scholarly journals Integrated Avionics System (IAS): Integrating 3D Technology on a Spacecraft Panel

2003 ◽  
Author(s):  
Don J. Hunter
Keyword(s):  
System Integration ◽  
New Technologies ◽  
System Development ◽  
High Density ◽  
Design System ◽  
Flexible System ◽  
Integration Schemes ◽  
Environmental Test ◽  
Low Mass ◽  
System Packaging

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the “state of the art” in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density component packaging technologies. Industry has made significant progress in these technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Contextualizing private sector-based seed system development: The case of sorghum in Eastern Africa

2021 ◽  
pp. 003072702110563
Author(s):  
Caroline Hambloch ◽  
Jane Kahwai ◽  
John Mugonya
Keyword(s):  
Rural Development ◽  
Private Sector ◽  
New Technologies ◽  
System Development ◽  
Sub Saharan Africa ◽  
Eastern Africa ◽  
Improved Varieties ◽  
Seed System ◽  
Political Economic ◽  
Farming Households

Private sector-based seed system development remains a key development intervention in Sub-Saharan Africa. Seed system interventions promoting the adoption of improved varieties through the private sector generally follow a linear, market-oriented technological adoption logic. A qualitative case study of the sorghum seed system in Kenya, Uganda, and Tanzania demonstrates that this model may not be able to drive the broad-scale adoption of improved sorghum varieties and to generate significant benefits for small sorghum-farming households. The findings suggest that the agro-ecological, social, and political-economic contexts critically determine the role improved varieties and the private sector can play in rural development. Improved sorghum varieties promoted by both the public and private sectors may not suit the needs, preferences and contexts of farming households. Seed companies hold sorghum as an add-on in their portfolio, investing less resources and research into sorghum compared to more profitable crops such as vegetable and maize seeds. Significant political-economic obstacles exist that favor the support of cash crops such as maize and rice, limiting the growth and development of the private sector in the sorghum seed system. We conclude that future interventions should build on approaches that aim to develop more diverse channels of seed delivery in both the formal and informal seed systems, adopt a livelihoods perspective to evaluate the costs, benefits, and risks associated with the adoption of new technologies, and acknowledge that seed system interventions are only one out of a portfolio of interventions to generate rural development.

scholarly journals REVIEW OF FLIP BARRIER GATE IMPLEMENTATION IN IMPROVING THE QUALITY OF PASSPORT APPLICATION SERVICES IN THE KANTOR IMIGRASI KELAS II NON-TPI KEDIRI

2020 ◽  
Vol 2 (1) ◽  
pp. 25-32
Author(s):  
Muhammad Rizqi Ghozhali
Keyword(s):  
System Analysis ◽  
System Development ◽  
Development Planning ◽  
Design System ◽  
Development Theory ◽  
Online Application ◽  
Directorate General ◽  
System Maintenance ◽  
Gate System ◽  
Analysis System

The practice of brokering is one of the concerns felt by the community at immigration services. The Directorate General of Immigration immediately followed up on the report, and appealed to all technical units of immigration to eradicate brokering practices and the practice of extortion (illegal levies) on immigration services. In line with this appeal, the Directorate General of Immigration made an online application called APAPO. Kantor Imigrasi Kelas II Non-TPI Kediri in follow-up to the practice of extortion and brokering also built the Flip Barrier Gate system. This system utilizes the use of RFID (Radio Frequent Identification) technology embedded in the access card. However, over time, this system began to find some problems. Among the obstacles that have arisen are the inactivity of this system because it is feared that it will become the center of the spread of COVID-19 due to the alternating use of access cards. In this research, development planning is carried out for the Flip Barrier Gate Class II Non-TPI Kediri Immigration Office. Flip Barrier Gate is integrated with APAPO through the use of QR code booking code as an access reader. In development planning, this study uses the system development theory described by Tata Sutabri. This phase consists of 5 stages, namely, system investigation, system analysis, system design, system implementation, system maintenance.

scholarly journals Design and Implementation of a Computerized Drug Inventory Management Information System Using ASP.NET MVC

2020 ◽  
Vol 13 (4) ◽  
pp. 80-90
Author(s):  
Shaimaa K. Ahmed ◽  
Zobeda H. Naji ◽  
Yousif N. Hatif ◽  
Meaad Hussam
Keyword(s):  
Information System ◽  
Inventory Management ◽  
Management Information System ◽  
New Technologies ◽  
Early Stage ◽  
System Development ◽  
Management Information ◽  
Expiry Date ◽  
Iterative Model ◽  
Distribution Process

Automation in the drug inventory distribution process is helpful to pharmacist. Pharmacy management has kept paper record in filing cabinets. Managing a very large pharmacy with records on papers will be tedious and difficult to keep track ofinventories with regards to the drugs in the store, expiry date, quantity of drugs available based on the categories and their functions. A Drug Inventory Management Information System(DIMIS) is basically a computer system that can manage all the information to allow pharmacists to do their jobs faster and more effective in real time. These jobs include: dispensing of drugs, drug regulation, and the sale of these drugs. The developed methodology adopted in the implementation of the software is iterative model of system development life cycle. This method produces an early stage of model. The development of the system is based on using new technologies like AJAX, ASP.NET MVC 5, Bootstrap, HTML and CSS which make the user interface more interactive. C#.NET language was used as server language whereas as a database server Microsoft SQL server 2012 was utilized. DIMIS is able to search and check a huge number and expiration date of drug in the purchase as well as delivery records. These attributes and functions are powerful, efficient and subsequently useful in patient's safety and cost containment

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

scholarly journals Perancangan Sistem Informasi Akademis Perguruan Tinggi Berbasis Data DIKTI/EPSBED

2011 ◽  
Vol 2 (2) ◽  
pp. 771 ◽  
Author(s):  
Karto Iskandar ◽  
Reina Reina ◽  
Irma Irawati Ibrahim
Keyword(s):  
Systems Engineering ◽  
Process Design ◽  
System Development ◽  
Design System ◽  
Study Program ◽  
Business Process Design ◽  
Specific Data ◽  
Analysis And Design ◽  
Development Life Cycle ◽  
Academic Information

This research aims to help universities that do not have an academic information system and facilitate EPSBED data report to Directorate of Higher Education (DHE). The method used is the three first stages in the System Development Life Cycle (SDLC), which are systems engineering, requirements analysis, and design system. The result is a design of university business process, design of database, and design of user interface. This research finds that DHE has a specific data structure that can represent the basic activities of a study program. Therefore, this system design can be used for reporting of EPSBED data as well as for data collection of study program activities. 

Ontology Augmented Software Engineering

2013 ◽  
pp. 406-413
Author(s):  
Qazi Mudassar Ilyas
Keyword(s):  
Software Engineering ◽  
Semantic Web ◽  
System Integration ◽  
Software Maintenance ◽  
Domain Knowledge ◽  
System Development ◽  
Tracking System ◽  
Software Artifacts ◽  
Natural Choice ◽  
Development Life Cycle

Semantic Web was proposed to make the content machine-understandable by developing ontologies to capture domain knowledge and annotating content with this domain knowledge. Although, the original idea of semantic web was to make content on the World Wide Web machine-understandable, with recent advancements and awareness about these technologies, researchers have applied ontologies in many interesting domains. Many phases in software engineering are dependent on availability of knowledge, and the use of ontologies to capture and process this knowledge is a natural choice. This chapter discusses how ontologies can be used in various stages of the system development life cycle. Ontologies can be used to support requirements engineering phase in identifying and fixing inconsistent, incomplete, and ambiguous requirement. They can also be used to model the requirements and assist in requirements management and validation. During software design and development stages, ontologies can help software engineers in finding suitable components, managing documentation of APIs, and coding support. Ontologies can help in system integration and evolution process by aligning various databases with the help of ontologies capturing knowledge about database schema and aligning them with concepts in ontology. Ontologies can also be used in software maintenance by developing a bug tracking system based upon ontological knowledge of software artifacts and roles of developers involved in software maintenance task.

Advanced barrier and seed layer deposition enabling multiple type of TSVs integration

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000077-000103
Author(s):  
Thierry Mourier ◽  
Mathilde Gottardi ◽  
Pierre-Emile Philip ◽  
Sophie Verrun ◽  
Gilles Romero ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Seed Layer ◽  
Process Development ◽  
High Density ◽  
Process Equipment ◽  
Integration Schemes ◽  
Step Coverage ◽  
Wide Range ◽  
Silicon Thickness ◽  
Very High

TSV integration is a key technology allowing heterogeneous devices 3D integration. However, depending on the targeted application, various TSV sizes and integration schemes exist, all requesting very high aspect ratio. The most common integration is the Mid-process TSV for which aspect ratio is required to be higher than 10:1 whatever application. In the case of large interposers, silicon thickness has to be increased to limit the deformation of the substrate due to highly stressed devices. Same requirements are made by photonic interposers which use thick SOI substrate leading to high warpage during integration. In the opposite, imagers requires to save silicon surface thus reduce TSV size and keep out zone. Silicon thickness has to be kept in the 100 μm range leading then the aspect ratio of the TSV to increase. Recently, Hybrid bonding progresses allowed a new type of TSV to be introduced : High Density TSVs for imagers. In this application, micrometer range TSV have to be filled with a Silicon thickness reduction limited to 10 μm by grinding process control. In order to allow the metal filling of all those type of structures, we have developed a highly conformal barrier and seed layer processes using standard materials for easier integration. The process is based on the use of MOCVD TiN as a barrier. This material is deposited using TDMAT precursor which allows low temperature deposition (200 °C)[1] which extends also the polyvalence of the process toward polymer bonded integrations. The very high step coverage of this process, reported at more than 30% in 20:1 aspect ratio coupled to high resistance to copper diffusion allows as thin as 20 nm barrier thickness which appears relevant economically (for deposition and CMP) and for stress consideration, compared to the well known but thicker PVD TaN process. Considering seed layer, the eG3D process[2] was brought to a high maturity allowing it to be integrated in an applied material raider tool coupled to TSV filling reactors. This process, based on electrografting of copper has already proved a step coverage of more than 50% in 12:1 aspect ratio structures. The presented work shows that the same process requires only deposition parameters change to be able to fully cover 10×150 μm Mid-process TSV as well as 1×10 μm High density ones. The excellent step coverage of this process allowed as thin as 200 nm (for 10×120 μm TSVs) and 100 nm (for (1×10 μm ones) deposited thicknesses to ensure perfect coverage of the structures. eG3D process also has the ability to be used as a repair process for non-continuous widely used PVD Cu seed layers but also be deposited directly on the barrier material. These 2 layers were evaluated together in a 300mm TSV integration schemes of both 10×120 mid process and 1×10 μm High Density structures and qualified electrically. The paper will discuss the deposition process development leading to simultaneously allow copper filling of the very wide range of TSVs on the same process equipment and using the same chemicals. We will then present integration results as well as electrical test of TSV daisy chains of both mid and High density TSVs showing excellent yield for all TSV size and integration schemes.

scholarly journals High-Density Cell Arrays for Genome-Scale Phenotypic Screening

2019 ◽  
Vol 24 (3) ◽  
pp. 274-283 ◽  
Author(s):  
Vytaute Starkuviene ◽  
Stefan M. Kallenberger ◽  
Nina Beil ◽  
Tautvydas Lisauskas ◽  
Bastian So-Song Schumacher ◽  
...  
Keyword(s):  
New Technologies ◽  
High Density ◽  
Cell Array ◽  
Preclinical Development ◽  
Single Experiment ◽  
Efficient Manner ◽  
Cell Arrays ◽  
High Density Cell ◽  
High Degree ◽  
Genome Scale

Due to high associated costs and considerable time investments of cell-based screening, there is a strong demand for new technologies that enable preclinical development and tests of diverse biologicals in a cost-saving and time-efficient manner. For those reasons we developed the high-density cell array (HD-CA) platform, which miniaturizes cell-based screening in the form of preprinted and ready-to-run screening arrays. With the HD-CA technology, up to 24,576 samples can be tested in a single experiment, thereby saving costs and time for microscopy-based screening by 75%. Experiments on the scale of the entire human genome can be addressed in a real parallel manner, with screening campaigns becoming more comfortable and devoid of robotics infrastructure on the user side. The high degree of miniaturization enables working with expensive reagents and rare and difficult-to-obtain cell lines. We have also optimized an automated imaging procedure for HD-CA and demonstrate the applicability of HD-CA to CRISPR-Cas9- and RNAi-mediated phenotypic assessment of the gene function.

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