A Multi-Fingered Micromechanism for Coordinated Micro/Nano Manipulation

2005 ◽  
Author(s):  
Sandeep Krishnan ◽  
Laxman Saggere
Keyword(s):  
Silicon On Insulator ◽  
Systematic Design ◽  
Ansys Software ◽  
Excellent Correlation ◽  
Element Analysis ◽  
Deep Reactive Ion Etching ◽  
Baseline Design ◽  
Output Displacement ◽  
Nano Scale ◽  
Theoretical Results

Micromanipulators for coordinated manipulation of micro- and nano-scale objects are critical for advancing several emerging applications such as microassembly and manipulation of biological cells. Most of existing designs for micromanipulators accomplish either primarily microgripping or primarily micropositioning tasks, and relatively, only a very few are capable of accomplishing both microgripping and micropositioning, however, they are generally bulky. This paper presents conceptualization, design, fabrication and experimental characterization a novel micromanipulation station for coordinated planar manipulation combining both gripping and positioning of micro- and nano-scale objects. Conceptually, the micromanipulation station is comprised of multiple, independently actuated, fingers capable of coordinating with each other to accomplish the manipulation and assembly of micron-scale objects within a small workspace. A baseline design is accomplished through a systematic design optimization of each finger maximizing the workspace area of the manipulation station using the optimization toolbox in MATLAB. The device is micromachined on a SOI (silicon-on-insulator) wafer using the DRIE (Deep Reactive Ion Etching) process. The device prototype is experimentally characterized for the output displacement characteristics of each finger for known input displacements applied through manual probing. An excellent correlation between the experimental results and the theoretical results obtained through a finite element analysis in ANSYS software, which validates both the design and the fabrication of the proof-of-the-concept, is demonstrated.

scholarly journals Design and Validation of a Single-SOI-Wafer 4-DOF Crawling Microgripper

Micromachines ◽  
2019 ◽  
Vol 10 (6) ◽  
pp. 376 ◽  
Author(s):  
Matteo Verotti ◽  
Alvise Bagolini ◽  
Pierluigi Bellutti ◽  
Nicola Pio Belfiore
Keyword(s):  
Finite Element Analysis ◽  
Rigid Body ◽  
Compliant Mechanism ◽  
Silicon On Insulator ◽  
Element Analysis ◽  
Deep Reactive Ion Etching ◽  
Theoretical Simulation ◽  
Body Model ◽  
Replacement Method ◽  
Rigid Body Model

This paper deals with the manipulation of micro-objects operated by a new concept multi-hinge multi-DoF (degree of freedom) microsystem. The system is composed of a planar 3-DoF microstage and of a set of one-DoF microgrippers, and it is arranged is such a way as to allow any microgripper to crawl over the stage. As a result, the optimal configuration to grasp the micro-object can be reached. Classical algorithms of kinematic analysis have been used to study the rigid-body model of the mobile platform. Then, the rigid-body replacement method has been implemented to design the corresponding compliant mechanism, whose geometry can be transferred onto the etch mask. Deep-reactive ion etching (DRIE) is suggested to fabricate the whole system. The main contributions of this investigation consist of (i) the achievement of a relative motion between the supporting platform and the microgrippers, and of (ii) the design of a process flow for the simultaneous fabrication of the stage and the microgrippers, starting from a single silicon-on-insulator (SOI) wafer. Functionality is validated via theoretical simulation and finite element analysis, whereas fabrication feasibility is granted by preliminary tests performed on some parts of the microsystem.

scholarly journals Design of a Compliant Mechanism Based Four-Stage Amplification Piezoelectric-Driven Asymmetric Microgripper

Micromachines ◽  
2019 ◽  
Vol 11 (1) ◽  
pp. 25
Author(s):  
Xiaodong Chen ◽  
Zilong Deng ◽  
Siya Hu ◽  
Jinhai Gao ◽  
Xingjun Gao
Keyword(s):  
Compliant Mechanism ◽  
Experimental Tests ◽  
Element Analysis ◽  
Output Displacement ◽  
Amplification Ratio ◽  
Output Force ◽  
Characteristics Analysis ◽  
The Relationship ◽  
Two Sides ◽  
Theoretical Results

The existing symmetrical microgrippers have larger output displacements compared with the asymmetrical counterparts. However, the two jaws of a symmetrical microgripper are less unlikely to offer the same forces on the two sides of a grasped micro-object due to the manufacture and assembly errors. Therefore, this paper proposes a new asymmetric microgripper to obtain stable output force of the gripper. Compared with symmetrical microgrippers, asymmetrical microgrippers usually have smaller output displacements. In order to increase the output displacement, a compliant mechanism with four stage amplification is employed to design the asymmetric microgripper. Consequently, the proposed asymmetrical microgripper possesses the advantages of both the stable output force of the gripper and large displacement amplification. To begin with, the mechanical model of the microgripper is established in this paper. The relationship between the driving force and the output displacement of the microgripper is then derived, followed by the static characteristics’ analysis of the microgripper. Furthermore, finite element analysis (FEA) of the microgripper is also performed, and the mechanical structure of the microgripper is optimized based on the FEA simulations. Lastly, experimental tests are carried out, with a 5.28% difference from the FEA results and an 8.8% difference from the theoretical results. The results from theoretical calculation, FEA simulations, and experimental tests verify that the displacement amplification ratio and the maximum gripping displacement of the microgripper are up to 31.6 and 632 μm, respectively.

Design, Optimization, and Experiments of Compliant Microgripper

2003 ◽  
Author(s):  
Young Seok Oh ◽  
Woo Ho Lee ◽  
Harry E. Stephanou ◽  
George D. Skidmore
Keyword(s):  
Mass Production ◽  
Low Cost ◽  
Three Dimensional ◽  
Sensory Information ◽  
Silicon On Insulator ◽  
Element Analysis ◽  
Deep Reactive Ion Etching ◽  
Design And Optimization ◽  
Mems Technology ◽  
Large Opening

Recent progress of MEMS technology enables the mass production of microdevices with low cost. However, methods for designing microgrippers and microdevice assembly processes have not been studied extensively. This paper presents the design and optimization of compliant microgripper, and snap-fit based microassembly experiments. A key issue of microassembly is to design a microgripper that is capable of handling and manipulating microparts with positional uncertainty and the lack of sensory information. Topology optimization is used to design compliant microgrippers that can produce a large opening at the tip or a gripper, and Finite Element Analysis (FEA) is performed to evaluate the characteristics of grippers. Compliant microgripper driven by the embedded thermal actuator and snap-connectors were fabricated using deep reactive ion etching (DRIE) process with Silicon On Insulator (SOI) wafer. With a fabricated microgripper and several snap-fits, the assembly of a three dimensional microstructure was successfully demonstrated.

Design and Characterization of a Large Displacement Electro-thermal Actuator for a New Kind of Safety-and-Arming Device

2015 ◽  
Vol 0 (0) ◽  
Author(s):  
Yu-Long Zhao ◽  
Teng-Jiang Hu ◽  
Xiu-Yuan Li ◽  
Zhuang-De Jiang ◽  
Wei Ren ◽  
...  
Keyword(s):  
Silicon On Insulator ◽  
Step Response ◽  
Small Displacement ◽  
Driving Voltage ◽  
Maximum Displacement ◽  
Element Analysis ◽  
Output Displacement ◽  
Chip Size ◽  
Device Applications

AbstractThe design, fabrication and characterization of a distinctive electro-thermal MEMS safety-and-arming device are presented in this paper. The device is comprised of a V-shape actuator and a micro lever. The V-shape actuator can generate a large output force but small displacement; thus, it is necessary to design a micro lever to amplify the insufficient displacement, which can broaden the device applications in different fields. The temperature distribution, the maximum displacement and the step response time of the actuator are analyzed and validated by the finite element analysis software ANSYS. The whole device is fabricated on SOI (Silicon-on-Insulator) wafer, and MUMPs process is introduced. The characterized performance of the device shows output displacement at more than 150 µm within 17 V driving voltage, and the consuming power is about 1.53 W. The chip size is about 5 × 5 × 0.5 mm

Method of Detecting Trace Metal Contamination in Thick-Film SOI Device

2005 ◽  
Author(s):  
Yasunori Goto ◽  
Hiroomi Eguchi ◽  
Masaru Iida
Keyword(s):  
Trace Metal ◽  
Thick Film ◽  
Metal Contamination ◽  
Semiconductor Device ◽  
Trace Element Analysis ◽  
Silicon On Insulator ◽  
Element Analysis ◽  
Trace Metal Contamination ◽  
Trace Metal Elements ◽  
Output Characteristics

Abstract In the automotive IC using thick-film silicon on insulator (SOI) semiconductor device, if the gettering capability of a SOI wafer is inadequate, electrical characteristics degradation by metal contamination arises and the yield falls. At this time, an automotive IC was made experimentally for evaluation of the gettering capability as one of the purposes. In this IC, one of the output characteristics varied from the standard, therefore failure analysis was performed, which found trace metal elements as one of the causes. By making full use of 3D perspective, it is possible to fabricate a site-specific sample into 0.1 micrometre in thickness without missing a failure point that has very minute quantities of contaminant in a semiconductor device. Using energy dispersive X-ray, it is possible to detect trace metal contamination at levels 1E12 atoms per sq cm. that are conventionally detected only by trace element analysis.

Use of the Finite Element Analysis Method in Pedodontics

2018 ◽  
Vol 55 (4) ◽  
pp. 666-675
Author(s):  
Mihaela Tanase ◽  
Dan Florin Nitoi ◽  
Marina Melescanu Imre ◽  
Dorin Ionescu ◽  
Laura Raducu ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Structural Model ◽  
Analysis Method ◽  
Ansys Software ◽  
Concentrated Force ◽  
Element Analysis ◽  
Finite Element Analysis Method ◽  
The Finite Element Analysis ◽  
Solid Type

The purpose of this study was to determinate , using the Finite Element Analysis Method, the mechanical stress in a solid body , temporary molar restored with the self-curing GC material. The originality of our study consisted in using an accurate structural model and applying a concentrated force and a uniformly distributed pressure. Molar structure was meshed in a Solid Type 45 and the output data were obtained using the ANSYS software. The practical predictions can be made about the behavior of different restorations materials.

Based on ANSYS Planetary Gear Ransmission Design Analysis

2011 ◽  
Vol 314-316 ◽  
pp. 1218-1221
Author(s):  
Hao Min Huang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Contact Stress ◽  
Planetary Gear ◽  
Design Analysis ◽  
Ansys Software ◽  
Element Analysis ◽  
Planet Gear ◽  
Gear Contact ◽  
Transmission Gear

Conventional methods of design to be completed ordinary hydraulic transmission gear gearbox design, but for such a non-planet-rule entity, and the deformation of the planet-gear contact stress will have a great impact on the planet gear, it will be very difficult According to conventional design. In this paper, ANSYS software to the situation finite element analysis, the planetary gear to simulate modeling study.

scholarly journals A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 382
Author(s):  
Chao Xiang ◽  
Yulan Lu ◽  
Chao Cheng ◽  
Junbo Wang ◽  
Deyong Chen ◽  
...  
Keyword(s):  
Chemical Mechanical Planarization ◽  
Measurement Range ◽  
Silicon On Insulator ◽  
Anodic Bonding ◽  
Pressure Measurements ◽  
Quality Factors ◽  
Deep Reactive Ion Etching ◽  
Wide Range ◽  
Form Pressure ◽  
Silicon Islands

This paper presents a resonant pressure microsensor with a wide range of pressure measurements. The developed microsensor is mainly composed of a silicon-on-insulator (SOI) wafer to form pressure-sensing elements, and a silicon-on-glass (SOG) cap to form vacuum encapsulation. To realize a wide range of pressure measurements, silicon islands were deployed on the device layer of the SOI wafer to enhance equivalent stiffness and structural stability of the pressure-sensitive diaphragm. Moreover, a cylindrical vacuum cavity was deployed on the SOG cap with the purpose to decrease the stresses generated during the silicon-to-glass contact during pressure measurements. The fabrication processes mainly contained photolithography, deep reactive ion etching (DRIE), chemical mechanical planarization (CMP) and anodic bonding. According to the characterization experiments, the quality factors of the resonators were higher than 15,000 with pressure sensitivities of 0.51 Hz/kPa (resonator I), −1.75 Hz/kPa (resonator II) and temperature coefficients of frequency of 1.92 Hz/°C (resonator I), 1.98 Hz/°C (resonator II). Following temperature compensation, the fitting error of the microsensor was within the range of 0.006% FS and the measurement accuracy was as high as 0.017% FS in the pressure range of 200 ~ 7000 kPa and the temperature range of −40 °C to 80 °C.

Analysis of Hydroelectric Unit’s Upper Bracket Based on Test and FEM

2014 ◽  
Vol 721 ◽  
pp. 131-134
Author(s):  
Mi Mi Xia ◽  
Yong Gang Li
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Element Model ◽  
The Finite Element Method ◽  
Ansys Software ◽  
Element Analysis ◽  
Hydroelectric Unit ◽  
The Finite Element Analysis ◽  
Strain Rosette ◽  
The Finite Element Model

To research the load upper bracket of Francis hydroelectric unit, then established the finite-element model, and analyzed the structure stress of 7 operating condition points with the ANSYS software. By the strain rosette test, acquired the data of stress-strain in the area of stress concentration of the upper bracket. The inaccuracy was considered below 5% by analyzing the contradistinction between the finite-element analysis and the test, and match the engineering precision and the test was reliable. The finite-element method could be used to judge the stress of the upper bracket, and it could provide reference for the Structural optimization and improvement too.

Finite Element Analysis of Drum on the New Type Self-Driven Towing Machine for Cable

2011 ◽  
Vol 55-57 ◽  
pp. 664-669
Author(s):  
Jin Ning Nie ◽  
Hui Wang ◽  
De Feng Xie
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Analysis ◽  
Compressive Stress ◽  
Wire Rope ◽  
Ansys Software ◽  
Element Analysis ◽  
Structure Improvement ◽  
Improvement Measures ◽  
New Type

According to the situation that the dual-friction drums on the new type towing machine lack stress analysis when designed, the safety is difficult to test and verify. The pull of wire rope in various positions was derived and calculated, so both compressive stress and tangent friction force generated by the pull of wire rope were calculated. The result made by ANSYS software demonstrates the safety of the left drum which suffers from larger loads, structure improvement measures are put forward for the drum.

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