Internal, translational, and angular momentum product state distributions of CuF molecules desorbing associatively from copper surfaces

1994 ◽  
Vol 72 (3) ◽  
pp. 643-651 ◽  
Author(s):  
A. Bracker ◽  
P. Jakob ◽  
U. Näher ◽  
M. Rüdiger ◽  
K. Sugawara ◽  
...  

The dry etching reaction of solid copper surfaces with fluorine atoms or molecules has been studied with laser-induced fluorescence spectroscopy. The reaction product, copper monofluoride, CuF, is produced in the X1Σ+ electronic ground state and desorbs into the gas phase at surface temperatures above approximately 750 K. Rotationally resolved LIF excitation spectra of the C1П ← X1Σ+ band system of CuF molecules desorbing from an isotopically purified 63Cu polycrystalline sample are obtained under conditions of coherent saturation. From the product state analysis it is deduced that the rovibrational product populations are in thermal equilibrium with the surface. The same holds for the translational velocity distribution obtained by Doppler-shift measurements. A pronounced polarization effect, particularly strong for Q branch transitions, can be traced back to photoselection of single-parity levels in the Λ doublets of the C1П state. A theoretical analysis for the distribution of J vectors, based on the formalism of Greene and Zare, shows that the measured degree of polarization is quantitatively in agreement with an isotropic distribution of rotational angular momentum vectors. The vibrational and translational product equilibration is not affected by changing the reactants from F2 molecules to F atoms, which increases the exoergicity of the overall reaction. The results are interpreted in terms of the absence of a barrier for desorption and a long residence time of the chemisorbed CuF molecules at the copper surface. The lack of any translational and rotational cooling is discussed within the framework of a model.

Author(s):  
Jan H. Kwapisz ◽  
Leszek Z. Stolarczyk

AbstractThe equilibrium carbon-carbon (C-C) bond lengths in π-electron hydrocarbons are very sensitive to the electronic ground-state characteristic. In the recent two papers by Stolarczyk and Krygowski (J Phys Org Chem, 34:e4154,e4153, 2021) a simple quantum approach, the Augmented Hückel Molecular Orbital (AugHMO) model, is proposed for the qualitative, as well as quantitative, study of this phenomenon. The simplest realization of the AugHMO model is the Hückel-Su-Schrieffer-Heeger (HSSH) method, in which the resonance integral β of the HMO model is a linear function the bond length. In the present paper, the HSSH method is applied in a study of C-C bond lengths in a set of 34 selected polycyclic aromatic hydrocarbons (PAHs). This is exactly the set of molecules analyzed by Riegel and Müllen (J Phys Org Chem, 23:315, 2010) in the context of their electronic-excitation spectra. These PAHs have been obtained by chemical synthesis, but in most cases no diffraction data (by X-rays or neutrons) of sufficient quality is available to provide us with their geometry. On the other hand, these PAHs are rather big (up to 96 carbon atoms), and ab initio methods of quantum chemistry are too expensive for a reliable geometry optimization. That makes the HSSH method a very attractive alternative. Our HSSH calculations uncover a modular architecture of certain classes of PAHs. For the studied molecules (and their fragments – modules), we calculate the values of the aromaticity index HOMA.


Author(s):  
Adam R. Girard ◽  
Jinsub Kim ◽  
Seung M. You

The effect of wettability on boiling heat transfer (BHT) coefficient and critical heat flux (CHF) in pool boiling of water on hydrophilic surfaces having different contact angles was investigated. Hot alkali solutions were utilized to promote cupric and cuprous oxide growth which exhibited micro and nanoscale structures on copper surfaces, with thicknesses on the order of a couple of micrometers. These structure and surface energy variations result in different levels of wettability and roughness while maintaining the effusivity of the bare copper surface. The study showed that the BHT coefficient has an inverse relationship to wettability; the BHT coefficient decreases as wettability increases. Furthermore, it was shown that this dependency between BHT coefficient and wettability is more significant than the relationship between BHT coefficient and surface roughness. The CHF was also found to increase with increases in wettability and roughness. For the most hydrophilic surface tested in this study, CHF values were recorded near the 2,000 kW/m2 mark. This value is compared with maximum values reported in literature for water on non-structured flat surfaces without area enhancements. Based on these results it is postulated that there exists a true hydrodynamic CHF limit for pool boiling with water on flat surfaces, very near 2,000 kW/m2, independent of heater material, representing an 80% increase in the limit suggested by Zuber [1].


2000 ◽  
Vol 612 ◽  
Author(s):  
G.P. Beyer ◽  
M. Baklanov ◽  
T. Conard ◽  
K. Maex

AbstractIt was found that copper surfaces, which had been exposed to a clean room atmosphere, were covered by a layer, whose chemical composition can be described by Cu(OH)2·CuCO3. This layer can effectively be removed by either a short thermal treatment in vacuum at 350°C, a hydrogen plasma treatment, or a combination of both. Ex-situ photoelectron spectroscopy measurements show little difference of the chemical composition of the surface after the respective treatments. The thermal treatment, however, gives rise to re-crystallisation of the copper film due to the difference in temperature of deposition and the anneal. Ex-situ ellipsometry measurements indicate that the hydrogen plasma not only removes Cu(OH)2·CuCO3 but also passivates the copper surface.


2009 ◽  
Vol 74 ◽  
pp. 133-136 ◽  
Author(s):  
Ang Xiao Fang ◽  
Jun Wei ◽  
Chen Zhong ◽  
Wong Chee Cheong

Typically, copper material is used as a bonding material in MEMs devices for its excellent mechanical, electrical and hermetic properties. Direct copper bonding, however, requires high temperature (>300°C) to forge a bond due to the oxidative nature of copper. In this study, using an alternative approach based on an organic monolayer coating, we demonstrate metallurgical bonding between two copper surfaces under ambient condition at low bonding temperature below 140°C, while maintaining reliable mechanical joint integrity of 50MPa. This monolayer is believed to behave as a passivation layer, protecting the copper surface against oxidation under ambient conditions. In contrast to a bulk oxide layer, this layer can be easily displaced during mechanical deformation at the bonding interface.


RSC Advances ◽  
2016 ◽  
Vol 6 (72) ◽  
pp. 68351-68356 ◽  
Author(s):  
Liang Cai ◽  
Xue-Qing Feng ◽  
Xin Hua ◽  
Xiao-Peng He ◽  
Yi-Tao Long ◽  
...  

Surface chelation has been demonstrated to be a promising strategy to address repulsion between protonated corrosion inhibitors and ionized copper surfaces in acids.


Author(s):  
Farooq Riaz Siddiqui ◽  
Chi Yan Tso ◽  
Sau Chung Fu ◽  
Huihe Qiu ◽  
Christopher Yu Hang Chao

Abstract Droplet evaporation is an efficient process as it removes a large amount of heat by using the latent energy, making it suitable for heat transfer applications. In this research, evaporation of the silver-graphene hybrid nanofluid (SGHF) droplet, because of its synergistic thermal conductivity, is investigated for substrate temperature in a range of 25–100 °C. The experiments for droplet evaporation were performed in an environmental facility for two droplet sizes, 3 μL and 30 μL volume, on a copper plate. A 100 W silicone heater mat was used to heat the copper plate from the underside, while two T-type thermocouples were used to monitor its surface temperature. As droplet evaporation ended, a porous residue was formed on the copper surface. Subsequently, a 3 μL volume of the SGHF droplet was dispensed on the porous residue surface. The results showed a tremendous rise in the evaporation rate (up to 160%) for the subsequent SGHF droplet sitting on the porous residue as compared to the non-wetted copper surface. Moreover, the evaporation rate of the SGHF droplet on the copper surface increased up to 56% as compared to the water droplet for a substrate temperature range of 25–100 °C.


Author(s):  
G. V. Korshin ◽  
J. F. Ferguson ◽  
M. E. Rock

Natural organic matter (NOM) is a ubiquitous and important component of natural waters. Polymeric species related to humus found in soils constitute the major part of NOM. NOM is of major importance for the speciation of metals in waters but its effects on metal corrosion are little known. The influence of NOM on the morphology of corroding copper surfaces is discussed in this communication. The studies were performed for copper coupons exposed for 7 weeks to waters supporting an intense localized corrosion attack called pitting. Two types of waters were used: highly mineralized water at pH close to 7.3 (water A) and soft water at pH close to 9.3 (water B). The morphology of the surface was examined using conventional photography and SEM (JEOL 5200). The range of accelerating voltages was from 10 to 25 kV.Profound effects of NOM on the state of the corroding copper surface were found.


Author(s):  
Robert C. Wetherhold ◽  
Elena Pisanova ◽  
Hani Alarifi

A simple spray method using a plain orifice atomizer has been developed for depositing γ-aminopropyltriethoxysilane (APS) from solutions in water and in methanol onto copper surfaces. The peel strengths between copper foil and epoxy resin were measured with and without APS deposition. In all cases, a higher concentration of APS gives higher peel strength. APS applied from 1 wt% solution in methanol resulted in higher peel strength than when applied from a 1 wt% aqueous solution; the opposite was true with 0.2 wt% APS solutions, indicating a trade-off between deposited APS film thickness and surface coverage. APS was very effective when chemisorption occurred at the surface but much less effective when there was only physisorption. A study of the fracture surfaces showed that the failure is cohesive, inside the epoxy layer, and that the deposited APS on the copper surfaces had a long-range effect which was seen deep in the epoxy layer, well away from the copper surface.


Author(s):  
Mayank Modak ◽  
Vishal Nirgude ◽  
Avadhesh K. Sharma ◽  
Santosh K. Sahu

In the present work an attempt has been made to study the heat transfer characteristics of single circular jet on a variety of enhanced surfaces. In the present investigation three different copper target surfaces of various surface modifications: bare copper surface, pin fin enhancement surface and a flat surface coated with alumina porous layer. The heat transfer performance of each surface is studied in two phase boiling operation at different flow rates (3959 < Re < 7900). The comparison indicates that both the surface modification have enhanced the boiling heat transfer rates.


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