Thermal Performance of Laminate-to-Aluminum Attachment Materials

2009 ◽  
Author(s):  
John F. Maddox ◽  
Roy W. Knight ◽  
Sushil H. Bhavnani ◽  
John Evans
Keyword(s):  
Thermal Conductivity ◽  
Thermal Cycling ◽  
Thermal Performance ◽  
Industrial Application ◽  
Aluminum Substrate ◽  
Non Destructive

A non-destructive method was used to determine the effects of thermal cycling on the thermal performance of a PCB attached to an aluminum substrate with a thermal adhesive. This method allows for a comparison of the thermal performance of various TIMs in an industrial application. Testing was done on FR4 and Flex boards, both with and without overmolding, attached using PSA and an alternative adhesive. Baseline measurements were taken, then the boards were cycled from −40 to 125°C on a 90-minute cycle with 15-minute dwells at the target temperatures. It was found that both adhesives showed an increase in thermal conductivity, possibly due to curing, and delamination occurred at 17 out of 35 locations with the alternative adhesive within the first 1000 cycles while no delamination occurred with the PSA.

Maximizing Heat Transfer Through Joint Fin Systems

2005 ◽  
Vol 128 (2) ◽  
pp. 203-206 ◽  
Author(s):  
A.-R. A. Khaled
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Performance ◽  
Critical Length ◽  
The Other ◽  
Rigid Fixation ◽  
Convection Coefficient ◽  
Heat Transfer Characteristics ◽  
Cold Side ◽  
Transfer Characteristics

Heat transfer through joint fins is modeled and analyzed analytically in this work. The terminology “joint fin systems” is used to refer to extending surfaces that are exposed to two different convective media from its both ends. It is found that heat transfer through joint fins is maximized at certain critical lengths of each portion (the receiver fin portion which faces the hot side and the sender fin portion that faces the cold side of the convective media). The critical length of each portion of joint fins is increased as the convection coefficient of the other fin portion increases. At a certain value of the thermal conductivity of the sender fin portion, the critical length for the receiver fin portion may be reduced while heat transfer is maximized. This value depends on the convection coefficient for both fin portions. Thermal performance of joint fins is increased as both thermal conductivity of the sender fin portion or its convection coefficient increases. This work shows that the design of machine components such as bolts, screws, and others can be improved to achieve favorable heat transfer characteristics in addition to its main functions such as rigid fixation properties.

scholarly journals Enhancement of the Thermal Performance of the Paraffin-Based Microcapsules Intended for Textile Applications

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1120
Author(s):  
Virginija Skurkyte-Papieviene ◽  
Ausra Abraitiene ◽  
Audrone Sankauskaite ◽  
Vitalija Rubeziene ◽  
Julija Baltusnikaite-Guzaitiene
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Comparative Method ◽  
Multiwall Carbon Nanotubes ◽  
Acrylic Resin ◽  
Positive Influence ◽  
Outer Shell ◽  
Ir Camera ◽  
Spacer Fabric ◽  
Thermally Conductive

Phase changing materials (PCMs) microcapsules MPCM32D, consisting of a polymeric melamine-formaldehyde (MF) resin shell surrounding a paraffin core (melting point: 30–32 °C), have been modified by introducing thermally conductive additives on their outer shell surface. As additives, multiwall carbon nanotubes (MWCNTs) and poly (3,4-ethylenedioxyoxythiophene) poly (styrene sulphonate) (PEDOT: PSS) were used in different parts by weight (1 wt.%, 5 wt.%, and 10 wt.%). The main aim of this modification—to enhance the thermal performance of the microencapsulated PCMs intended for textile applications. The morphologic analysis of the newly formed coating of MWCNTs or PEDOT: PSS microcapsules shell was observed by SEM. The heat storage and release capacity were evaluated by changing microcapsules MPCM32D shell modification. In order to evaluate the influence of the modified MF outer shell on the thermal properties of paraffin PCM, a thermal conductivity coefficient (λ) of these unmodified and shell-modified microcapsules was also measured by the comparative method. Based on the identified optimal parameters of the thermal performance of the tested PCM microcapsules, a 3D warp-knitted spacer fabric from PET was treated with a composition containing 5 wt.% MWCNTs or 5 wt.% PEDOT: PSS shell-modified microcapsules MPCM32D and acrylic resin binder. To assess the dynamic thermal behaviour of the treated fabric samples, an IR heating source and IR camera were used. The fabric with 5 wt.% MWCNTs or 5 wt.% PEDOT: PSS in shell-modified paraffin microcapsules MPCM32D revealed much faster heating and significantly slower cooling compared to the fabric treated with the unmodified ones. The thermal conductivity of the investigated fabric samples with modified microcapsules MPCM32D has been improved in comparison to the fabric samples with unmodified ones. That confirms the positive influence of using thermally conductive enhancing additives for the heat transfer rate within the textile sample containing these modified paraffin PCM microcapsules.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

scholarly journals On Thermal Performance of Seawater Cooling Towers

2010 ◽  
Author(s):  
Mostafa H. Sharqawy ◽  
John H. Lienhard ◽  
Syed M. Zubair
Keyword(s):  
Thermal Conductivity ◽  
Power Generation ◽  
Thermal Performance ◽  
Cooling Tower ◽  
Cooling Towers ◽  
Governing Equations ◽  
Detailed Model ◽  
Salt Deposition ◽  
Transfer Processes ◽  
Mass Transfer Processes

Seawater cooling towers have been used since the 1970’s in power generation and other industries, so as to reduce the consumption of freshwater. The salts in seawater are known to create a number of operational problems including salt deposition, packing blockage, corrosion, and certain environmental impacts from salt drift and blowdown return. In addition, the salinity of seawater affects the thermophysical properties which govern the thermal performance of cooling towers, including vapor pressure, density, specific heat, viscosity, thermal conductivity and surface tension. In this paper, the thermal performance of seawater cooling towers is investigated using a detailed model of a counterflow wet cooling tower. The model takes into consideration the coupled heat and mass transfer processes and does not make any of the conventional Merkel approximations. In addition, the model incorporates the most up-to-date seawater properties in the literature. The model governing equations are solved numerically and its validity is checked by data in the literature. Based on the results of the model, a correction factor is obtained which characterizes the degradation of the cooling tower effectiveness when seawater is used.

Flexible phase change materials with enhanced tensile strength, thermal conductivity and photo-thermal performance

2021 ◽  
Vol 219 ◽  
pp. 110728
Author(s):  
Zhuodi Cai ◽  
Jian Liu ◽  
Yanxue Zhou ◽  
Liling Dai ◽  
Huixin Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Tensile Strength ◽  
Phase Change ◽  
Thermal Performance ◽  
Phase Change Materials

scholarly journals Thermal Performance of Oil Palm Fibre and Paper Pulp as the Insulation Materials

2014 ◽  
Vol 5 (2) ◽  
pp. 22-28
Author(s):  
S.H. Ibrahim ◽  
Sia W.K. ◽  
A. Baharun ◽  
M.N.M. Nawi ◽  
R. Affandi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Oil Palm ◽  
Total Density ◽  
Insulation Material ◽  
Paper Pulp ◽  
Particle Board ◽  
Environment Impact ◽  
Palm Fiber ◽  
Insulation Materials

 Energy consumption for residential use in Malaysia is keep increasing yearly in order to maintain the internal thermal comfort of the building. Roof insulation material plays a vital role in improving the thermal comforts of the building while reduce the cooling load of the building. Oil palm industry in Malaysia had grown aggressively over the past few decades. Tons of oil palm waste had produced during the process such as empty fruit bunch fiber. Another waste material that available and easy to obtain is paper. Paper is a valuable material that can be recycled. Waste paper comes from different sources such as newspaper, office and printing papers. This study will take advantage of the available resources which could contribute to reduce the environment impact. The aim of this study is to investigate the thermal performance of roof insulation materials using mixture of oil palm fiber and paper pulp with different ratio and thickness. This study found that the thermal performance of the paper pulp is slightly better compare to the oil palm fiber. Thermal conductivity of the particle board reduces around 4.1% by adding the 10% of paper pulp into the total density of the particle board. By adding 75% of paper pulp, the thermal conductivity of the particle board could be reduced to 24.6% compare to the oil palm fiber board under the similar condition. Therefore, from this study, it could be concluded that paper pulp has high potential to be used as a building insulation material.

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