Time-multiplexed, inductively coupled plasma process with separate SiCl[sub 4] and O[sub 2] steps for etching of GaAs with high selectivity
2005 ◽
Vol 23
(6)
◽
pp. 2444
◽
Keyword(s):
Improvement of the quality of analytical control of metallurgical products as a means of uncertainty
2020 ◽
Vol 130
(1)
◽
pp. 11-17
2005 ◽
Vol 198
(1-3)
◽
pp. 291-295
◽
Keyword(s):
2015 ◽
Vol 24
(4)
◽
pp. 922-930
◽
Keyword(s):
2004 ◽
Vol 33
(8)
◽
pp. 916-922
◽