Power Packaging Thermal and Stress Model for Quick Parametric Analyses

2017 ◽  
Author(s):  
L. M. Boteler ◽  
S. M. Miner
Keyword(s):  
Thermal Stresses ◽  
Thermal Analyses ◽  
Computational Time ◽  
Design Parameters ◽  
Power Module ◽  
Element Analysis ◽  
Resistor Network ◽  
Fea Model ◽  
Wide Range ◽  
Packaging Structure

This work presents an easy to use approach to quickly estimate the device temperatures and thermal stresses in a generic high power module. A low order model was developed in MATLAB using a combination of numerical-analytical approach and a 3D nodal resistor network to calculate device temperatures and thermal stresses. The model assumes a heat flux generated at the top of each device which is dissipated through the packaging structure and removed by convection. The temperature distribution is used to calculate thermal stresses throughout the package. This method eliminates computer aided drawings (CAD) in favor of numerical parameters that can be easily and quickly varied over a wide range. The resistor network solves quickly in MATLAB, enabling fast, iterative thermal analyses and design through parametric studies of the chip dimensions, number of chips, chip layout, material types, cooling solutions, etc. The model is adaptable to any number of devices and board layers. The MATLAB model reduced the computational time by 97% compared to an equivalent SOLIDWORKS finite element analysis (FEA) model and that does not include the time required to generate the CAD model and verify mesh convergence and mesh independence. Temperatures from the network model were within 5°C and stresses were within 30% of the values obtained from the FEA model. The ability to quickly assess the thermal and stress effects of a wide variety of power module design parameters during the initial design process, without the complexity of a full FEA analysis, with reasonable results can significantly improve the final module.

Electrothermal Characterization of Doped-Si Heated Microcantilevers Under Periodic Heating Operation

2016 ◽  
Vol 138 (5) ◽  
Author(s):  
Sina Hamian ◽  
Andrew M. Gauffreau ◽  
Timothy Walsh ◽  
Jungchul Lee ◽  
Keunhan Park
Keyword(s):  
Microelectromechanical Systems ◽  
Transfer Functions ◽  
Design Parameters ◽  
Periodic Heating ◽  
Element Analysis ◽  
Full Spectrum ◽  
Frequency Dependent ◽  
Thermal Transfer ◽  
Fea Model

This paper reports the frequency-dependent electrothermal behaviors of a freestanding doped-silicon heated microcantilever probe operating under periodic (ac) Joule heating. We conducted a frequency-domain finite-element analysis (FEA) and compared the steady periodic solution with 3ω experiment results. The computed thermal transfer function of the cantilever accurately predicts the ac electrothermal behaviors over a full spectrum of operational frequencies, which could not be accomplished with the 1D approximation. In addition, the thermal transfer functions of the cantilever in vacuum and in air were compared, through which the frequency-dependent heat transfer coefficient of the air was quantified. With the developed FEA model, design parameters of the cantilever (i.e., the size and the constriction width of the cantilever heater) and their effects on the ac electrothermal behaviors were carefully investigated. Although this work focused on doped-Si heated microcantilever probes, the developed FEA model can be applied for the ac electrothermal analysis of general microelectromechanical systems.

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

2018 ◽  
Author(s):  
L. M. Boteler ◽  
S. M. Miner
Keyword(s):  
Stress Analysis ◽  
High Voltage ◽  
Parametric Analysis ◽  
Thermal Stresses ◽  
Analysis Tool ◽  
Element Analysis ◽  
Module Design ◽  
Fast Running ◽  
Packaging Structure ◽  
Low Order

A low order fast running parametric analysis tool, ParaPower, was used to arrive at the design for a novel high voltage module. The low order model used a 3D nodal network to calculate device temperatures and thermal stresses. The model assumed heat flux generated near the top surface of each device which is then conducted through the packaging structure and removed by convection. The temperature distribution is used to calculate thermal stresses throughout the package. This co-design modeling tool, developed for rectilinear geometries, allowed a rapid evaluation of the package temperatures and CTE induced stresses throughout the design space. However, once the final design configuration was determined a detailed finite element analysis was performed to validate the design. This paper compares the results obtained using ParaPower to the FEA, demonstrating the usefulness of the parametric analysis tool. Results for both temperature and CTE induced stress are compared. Two different stress models are evaluated. One based on the more traditional planar module design, which assumes a substantial substrate or heat spreader on which the module is assembled. The other model is less restrictive, eliminating the requirement for a substrate. The FEA modeling was performed using SolidWorks beginning with a thermal analysis followed by a stress analysis based on the temperature solution. Both the values and the trends of the temperatures and stresses were evaluated. The temperature results agreed to within 3.2°C. The trends and sign of the stresses were correctly predicted, but the magnitudes were not. One of the significant advantages of ParaPower is the speed of the computation. The run time for the parametric analysis was roughly two orders of magnitude faster than the FEA. This made it possible to build the model and complete the parametric analysis of roughly 500 runs in less than a day.

Effect of Adhesive Thickness and Bonding Length on Behavior of Composite Adhesive Joints Subject to Torsion

2007 ◽  
Vol 124-126 ◽  
pp. 1313-1316
Author(s):  
Je Hoon Oh
Keyword(s):  
Finite Element Analysis ◽  
Thermal Stresses ◽  
Failure Modes ◽  
Adhesive Joints ◽  
Design Parameters ◽  
Stress Distributions ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Adhesive Thickness ◽  
Bonding Length

Combined thermal and mechanical analyses were used to investigate the effect of joint design parameters such as the adhesive thickness and bonding length on stress distributions and torque capacities of tubular adhesive joints with composite adherends. The finite element analysis was employed to calculate the residual thermal stresses due to fabrication, and the mechanical stresses were analyzed using the nonlinear analysis of tubular adhesive joints. The analyses reveal that the stacking angle, adhesive thickness and bonding length have a significant influence on residual thermal stresses, and consequently failure modes and joint strengths.

scholarly journals Multistage Tool Path Optimisation of Single-Point Incremental Forming Process

Materials ◽  
2021 ◽  
Vol 14 (22) ◽  
pp. 6794
Author(s):  
Zhou Yan ◽  
Hany Hassanin ◽  
Mahmoud Ahmed El-Sayed ◽  
Hossam Mohamed Eldessouky ◽  
Joy Rizki Pangestu Djuansjah ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Processing Time ◽  
Incremental Forming ◽  
Single Point ◽  
Computational Time ◽  
Single Point Incremental Forming ◽  
Two Stage ◽  
Element Analysis ◽  
Wide Range

Single-point incremental forming (SPIF) is a flexible technology that can form a wide range of sheet metal products without the need for using punch and die sets. As a relatively cheap and die-less process, this technology is preferable for small and medium customised production. However, the SPIF technology has drawbacks, such as the geometrical inaccuracy and the thickness uniformity of the shaped part. This research aims to optimise the formed part geometric accuracy and reduce the processing time of a two-stage forming strategy of SPIF. Finite element analysis (FEA) was initially used and validated using experimental literature data. Furthermore, the design of experiments (DoE) statistical approach was used to optimise the proposed two-stage SPIF technique. The mass scaling technique was applied during the finite element analysis to minimise the computational time. The results showed that the step size during forming stage two significantly affected the geometrical accuracy of the part, whereas the forming depth during stage one was insignificant to the part quality. It was also revealed that the geometrical improvement had taken place along the base and the wall regions. However, the areas near the clamp system showed minor improvements. The optimised two-stage strategy successfully decreased both the geometrical inaccuracy and processing time. After optimisation, the average values of the geometrical deviation and forming time were reduced by 25% and 55.56%, respectively.

Analysis of Unburied Pipeline Spans

2012 ◽  
Author(s):  
Lawrence M. Matta ◽  
Rhett Dotson
Keyword(s):  
Survey Data ◽  
Thermal Stresses ◽  
Ground Movement ◽  
Wind Loading ◽  
Longitudinal Stress ◽  
Element Analysis ◽  
Stress Evaluation ◽  
Safety Issues ◽  
Fea Model ◽  
Potential Safety

Support requirements for unburied spans on existing pipelines can be difficult to assess. An approach for investigating the adequacy of support of unburied spans is presented. It begins with a screening based on theoretical longitudinal stress evaluation. An estimate of the allowable free span lengths between supports is calculated, considering the weight of the pipe and its contents, longitudinal stresses from internal pressure, thermal stresses, and steady wind loading. Existing span lengths are compared to the allowable length and any segments exceeding the limit are flagged for further study. Review by finite element analysis and comparison with survey data for the identified spans is then performed. Comparison of the FEA model deflections and survey data can help determine whether “pre-existing stresses” or plastic deformations are present, due, for example, to installation procedures or ground movement. The FEA results provide a factor of safety that can be used to help identify potential safety issues and prioritize mitigation efforts.

Characterization of Tissue Scaffolds Fabricated by Rapid Prototyping Techniques Aided by Finite Element Analysis

2006 ◽  
Author(s):  
Andrew R. Thoreson ◽  
James J. Stone ◽  
Kurtis L. Langner ◽  
Jay Norton ◽  
Bor Z. Jang
Keyword(s):  
Finite Element ◽  
Computer Aided Design ◽  
Three Dimensional ◽  
Cartilage Regeneration ◽  
Element Model ◽  
Tissue Scaffolds ◽  
Design Parameters ◽  
Element Analysis ◽  
Apparent Modulus ◽  
Wide Range

Numerous techniques for fabricating tissue engineering scaffolds have been proposed by researchers covering many disciplines. While literature regarding properties and efficacy of scaffolds having a single set of design parameters is abundant, characterization studies of scaffold structures encompassing a wide range of design parameters are limited. A Precision Extrusion Deposition (PED) system was developed for fabricating poly-ε-caprolactone (PCL) tissue scaffolds having interconnected pores suitable for cartilage regeneration. Scaffold structures fabricated with three-dimensional printing methods are periodic and are readily modeled using Computer Aided Design (CAD) software. Design parameters of periodic scaffold architectures were identified and incorporated into CAD models with design parameters over the practical processing range represented. Solid models were imported into a finite element model simulating compression loading. Model deformation results were used to identify apparent modulus of elasticity of the structure. PCL scaffold specimens with design parameters within the modeled range were fabricated and subjected to compression testing to physically characterize scaffold modulus. Results of physical testing and finite element models were compared to determine effectiveness of the method.

Study on Thermal Stresses the Extreme Temperature in Bridge Deck Pavements Using FEM Analysis

2012 ◽  
Vol 482-484 ◽  
pp. 1718-1721
Author(s):  
Hai Bin Li ◽  
Yan Ping Sheng ◽  
Qian Wang
Keyword(s):  
Finite Element ◽  
Elastic Modulus ◽  
Thermal Stresses ◽  
Bridge Deck ◽  
Extreme Temperature ◽  
Fem Analysis ◽  
Maximum Principal Stress ◽  
Shear Stresses ◽  
Element Analysis ◽  
Wide Range

The thermal stresses at the extreme temperatures in bridge deck pavements (BDP) was analyzed in the paper. The sample bridge deck and asphalt concrete pavements were analyzed. The maximum principal and shear stresses in the BDP at the wide range of temperatures were calculated using 3D finite element method. The compared results showed a strong linear correlation between the BDP maximum principal stress and the elastic modulus. This linear relationship also existed between the shear stress and the elastic modulus. From the finite element analysis, it is found that the BDP elastic modulus affects the thermal stress more than the thickness of BDP. With the consideration of thermal stresses of BDP, the thickness of BDP from 6 to 12 cm is recommended for the BDP construction.

scholarly journals A comparison between hybrid method technique and transfer matrix method for design optimization of vehicle muffler

2021 ◽  
Vol 49 (2) ◽  
pp. 494-500
Author(s):  
Barhm Mohamad ◽  
Jalics Karoly ◽  
Andrei Zelentsov ◽  
Salah Amroune
Keyword(s):  
Transmission Loss ◽  
Complex Structure ◽  
Design Parameters ◽  
Element Analysis ◽  
Vehicle Noise ◽  
Race Car ◽  
Fea Model ◽  
Important Approach ◽  
Machine Analysis ◽  
Perforated Pipe

Hybrid mufflers are now commonly equipped to decrease vehicle noise and are a crucial tool for regulation of the acoustic system. In order to ensure optimum engine efficiency, the system is intended to dump the strength of the acoustic pulses generated from the engine, and the back pressure created by these systems must be held to a minimum. Typically, modern mufflers have a complex structure of chambers and flow paths. There are a number of mechanisms for sound dampening that operate to silence the sound flowing through a muffler and piping device. This research introduces an important approach to optimize the transmission loss of hybrid muffler Formula student race car (FS) by using both experimental and analytical methods. For this analysis, two methods of calculation were chosen. The muffler has a complex partition located within the muffler chamber, which is a perforated pipe. For the creation of the Finite Element Analysis (FEA) model in AVL BOOST solver and another commercial advanced design software, the muffler CAD file was developed. Experimental measurements using a two-load method validated the FEA model. Reliable tests were conducted to verify the design parameters and optimize the muffler's transmission loss (TL) after the model was checked. The findings of experimental and machine analysis are included in the paper. For different measurement methods, recommendations are made for achieving optimum transmission loss curves.

scholarly journals A hybrid method technique for design and optimization of Formula race car exhaust muffler

2020 ◽  
Vol 11 (2) ◽  
pp. 174-180
Author(s):  
Barhm Mohamad ◽  
Jalics Karoly ◽  
Andrei Zelentsov ◽  
Salah Amroune
Keyword(s):  
Computer Aided Design ◽  
Cfd Simulation ◽  
Fluid Dynamic ◽  
Design Parameters ◽  
Piping System ◽  
Element Analysis ◽  
Software Analysis ◽  
Race Car ◽  
Fea Model ◽  
Car Exhaust

AbstractIn this work a multilevel Computational Fluid Dynamics (CFD) analysis has been applied for the design of a Formula race car exhaust muffler with improved characteristics of sound pressure level (SPL) and fluid dynamic response. The approaches developed and applied for the optimization process range from the 1D to fully 3D CFD simulation, exploring hybrid approaches based on the integration of a 1D model with 3D tools. Modern mufflers typically have a complex system of chambers and flow paths. There are a variety of sound damping and absorbing mechanisms working to quiet the sound flowing through a muffler and piping system. Two calculation methods were selected for this study. The muffler has a complex inner structure containing perforated pipe and fiber material. Computer-aided design (CAD) file of the muffler was established for developing Finite Element Analysis (FEA) model in AVL BOOST v2017 and another commercial advanced design software (SolidWorks 2017). FEA model was made to monitor the flow properties, pressure and velocity. After the model was verified, sensitivity studies of design parameters were performed to optimize the SPL of the muffler. The software analysis results are included in the paper. Recommendations are made for obtaining smoother SPL curves for various measurement methods.

Engineering Applications of Satellite Structural Optimization Utilizing ANSYS/CATIA

2011 ◽  
Vol 110-116 ◽  
pp. 1567-1575
Author(s):  
Jia Mao ◽  
Wei Hua Zhang
Keyword(s):  
Optimization Design ◽  
Parametric Design ◽  
Reference Value ◽  
Optimization Method ◽  
Design Parameters ◽  
Element Analysis ◽  
Fea Model ◽  
Satellite Platform ◽  
Weight Design ◽  
Work Done

A structured frame for the design optimization problem of satellite platform structure was established through the definition, flow and modification research of design parameters in the ANSYS/CATIA system. Problems with creating complex satellite structure FEA (Finite Element Analysis) models were discussed, including the idealization of real structure, as well as embedment of APDL (ANSYS Parametric Design Language) programme developed specially for the pre-processing and post-processing of FEA model. The optimization model was established under structural design requirements, and a graded optimization method was applied for calculation. Light-weight design schemes for two satellite platform structure were obtained through the subsequently optimization implemented using approaches put forward previously. The optimization design problems of two satellite platform structure were settled well, and work done in this paper provides certain reference value for optimization of other spacecraft structures.

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