Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

2021 ◽  
Author(s):  
Chris May ◽  
Jordan Mizerak ◽  
David Earley ◽  
Bernard Malouin
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Large Scale ◽  
Heat Removal ◽  
High Heat ◽  
Stress Tests ◽  
Flow Loop ◽  
High Effectiveness ◽  
Power Draw ◽  
High Flexibility

Abstract As processors continually seek greater computational output, the traditional single die processor configuration is giving way to emerging multi-die processor assemblies. As a result, dies of varying powers are spatially distributed in processor packages, causing local areas of high heat density and non-uniform temperature patterns. If not properly addressed, local hot spots may limit the total device operating power, increase leakage current to lower processor efficiency, and accelerate thermal induced semiconductor deterioration to reduce device lifetime. In this article, a modular microconvective heat sink (M2HS) is developed as a high effectiveness, high flexibility cooling solution for multi-die assemblies. Microconvective cooling, featuring optimized single-phase impingement cooling and effluent fluid flow control, provides high power density heat removal from localized heat flux zones on semiconductor dies. An AMD Threadripper 3960X is chosen as a multi-die test vehicle for the M2HS to test thermal performance in a liquid cooled experimental flow loop. Experimental results in overclocked thermal stress tests are presented, achieving power draws of up to 75% higher than the nominal processor TDP. Further, compared to a recommended product pairing of the CPU serving as a baseline heat sink, the M2HS showed a 51% improvement in CPU power draw performance. When operating at nominal, non-overclocked conditions, reduced temperature operation of the CPU using M2HS solutions resulted in a CPU efficiency increase of up to 10% compared to the baseline heat sink, providing opportunities for reduced PUE in large scale data centers. The study concludes that the M2HS shows promise as a high effectiveness, implementation-friendly cooling solution for emerging multi-die processor assemblies.

Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices

2020 ◽  
Author(s):  
Gerardo Rojo ◽  
Jeff Darabi
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Computational Study ◽  
Copper Substrate ◽  
Heat Removal ◽  
Cost Effective ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Micropillar Array

Abstract Miniaturization of electronic products and a consequent rapid increase in power density of advanced microprocessors and electronic components have created a need for improved cooling techniques to efficiently remove heat from such devices. Traditional air-cooled heat sinks have been utilized for several decades as the most cost-effective cooling technique for electronic cooling applications. However, the existing thermal management solutions are unable to maintain the temperature of the next generation of complex electronic systems within acceptable limits without adding considerable weight and complexity. This paper reports a microstructured wick for application in passive thermal management systems such as heat pipes and vapor chambers. The wick structure consists of mushroom-like composite copper-carbon nanotubes (Cu-CNT) micropillars. The small spacing between micropillar heads provides a higher capillary pressure whereas the large spacing between the base of micropillars provides a higher permeability for liquid flow. The micropillar array was fabricated on a copper substrate using an electroplating technique. The micropillar array was then tested in a controlled environment to experimentally measure its thermal performance under several operating conditions. A heat removal capability of 80 W/cm2 was demonstrated at a wall superheat of 15° C. In addition, a computational study was performed using ANSYS Fluent to predict the thermal performance of the micropillar array. Model predictions were compared with the experimental results and good agreement was obtained.

scholarly journals Cooling Performance of a Novel Circulatory Flow Concentric Multi-Channel Heat Sink with Nanofluids

Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 647 ◽  
Author(s):  
Ravindra Jilte ◽  
Mohammad H. Ahmadi ◽  
Ravinder Kumar ◽  
Vilas Kalamkar ◽  
Amirhosein Mosavi
Keyword(s):  
Heat Sink ◽  
Volume Fraction ◽  
Removal Rate ◽  
Heat Removal ◽  
High Heat ◽  
Operating Conditions ◽  
Bottom Surface ◽  
Outlet Temperature ◽  
Cooling Performance ◽  
Heat Rejection

Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction.

Heat Transfer Analysis of Supercritical Methane in Microchannels with Different Geometric Configurations On High Power Electromechanical Actuator

2022 ◽  
Author(s):  
Zhigang Gao ◽  
Tianhu Wang ◽  
Yuxin Yang ◽  
Xiaolong Shang ◽  
Junhua Bai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Removal ◽  
Electrical Equipment ◽  
Heat Sinks ◽  
Electromechanical Actuator ◽  
Regenerative Cooling ◽  
Geometric Configurations

Abstract The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels is the microchannel heat sinks, which are thought as a prospective means of improving heat removal capacities on electrical equipment of smaller sizes. In this paper, three numerical models with different geometric configurations, namely straight, zigzag, and sinusoid respectively, are built to probe into the thermal hydraulic performance while heat transfer mechanism of supercritical methane in microchannel heat sinks for the heat removal of high-power electromechanical actuator is also explored. In addition, some crucial influence factors on heat transfer such as inlet Reynolds number, operating pressure and heating power are investigated. The calculation results imply the positive effect of wavy configurations on heat transfer and confirm the important effect of buoyancy force of supercritical methane in channels. The heat sinks with wavy channel show obvious advantages on comprehensive thermal performance including overall thermal performance parameter ? and thermal resistance R compared with that of the straight one. The highest Nu and average heat transfer coefficient am appear in the heat sink with zigzag channels, but the pumping power of the heat sink with sinusoidal channels is lower due to the smaller flow loss.

An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling

2010 ◽  
Author(s):  
Jingru Zhang ◽  
Shaurya Prakash ◽  
Yogesh Jaluria ◽  
Lei Lin
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Removal ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Flow Loop ◽  
Labview Software ◽  
Chemical Etch ◽  
Potential Applications

This paper presents the design, fabrication, and characterization of three different configurations of multiple microchannel heat sink devices to improve their overall cooling efficiency for potential applications in electronic cooling. A fabrication and packaging process based on standard UV-lithography, wet etching, and bonding was developed to allow a rapid parametric study. An anisotropic chemical etch with potassium hydroxide, water, and isopropanol is used to fabricate microchannels on (110)-oriented silicon wafers. PDMS (Polydimethylsiloxane) was tested as the cover of microchannels due to its mechanical flexibility. It is transparent so that the microchannel flow can be visualized using a microscope. An open flow loop, which consists of syringe pump and a power supply, was designed to test the heat sinks with different configurations. Temperature data were collected at different locations by a Data Acquisition (DAQ) system and recorded by Labview software to investigate the heat transfer characteristics of the heat sink. Three heat sinks, with different configurations, were tested. They all included microchannels of width 50 μm, depth 60 μm, and fin width 200 μm. Some Typical results on heat transfer are presented, along with discussion on the efficiency for heat removal.

scholarly journals Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling

Energies ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 6347
Author(s):  
Taha Baig ◽  
Zabdur Rehman ◽  
Hussain Ahmed Tariq ◽  
Shehryar Manzoor ◽  
Majid Ali ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Heat Removal ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Base Temperature ◽  
High Processing

Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20 %, 8.74 %, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.

Heat Transer Enhancement Using Flow-Induced Vibration of a Microfin Array

2000 ◽  
Author(s):  
Jeung Sang Go ◽  
Geunbae Lim ◽  
Hayong Yun ◽  
Junghyun Lee ◽  
Inseob Song ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Flow Velocity ◽  
Surface Area ◽  
Heat Sink ◽  
High Speed ◽  
Fluid Velocity ◽  
Heat Removal ◽  
High Heat ◽  
Thermal Engineering ◽  
Flow Induced Vibration

Abstract Advanced notebook computers are facing thermal engineering challenges from both the high heat generation with rapid performance improvement and the reduction of the available heat removal surface area. Efficient and compact cooling technology is desired to provide the reliable operation of the microelectronic devices. This paper investigates the feasibility of heat transfer enhancement in laminar flow using the flow-induced vibration of a microfin array without the additional consumption of battery power or the extension of heat removal surface area. The microfins are initially bent due to the residual stress difference. A high speed motion analyzer records the flow-induced vibration of the microfin array. Increase in flow velocity provides larger vibrating deflection and higher frequency of the microfin. We measure the thermal resistances to evaluate the thermal performance of the microfin heat sink and compare them with those of the plain-wall heat sink. For the fluid velocity of 4.4m/s, the thermal resistance of the microfin array heat sink is measured to be 4.45°C/W and that of the plain-wall heat sink 4.69°C/W, which indicates 5.5% cooling enhancement. At the flow velocity of 5.5m/s, the thermal resistance of the microfin array heat sink decreases by 11.5%.

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

2010 ◽  
Author(s):  
Paul Kalinowski ◽  
Edvin Cetegen ◽  
Serguei Dessiatoun ◽  
John Lawler
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
High Heat ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Groove Surface ◽  
Pressure Drops ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Low Profile

The development and testing of a new low-profile, air-cooled heat sink for use in cooling electronic modules are presented. This heat sink consists of a micro-groove surface with a special manifold that generated high heat transfer coefficients but low pressure drops. The optimization of the various geometries that make up a micro-grooved heat sink is discussed, as well as the various CFD simulations that were employed to estimate and optimize the thermal performance of a micro-grooved heat sink. The thermal performance of a prototype micro-grooved heat sink is compared with that of a finned heat sink. Other characteristics of the micro-grooved heat sinks will also be contrasted with the finned heat sink.

NUMERICAL ANALYSIS OF THE THERMAL PERFORMANCE OF A NOVEL DOUBLE-LAYERED HEAT SINK WITH STAGGERED PIN FINS

2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Pin Fins
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