A new high-speed image sensing technique based on an ordinary CCD

2007 ◽  
Author(s):  
Guotian He ◽  
Xiangzhao Wang ◽  
Dailin Li ◽  
Jianmin Hu
Keyword(s):  
2010 ◽  
Vol 437 ◽  
pp. 89-94 ◽  
Author(s):  
Liang Chia Chen ◽  
Abraham Mario Tapilouw ◽  
Sheng Lih Yeh ◽  
Shyh Tsong Lin ◽  
Jin Liang Chen ◽  
...  

White light interferometry has become an important method for measuring micro surface profiles with a long vertical range and nano-scale resolution. However, environmental vibration encountered in in-field optical inspection is usually unavoidable and it affects measurement performance significantly. Isolating vibration sources from the measurement system sometimes is not completely effective, especially within complicated in-field fabrication environment. Therefore, in this research we aim to develop a novel method in achieving white-light fringe-locking condition during vertical scanning processes. The developed optical system consists of white light source, a Mirau objective, a PZT vertical scanner, an optical band-pass filter and two image sensing devices. The developed system generates a high and a low coherent interferograms, simultaneously captured by two charged coupled devices (CCDs). The high coherent interferogram is employed to detect high-speed nano-scale displacement and direction of the external vibration. An innovative real time fringe-locking operation is performed and a new vertical scanning technique is performed accordingly to isolate vertical scanning from environmental disturbances. The feasibility of the anti-vibration VSI system is verified by performing some of industrial in-field examples. Based on the experimental result, the fringe locking technique can improve the measurement result.


Optik ◽  
2008 ◽  
Vol 119 (11) ◽  
pp. 548-552 ◽  
Author(s):  
Guotian He ◽  
Xiangzhao Wang ◽  
Dailin Li ◽  
Jianmin Hu
Keyword(s):  

Science ◽  
2013 ◽  
Vol 341 (6146) ◽  
pp. 640-643 ◽  
Author(s):  
Peng-Fei Wang ◽  
Xi Lin ◽  
Lei Liu ◽  
Qing-Qing Sun ◽  
Peng Zhou ◽  
...  

As the semiconductor devices of integrated circuits approach the physical limitations of scaling, alternative transistor and memory designs are needed to achieve improvements in speed, density, and power consumption. We report on a transistor that uses an embedded tunneling field-effect transistor for charging and discharging the semi-floating gate. This transistor operates at low voltages (≤2.0 volts), with a large threshold voltage window of 3.1 volts, and can achieve ultra–high-speed writing operations (on time scales of ~1 nanosecond). A linear dependence of drain current on light intensity was observed when the transistor was exposed to light, so possible applications include image sensing with high density and performance.


Author(s):  
E.D. Wolf

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.


Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.


Author(s):  
William Krakow

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.


Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.


Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions


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