Advanced barrier and seed layer deposition enabling multiple type of TSVs integration

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000077-000103
Author(s):  
Thierry Mourier ◽  
Mathilde Gottardi ◽  
Pierre-Emile Philip ◽  
Sophie Verrun ◽  
Gilles Romero ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Seed Layer ◽  
Process Development ◽  
High Density ◽  
Process Equipment ◽  
Integration Schemes ◽  
Step Coverage ◽  
Wide Range ◽  
Silicon Thickness ◽  
Very High

TSV integration is a key technology allowing heterogeneous devices 3D integration. However, depending on the targeted application, various TSV sizes and integration schemes exist, all requesting very high aspect ratio. The most common integration is the Mid-process TSV for which aspect ratio is required to be higher than 10:1 whatever application. In the case of large interposers, silicon thickness has to be increased to limit the deformation of the substrate due to highly stressed devices. Same requirements are made by photonic interposers which use thick SOI substrate leading to high warpage during integration. In the opposite, imagers requires to save silicon surface thus reduce TSV size and keep out zone. Silicon thickness has to be kept in the 100 μm range leading then the aspect ratio of the TSV to increase. Recently, Hybrid bonding progresses allowed a new type of TSV to be introduced : High Density TSVs for imagers. In this application, micrometer range TSV have to be filled with a Silicon thickness reduction limited to 10 μm by grinding process control. In order to allow the metal filling of all those type of structures, we have developed a highly conformal barrier and seed layer processes using standard materials for easier integration. The process is based on the use of MOCVD TiN as a barrier. This material is deposited using TDMAT precursor which allows low temperature deposition (200 °C)[1] which extends also the polyvalence of the process toward polymer bonded integrations. The very high step coverage of this process, reported at more than 30% in 20:1 aspect ratio coupled to high resistance to copper diffusion allows as thin as 20 nm barrier thickness which appears relevant economically (for deposition and CMP) and for stress consideration, compared to the well known but thicker PVD TaN process. Considering seed layer, the eG3D process[2] was brought to a high maturity allowing it to be integrated in an applied material raider tool coupled to TSV filling reactors. This process, based on electrografting of copper has already proved a step coverage of more than 50% in 12:1 aspect ratio structures. The presented work shows that the same process requires only deposition parameters change to be able to fully cover 10×150 μm Mid-process TSV as well as 1×10 μm High density ones. The excellent step coverage of this process allowed as thin as 200 nm (for 10×120 μm TSVs) and 100 nm (for (1×10 μm ones) deposited thicknesses to ensure perfect coverage of the structures. eG3D process also has the ability to be used as a repair process for non-continuous widely used PVD Cu seed layers but also be deposited directly on the barrier material. These 2 layers were evaluated together in a 300mm TSV integration schemes of both 10×120 mid process and 1×10 μm High Density structures and qualified electrically. The paper will discuss the deposition process development leading to simultaneously allow copper filling of the very wide range of TSVs on the same process equipment and using the same chemicals. We will then present integration results as well as electrical test of TSV daisy chains of both mid and High density TSVs showing excellent yield for all TSV size and integration schemes.

Copper Electroplating for Damascene ULSI Interconnects

1998 ◽  
Vol 514 ◽  
Author(s):  
V. M. Dubin ◽  
S. Lopatin ◽  
S. Chen ◽  
R. Cheung ◽  
C. Ryu ◽  
...  
Keyword(s):  
Low Temperature ◽  
Aspect Ratio ◽  
Tensile Stress ◽  
High Aspect Ratio ◽  
Seed Layer ◽  
Cu Films ◽  
Step Coverage ◽  
Copper Electroplating ◽  
Electroplated Copper ◽  
Bottom Step

ABSTRACTCopper was electroplated on sputtered Cu seed layer with Ta diffusion barrier. We achieved enhanced Cu deposition at the bottom of trenches/vias and defect-free filling sub-0.5 μm trenches (down to 0.25 μm width) of high aspect ratio (up to 4:1). Large grains occupying the entire trench were observed. Bottom step coverage of electroplated copper in sub-0.5 μm trenches was estimated to be about 140%, while sidewalls step coverage was about 120%. Via resistance for sub-0.5 μm vias was measured to be below 0.55 Ω. Strong <111> texture, large grains, and low tensile stress were observed in electroplated Cu films and in-laid Cu lines after low temperature anneal.

High Density Foamed Cement Application for Channeling and Behind-the-Casing Flows Minimization in the Production Zone

2021 ◽  
Author(s):  
Alexey Vladimirovich Fomenkov ◽  
Ilya Igorevich Pinigin ◽  
Mikhail Alexandrovich Tsibulsky ◽  
Dmitry Yurievich Terentyev ◽  
Artem Alexandrovich Fedyanin
Keyword(s):  
Physical And Mechanical Properties ◽  
High Density ◽  
Process Equipment ◽  
Foaming Properties ◽  
Cement Slurry ◽  
Wide Range ◽  
Cement Sheath ◽  
Production Zone ◽  
Pilot Tests

Abstract This article describes the application of relatively high-density foamed cement for cementing wells in the Volga and Urals region. Good cementing practices with high density or conventional density cement slurry is required to ensure mud displacement in fluid saturated intervals of reservoir formations (Benge et al; 1982). With this requirement met, the cement column should circumferentially cover the annulus at this very interval which is exposed to the highest loads. However, due to limited physical and mechanical properties of conventional cement slurries in both liquid and solid state, in certain cases conventional slurries do not solve the problems encountered by the Customer, namely elimination of annular flow between the casing and cement sheath. High-density foamed cement is considered as an improved alternative to conventional cement slurries, and results in a high quality and durable sealing of gas and oil saturated production zones for the life of the well. Proprietary software and process equipment are used for the mixing of the foamed cement slurry with a variety of foaming properties. This process enables the use of a base cement slurry with higher density (up to 2.1 g/cm3) for delivering foamed cement slurries in a wide range of densities. To avoid possible cross flows behind the casing, pilot tests were conducted, where a conventional cement slurry (1.80–1.90 g/cm3) was replaced with a high-density foamed cement slurry with equivalent density with a foam quality of approx. 10% making the cement sheath elastic with improved adhesion to both the casing string and the formation (Spaulding et al; 2018). Pilot tests, incorporating the cementing of several production casings, were conducted where only foamed cement slurries with various foam quality were used in the entire cementing interval. No conventional (non-foamed) cement systems were used in these cases.

TEM study of boron additions to cobalt aluminide

1988 ◽  
Vol 46 ◽  
pp. 546-547
Author(s):  
Gerald B. Feldewerth
Keyword(s):  
High Temperature ◽  
Turbine Engines ◽  
Major Drawback ◽  
University Of Missouri ◽  
Specific Strength ◽  
Aerospace Applications ◽  
Wide Range ◽  
Ordered Alloys ◽  
The University ◽  
Very High

In recent years an increasing emphasis has been placed on the study of high temperature intermetallic compounds for possible aerospace applications. One group of interest is the B2 aiuminides. This group of intermetaliics has a very high melting temperature, good high temperature, and excellent specific strength. These qualities make it a candidate for applications such as turbine engines. The B2 aiuminides exist over a wide range of compositions and also have a large solubility for third element substitutional additions, which may allow alloying additions to overcome their major drawback, their brittle nature.One B2 aluminide currently being studied is cobalt aluminide. Optical microscopy of CoAl alloys produced at the University of Missouri-Rolla showed a dramatic decrease in the grain size which affects the yield strength and flow stress of long range ordered alloys, and a change in the grain shape with the addition of 0.5 % boron.

Features of the Christian values ​​system

2004 ◽  
pp. 21-29
Author(s):  
G.V. Pyrog
Keyword(s):  
Public Opinion ◽  
Religious Beliefs ◽  
Religious Values ◽  
Direct Influence ◽  
Moral Norms ◽  
Value System ◽  
Christian Religion ◽  
Mass Consciousness ◽  
Wide Range ◽  
Very High

In domestic scientific and public opinion, interest in religion as a new worldview paradigm is very high. Today's attention to the Christian religion in our society is connected, in our opinion, with the specificity of its value system, which distinguishes it from other forms of consciousness: the idea of ​​God, the absolute, the eternity of moral norms. That is why its historical forms do not receive accurate characteristics and do not matter in the mass consciousness. Modern religious beliefs do not always arise as a result of the direct influence of church preaching. The emerging religious values ​​are absorbed in a wide range of philosophical, artistic, ethical ideas, acting as a compensation for what is generally defined as spirituality. At the same time, the appeal to Christian values ​​became very popular.

DURCOMET 100

Alloy Digest ◽  
1993 ◽  
Vol 42 (2) ◽  
Keyword(s):  
Fracture Toughness ◽  
Wear Resistance ◽  
Corrosion Resistance ◽  
Mechanical Strength ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Annealed Condition ◽  
Excellent Corrosion Resistance ◽  
Wide Range ◽  
Very High

Abstract Durcomet 100 is an improved version of Alloy CD-4 MCu with better corrosion and wear resistance. The alloy is used in the annealed condition and possesses excellent corrosion resistance over a wide range of corrosion environments. Mechanical strength is also very high. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as fracture toughness. It also includes information on corrosion resistance as well as heat treating and joining. Filing Code: SS-540. Producer or source: Duriron Company Inc.

The Novel TEM Sample Preparation Approach for Targeted via with Barrier/Cu Seed Layer Inspection

2009 ◽  
Author(s):  
Wen-Fei Hsieh ◽  
Shih-Hsiang Tseng ◽  
Bo Min She
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Seed Layer ◽  
Target Location ◽  
Process Development ◽  
Process Integration ◽  
Ion Beam ◽  
Main Tool ◽  
Dual Beam ◽  
Sample Preparation Procedure

Abstract In this study, an FIB-based cross section TEM sample preparation procedure for targeted via with barrier/Cu seed layer is introduced. The dual beam FIB with electron beam for target location and Ga ion beam for sample milling is the main tool for the targeted via with barrier/Cu seed layer inspection. With the help of the FIB operation and epoxy layer protection, ta cross section TEM sample at a targeted via with barrier/Cu seed layer could be made. Subsequent TEM inspection is used to verify the quality of the structure. This approach was used in the Cu process integration performance monitor. All these TEM results are very helpful in process development and yield improvement.

Influencia de las condiciones de secado solar en la coloración de plantas medicinales

2019 ◽  
pp. 28-34
Author(s):  
Margarita Castillo-Téllez ◽  
Beatriz Castillo-Téllez ◽  
Juan Carlos Ovando-Sierra ◽  
Luz María Hernández-Cruz
Keyword(s):  
Medicinal Plants ◽  
Forced Convection ◽  
Rural Areas ◽  
Color Change ◽  
Drying Process ◽  
Scientific Medicine ◽  
Drying Time ◽  
Bacterial Proliferation ◽  
Wide Range ◽  
Very High

For millennia, humans have used hundreds of medicinal plants to treat diseases. Currently, many species with important characteristics are known to alleviate a wide range of health problems, mainly in rural areas, where the use of these resources is very high, even replacing scientific medicine almost completely. This paper presents the dehydration of medicinal plants that are grown in the State of Campeche through direct and indirect solar technologies in order to evaluate the influence of air flow and temperature on the color of the final product through the L* a* scale. b*, analyzing the activity of water and humidity during the drying process. The experimental results showed that the direct solar dryer with forced convection presents a little significant color change in a drying time of 400 min on average, guaranteeing the null bacterial proliferation and reaching a final humidity between 9 % and 11 %.

scholarly journals Separate Universe calibration of the dependence of halo bias on cosmic web anisotropy

2020 ◽  
Vol 499 (3) ◽  
pp. 4418-4431 ◽  
Author(s):  
Sujatha Ramakrishnan ◽  
Aseem Paranjape
Keyword(s):  
Dark Matter ◽  
High Precision ◽  
Gaussian Distribution ◽  
Initial Perturbation ◽  
Analytical Framework ◽  
Web Environment ◽  
Wide Range ◽  
Galaxy Assembly ◽  
Very High ◽  
Good Agreement

ABSTRACT We use the Separate Universe technique to calibrate the dependence of linear and quadratic halo bias b1 and b2 on the local cosmic web environment of dark matter haloes. We do this by measuring the response of halo abundances at fixed mass and cosmic web tidal anisotropy α to an infinite wavelength initial perturbation. We augment our measurements with an analytical framework developed in earlier work that exploits the near-lognormal shape of the distribution of α and results in very high precision calibrations. We present convenient fitting functions for the dependence of b1 and b2 on α over a wide range of halo mass for redshifts 0 ≤ z ≤ 1. Our calibration of b2(α) is the first demonstration to date of the dependence of non-linear bias on the local web environment. Motivated by previous results that showed that α is the primary indicator of halo assembly bias for a number of halo properties beyond halo mass, we then extend our analytical framework to accommodate the dependence of b1 and b2 on any such secondary property that has, or can be monotonically transformed to have, a Gaussian distribution. We demonstrate this technique for the specific case of halo concentration, finding good agreement with previous results. Our calibrations will be useful for a variety of halo model analyses focusing on galaxy assembly bias, as well as analytical forecasts of the potential for using α as a segregating variable in multitracer analyses.

scholarly journals High-resolution particle separation by inertial focusing in high aspect ratio curved microfluidics

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Javier Cruz ◽  
Klas Hjort
Keyword(s):  
High Resolution ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Biological Fluids ◽  
Essential Feature ◽  
Particle Separation ◽  
Size Difference ◽  
Inertial Focusing ◽  
Complex Samples ◽  
Wide Range

AbstractThe ability to focus, separate and concentrate specific targets in a fluid is essential for the analysis of complex samples such as biological fluids, where a myriad of different particles may be present. Inertial focusing is a very promising technology for such tasks, and specially a recently presented variant, inertial focusing in High Aspect Ratio Curved systems (HARC systems), where the systems are easily engineered and focus the targets together in a stable position over a wide range of particle sizes and flow rates. However, although convenient for laser interrogation and concentration, by focusing all particles together, HARC systems lose an essential feature of inertial focusing: the possibility of particle separation by size. Within this work, we report that HARC systems not only do have the capacity to separate particles but can do so with extremely high resolution, which we demonstrate for particles with a size difference down to 80 nm. In addition to the concept for particle separation, a model considering the main flow, the secondary flow and a simplified expression for the lift force in HARC microchannels was developed and proven accurate for the prediction of the performance of the systems. The concept was also demonstrated experimentally with three different sub-micron particles (0.79, 0.92 and 1.0 µm in diameter) in silicon-glass microchannels, where the resolution in the separation could be modulated by the radius of the channel. With the capacity to focus sub-micron particles and to separate them with high resolution, we believe that inertial focusing in HARC systems is a technology with the potential to facilitate the analysis of complex fluid samples containing bioparticles like bacteria, viruses or eukaryotic organelles.

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