Abstract
The paper displays the influencing factors, as well as the possibilities and challenges that come along with the process combination of selective laser melting (SLM) and heavy wire bonding. For the investigations, test samples were created from bronze powder on a SLM-machine. Then, 300 μm aluminum and copper wires were bonded on the SLM generated structures. Wire bonding capability is analyzed on untreated as well as on post-processed surfaces. The influence and effectiveness of various steps of post-processing such as cleaning, sandblasting and grinding are analyzed. Thus, interdependencies between both manufacturing process as well as the post-processing can be revealed. The effect of surface roughness and hardness of the assembly partner are investigated as well. To draw statistically backed conclusions, all tests are performed using DoE (Design of Experiment) studies. The primary characteristics besides the bond parameters that influence the wire bonding capability are focused in this paper. The process stability as well as the interconnection quality are evaluated by optical non-destructive laser microscopic analysis. Destructive pull and shear tests and metallographic cross sections are performed to evaluate the adhesion characteristics. The process stability and the yield obtained are important factors to describe the process and to evaluate the industrialization potential. By a profound understanding of all interdependencies between the two processes, a flexible manufacturing technology for power devices can be established.