Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications

2003 ◽  
Author(s):  
Sungdong Cho ◽  
Jin-Gul Hyun ◽  
Kuyng-Wook Paik
Keyword(s):  
Dielectric Constant ◽  
Shelf Life ◽  
Epoxy Resin ◽  
Printed Circuit Boards ◽  
Film Formation ◽  
Ceramic Composites ◽  
Organic Substrates ◽  
Curing Agent ◽  
Batio3 Powder ◽  
Embedded Capacitor

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials, because they have good process compatibility with multilayer organic substrates applications such as printed circuit boards (PCBs). In this work, it was demonstrated that low (less than ±5%) tolerance epoxy/BaTiO3 composite capacitors were successfully fabricated on PCBs using newly developed embedded capacitor films (ECFs), which were composed of specially formulated epoxy resin, latent curing agent, and BaTiO3 powders. And some properties of the capacitors were characterized. Compared with the dielectric layer formation method by spin coating using epoxy/BaTiO3 suspension, ECFs have excellent advantages such as lower (<5%) capacitance tolerance over large area, no waste of materials, good film formation capability, and processability, long shelf life, and good thermo-mechanical stability after final epoxy cure. Dielectric constant about 93 was obtained using two different size BaTiO3 powders mixture. Epoxy resin formulation, curing agent, solvents, and dispersant were optimized to produce good film formation capability, fast curing characteristics at 180°C within 5 minutes, good BaTiO3 powder dispersion control, and excellent shelf life for handling. And the effects of BaTiO3 particle size and BaTiO3 powder content on dielectric constant and adhesion strength were investigated. These capacitor films can be embedded on selective areas of PCBs during build-up processes or other substrates such as Si wafers and ceramic substrates.

scholarly journals Material Characterization of High Dielectric Constant Polymer–Ceramic Composite for Embedded Capacitor to RF Application

2002 ◽  
Vol 25 (1) ◽  
pp. 123-129 ◽  
Author(s):  
Yang Rao ◽  
Jireh Yue ◽  
C. P. Wong
Keyword(s):  
Dielectric Constant ◽  
Breakdown Voltage ◽  
Ceramic Composite ◽  
High Dielectric Constant ◽  
Ceramic Composites ◽  
Nano Composite ◽  
Capacitance Density ◽  
High Breakdown Voltage ◽  
Embedded Capacitor ◽  
High Dielectric

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer–ceramic composite with very high dielectric constant (εr∼150, a new record for the highest reportedεrvalue of nano-composite) has been developed in our previous work. RF application of embedded capacitors requires that insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer–ceramic nano-composite. Results show that this material has faily high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. 85/85 TH aging test has been performed and it had shown this novel high K material has good reliability. An embedded capacitor prototype with capacitance density of35 nF/cm2has been manufactured using this nano-composite with spinning coating technology. This novel nano-composite can be used for the integral capacitors in the RF applications.

scholarly journals Investigations on Structural, Mechanical, and Dielectric Properties of PVDF/Ceramic Composites

2015 ◽  
Vol 2015 ◽  
pp. 1-9 ◽  
Author(s):  
Anshuman Srivastava ◽  
Karun Kumar Jana ◽  
Pralay Maiti ◽  
Devendra Kumar ◽  
Om Parkash
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Single Phase ◽  
Extrusion Process ◽  
Ceramic Composites ◽  
X Ray Diffraction ◽  
Composite State ◽  
X Ray ◽  
Embedded Capacitor ◽  
Xrd Patterns

Polymer ceramic composites are widely used for embedded capacitor application. In the present work PVDF has been used as a matrix and CCTO and LaCCTO have been used as reinforcement. Extrusion process has been used for the synthesis of composites. X-ray diffraction (XRD) patterns confirm the formation of single phase CCTO, and LaCCTO in its pure as well as composite state. It is found that La doping in CCTO considerably increases the dielectric constant and reduces the dielectric loss. A similar trend is observed in the composites with the increasing content of CCTO and LaCCTO.

Preparation and analysis of a flexible curing agent for epoxy resin

2009 ◽  
Vol 114 (5) ◽  
pp. 2706-2710 ◽  
Author(s):  
Y. Yang ◽  
Gong Chen ◽  
K. M. Liew
Keyword(s):  
Epoxy Resin ◽  
Curing Agent

scholarly journals Synthesis of antibacterial polyether biguanide curing agent and its cured antibacterial epoxy resin

2021 ◽  
Vol 24 (1) ◽  
pp. 63-72
Author(s):  
Rui Li ◽  
Guoxing Yang ◽  
Yudan Wang ◽  
Lijia Liu ◽  
Qiang Wang ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Curing Agent

scholarly journals Effect of Terminal Groups on Thermomechanical and Dielectric Properties of Silica–Epoxy Composite Modified by Hyperbranched Polyester

Polymers ◽  
2021 ◽  
Vol 13 (15) ◽  
pp. 2451
Author(s):  
Jianwen Zhang ◽  
Dongwei Wang ◽  
Lujia Wang ◽  
Wanwan Zuo ◽  
Lijun Zhou ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Binding Energy ◽  
Epoxy Resin ◽  
Volume Fraction ◽  
Epoxy Composite ◽  
Mean Square Displacement ◽  
Mean Square ◽  
Hyperbranched Polyester ◽  
Free Volume Fraction

To study the effect of hyperbranched polyester with different kinds of terminal groups on the thermomechanical and dielectric properties of silica–epoxy resin composite, a molecular dynamics simulation method was utilized. Pure epoxy resin and four groups of silica–epoxy resin composites were established, where the silica surface was hydrogenated, grafted with silane coupling agents, and grafted with hyperbranched polyester with terminal carboxyl and terminal hydroxyl, respectively. Then the thermal conductivity, glass transition temperature, elastic modulus, dielectric constant, free volume fraction, mean square displacement, hydrogen bonds, and binding energy of the five models were calculated. The results showed that the hyperbranched polyester significantly improved the thermomechanical and dielectric properties of the silica–epoxy composites compared with other surface treatments, and the terminal groups had an obvious effect on the enhancement effect. Among them, epoxy composite modified by the hyperbranched polyester with terminal carboxy exhibited the best thermomechanical properties and lowest dielectric constant. Our analysis of the microstructure found that the two systems grafted with hyperbranched polyester had a smaller free volume fraction (FFV) and mean square displacement (MSD), and the larger number of hydrogen bonds and greater binding energy, indicating that weaker strength of molecular segments motion and stronger interfacial bonding between silica and epoxy resin matrix were the reasons for the enhancement of the thermomechanical and dielectric properties.

scholarly journals A Study on the Synthesis, Curing Behavior and Flame Retardance of a Novel Flame Retardant Curing Agent for Epoxy Resin

Polymers ◽  
2022 ◽  
Vol 14 (2) ◽  
pp. 245
Author(s):  
Yong Sun ◽  
Yongli Peng ◽  
Yajiao Zhang
Keyword(s):  
Flame Retardant ◽  
Epoxy Resin ◽  
Decomposition Temperature ◽  
Isothermal Kinetics ◽  
Flame Retardance ◽  
Curing Agent ◽  
Initial Decomposition Temperature ◽  
Limiting Oxygen Index ◽  
Epoxy Resin System ◽  
Dsc Method

In this work, a flame retardant curing agent (DOPO-MAC) composed of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide DOPO and methyl acrylamide (MAC) was synthesized successfully, and the structure of the compound was characterized by FT-IR and 1H-NMR. The non-isothermal kinetics of the epoxy resin/DOPO-MAC system with 1% phosphorus was studied by non-isothermal DSC method. The activation energy of the reaction (Ea), about 46 kJ/mol, was calculated by Kissinger and Ozawa method, indicating that the curing reaction was easy to carry out. The flame retardancy of the epoxy resin system was analyzed by vertical combustion test (UL94) and limiting oxygen index (LOI) test. The results showed that epoxy resin (EP) with 1% phosphorus successfully passed a UL-94 V-0 rating, and the LOI value increased along with the increasing of phosphorus content. It confirmed that DOPO-MAC possessed excellent flame retardance and higher curing reactivity. Moreover, the thermal stability of EP materials was also investigated by TGA. With the DOPO-MAC added, the residual mass of EP materials increased remarkably although the initial decomposition temperature decreased slightly.

Thermal-ageing characteristics of dry-type transformer epoxy composite insulation

2020 ◽  
Vol 32 (7) ◽  
pp. 741-752
Author(s):  
Yongqiang Wang ◽  
Changhui Feng ◽  
Ruoyu Fei ◽  
Yu Luo
Keyword(s):  
Surface Roughness ◽  
Dielectric Constant ◽  
Surface Morphology ◽  
Epoxy Resin ◽  
Degradation Mechanism ◽  
Three Dimensional ◽  
Thermal Ageing ◽  
Ageing Process ◽  
Complex Dielectric Constant ◽  
Significant Difference

To study the ageing characteristics of epoxy resin composite insulation in dry-type transformers in high-temperature environments, glass fibre-reinforced epoxy resin samples were placed in a hot air ageing environment at 130°C for testing. Dielectric properties, partial discharge (PD), microscopic morphology, three-dimensional morphology and Fourier transform infrared spectroscopy of aged samples were periodically tested. The results show that during the ageing process, the change in the surface morphology of the sample leads to an overall upward trend in surface roughness, and the older the sample, the faster the surface roughness increases; changes in the surface morphology and three-dimensional morphology of the material constitute the basis for judging the condition of the insulating surface and the state of ageing development. Microcracks are the direct cause of debonding of glass fibres and epoxy matrix. Degradation of the sample during the ageing process generates many free radicals, which enhances the polarisation ability of the sample and increases both the dielectric constant and the dielectric loss factor. The real part of the complex dielectric constant is more sensitive to the ageing response of the sample. The older the sample, the greater the effect on the results of the dielectric spectrum test. Since the aged sample generates more hot electrons during the PD process and makes it easier to inject electrons into the material, the PD of the sample is rendered more intense by thermal ageing. There is a significant difference between the degradation mechanism of the thermal ageing and PD. The samples subjected to PD after thermal ageing produce new groups, and the degradation of the samples is more severe than that caused by thermal ageing, or PD, alone.

Phosphorus- and silicon-containing amino curing agent for epoxy resin

2020 ◽  
Vol 29 (5) ◽  
pp. 433-443 ◽  
Author(s):  
Ajinkya Satdive ◽  
Siddhesh Mestry ◽  
Pavan Borse ◽  
Shashank Mhaske
Keyword(s):  
Epoxy Resin ◽  
Curing Agent
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