal mismatch but also to the considerable one direction bending load. This state is called as multi-loads in this study. The thermal cyclic fatigue reliability of solder joints had been studied by using analytical and heat cyclic testing approaches, and it is shown that the fatigue life can be assessed by Manson-Coffin’s law. However, the reliability evaluation techniques for multi-loads problem have not been established. In this study, the relation between the fatigue reliability and the multi-loads conditions was studied and the BGA (Ball Grid Array) package was chosen as the target. The author proposed a new cyclic bending test method to achieve the different conditions of the multi-loads, and based upon the experimented and analytical results it was found that impact of the multi loads some cases neglected for could not be.

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