Electro-optical Characteristics of Inductively Coupled Plasma by Ar Gas Pressure and RF Power

2005 ◽  
Author(s):  
Yong-Sung Choi ◽  
Jong-Chan Lee ◽  
Sang-Heon Lee ◽  
Dae-Hee Park
Keyword(s):  
Inductively Coupled Plasma ◽  
Gas Pressure ◽  
Optical Characteristics ◽  
Rf Power ◽  
Inductively Coupled ◽  
Ar Gas

scholarly journals Optical Diagnostics for a High.Power, RF-Inductively Coupled Plasma

1988 ◽  
Vol 117 ◽  
Author(s):  
N. S. Nogar ◽  
G. L. Keaton ◽  
J. E. Anderson ◽  
M. Trkula
Keyword(s):  
Flow Rate ◽  
Inductively Coupled Plasma ◽  
Emission Spectroscopy ◽  
Local Thermodynamic Equilibrium ◽  
Laser Induced Fluorescence ◽  
Rf Power ◽  
Inductively Coupled ◽  
Spatially Resolved ◽  
Hull Design ◽  
Ar Gas

AbstractEmission spectroscopy and laser-induced fluorescence have been used to monitor the field and tail-flame regions of a Hull-design 1 inductively coupled plasma. This plasma is used for a variety of syntheses 2,3 including SiC, TiC, BN, AlN and diamond. Temporallyand spatially-resolved spectra of both pure Ar and Ar/gas mixtures have been studied as a function of RF power, pressure and flow rate. Preliminary data suggest that the system is far from local thermodynamic equilibrium.

Inductively Coupled Plasma Etching of Pt/Ti Electrodes in Cl-Based Plasma

2013 ◽  
Vol 721 ◽  
pp. 346-349
Author(s):  
Zhi Qin Zhong ◽  
Cheng Tao Yang ◽  
Guo Jun Zhang ◽  
Shu Ya Wang ◽  
Li Ping Dai
Keyword(s):  
Process Parameters ◽  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Etch Rate ◽  
Dry Etching ◽  
Rf Power ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled ◽  
High Etch Rate ◽  
Ar Gas

Dry etching of Pt/Ti film was carried out using Cl2/Ar plasmas in an inductively coupled plasma (ICP) reactor. The influence of the various process parameters, such as RIE power, ICP power and Cl2/Ar gas mixing ratio, on the etch rate and selectivity of photoresist to Pt/Ti film were investigated systematically and optimized. It was revealed that the etch rate and the selectivity strongly depended on the key process parameters. The etch rate was found to increase dramatically with increasing of RIE power and ICP power. But by changing the ratio of Cl2 to the total gas, the maximum etch rate could be obtained at the proper ratio of 20%. The results also indicated too low or too high RIE power and the Cl2 ratio was detrimental to the selectivity. The optimized parameters of Pt/Ti dry etching for high etch rate and low selectivity of photoresist to Pt/Ti were obtained to be pressure: 10mT, RF power: 250W, ICP power: 0W, Cl2: 8sccm (standard cubic centimeters per minute), Ar: 32sccm.

scholarly journals Sidewall Slope Control of InP Via Holes for 3D Integration

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 89
Author(s):  
Jongwon Lee ◽  
Kilsun Roh ◽  
Sung-Kyu Lim ◽  
Youngsu Kim
Keyword(s):  
Inductively Coupled Plasma ◽  
Sio2 Layer ◽  
Etch Depth ◽  
Rf Power ◽  
3D Integration ◽  
Inductively Coupled ◽  
Wide Range ◽  
Via Holes ◽  
Dry Etch ◽  
Icp Etcher

This is the first demonstration of sidewall slope control of InP via holes with an etch depth of more than 10 μm for 3D integration. The process for the InP via holes utilizes a common SiO2 layer as an InP etch mask and conventional inductively coupled plasma (ICP) etcher operated at room temperature and simple gas mixtures of Cl2/Ar for InP dry etch. Sidewall slope of InP via holes is controlled within the range of 80 to 90 degrees by changing the ICP power in the ICP etcher and adopting a dry-etched SiO2 layer with a sidewall slope of 70 degrees. Furthermore, the sidewall slope control of the InP via holes in a wide range of 36 to 69 degrees is possible by changing the RF power in the etcher and introducing a wet-etched SiO2 layer with a small sidewall slope of 2 degrees; this wide slope control is due to the change of InP-to-SiO2 selectivity with RF power.

Plasma and electrical characteristics depending on an antenna position in an inductively coupled plasma with a passive resonant antenna

2021 ◽  
Author(s):  
Ju Ho Kim ◽  
Chin-Wook Chung
Keyword(s):  
Inductively Coupled Plasma ◽  
Metal Plate ◽  
Electrical Characteristics ◽  
Coupling Loss ◽  
Rf Power ◽  
Ion Density ◽  
Electron Kinetics ◽  
Inductively Coupled ◽  
Cylindrical Reactor ◽  
Antenna Position

Abstract We investigated the plasma and electrical characteristics depending on the antenna position in an inductively coupled plasma with a passive resonant antenna. When the powered antenna and passive resonant antenna are installed near the top plate and in the middle of the cylindrical reactor (Setup A), respectively, the ion density at the resonance is about 2.4 times to 9 times higher than that at non-resonance. This is explained by the reduction in power loss in the powered antenna (including the matching circuits) and the increase in power absorbed by the plasma discharge. However, when the powered antenna and passive resonant antenna are interchanged (Setup B), the ion density at the resonance is not significantly different from that at the non-resonance. When RF power is changed from 50 W to 200 W, the ion density at the resonance of Setup B is 1.6 times to 5.4 times higher than at the non-resonance of Setup A. To analyse this difference, the profile of the z-axis ion density is measured and the electric and magnetic field simulations are investigated. The results are discussed along with the electron kinetics effect and the coupling loss between the antenna and the metal plate.

scholarly journals Impact of Inductively Coupled Plasma Etching Conditions on the Formation of Semi-Polar ( 11 2 ¯ 2 ) and Non-Polar ( 11 2 ¯ 0 ) GaN Nanorods

Nanomaterials ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 2562
Author(s):  
Pierre-Marie Coulon ◽  
Peng Feng ◽  
Tao Wang ◽  
Philip A. Shields
Keyword(s):  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Defect Density ◽  
Rf Power ◽  
Resonant Cavities ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Dc Bias ◽  
The Impact

The formation of gallium nitride (GaN) semi-polar and non-polar nanostructures is of importance for improving light extraction/absorption of optoelectronic devices, creating optical resonant cavities or reducing the defect density. However, very limited studies of nanotexturing via dry etching have been performed, in comparison to wet etching. In this paper, we investigate the formation and morphology of semi-polar (112¯2) and non-polar (112¯0) GaN nanorods using inductively coupled plasma (ICP) etching. The impact of gas chemistry, pressure, temperature, radio-frequency (RF) and ICP power and time are explored. A dominant chemical component is found to have a significant impact on the morphology, being impacted by the polarity of the planes. In contrast, increasing the physical component enables the impact of crystal orientation to be minimized to achieve a circular nanorod profile with inclined sidewalls. These conditions were obtained for a small percentage of chlorine (Cl2) within the Cl2 + argon (Ar) plasma combined with a low pressure. Damage to the crystal was reduced by lowering the direct current (DC) bias through a reduction of the RF power and an increase of the ICP power.

scholarly journals Bulk Synthesis and Characterization of Ti3Al Nanoparticles by Flow-Levitation Method

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Shanjun Chen ◽  
Yan Chen ◽  
Huafeng Zhang ◽  
Yongjian Tang ◽  
Jianjun Wei ◽  
...  
Keyword(s):  
Inductively Coupled Plasma ◽  
Synthesis Method ◽  
Atomic Emission ◽  
Hexagonal Structure ◽  
Emission Spectrometry ◽  
Plasma Atomic Emission Spectrometry ◽  
X Ray ◽  
Inductively Coupled ◽  
Al Nanoparticles ◽  
Ar Gas

A novel bulk synthesis method for preparing high pure Ti3Al nanoparticles was developed by flow-levitation method (FL). The Ti and Al vapours ascending from the high temperature levitated droplet were condensed by cryogenic Ar gas under atmospheric pressure. The morphology, crystalline structure, and chemical composition of Ti3Al nanoparticles were, respectively, investigated by transmission electron microscopy, X-ray diffraction, and inductively coupled plasma atomic emission spectrometry. The results indicated that the Ti3Al powders are nearly spherical-shaped, and the particle size ranges from several nanometers to 100 nm in diameter. Measurements of the d-spacing from X-ray (XRD) and electron diffraction studies confirmed that the Ti3Al nanoparticles have a hexagonal structure. A thin oxidation coating of 2-3 nm in thickness was formed around the particles after exposure to air. Based on the XPS measurements, the surface coating of the Ti3Al nanoparticles is a mixture of Al2O3and TiO2. The production rate of Ti3Al nanoparticles was estimated to be about 3 g/h. This method has a great potential in mass production of Ti3Al nanoparticles.

scholarly journals Computational Fluid Dynamics (CFD) Simulations and Experimental Measurements in an Inductively-Coupled Plasma Generator Operating at Atmospheric Pressure: Performance Analysis and Parametric Study

Processes ◽  
2019 ◽  
Vol 7 (3) ◽  
pp. 133 ◽  
Author(s):  
Sangeeta Punjabi ◽  
Dilip Barve ◽  
Narendra Joshi ◽  
Asoka Das ◽  
Dushyant Kothari ◽  
...  
Keyword(s):  
Fluid Dynamics ◽  
Atmospheric Pressure ◽  
Inductively Coupled Plasma ◽  
Gas Flow ◽  
Rf Power ◽  
Gas Flow Rate ◽  
Inductively Coupled ◽  
Plasma Resistance ◽  
Computational Fluid Dynamics Cfd ◽  
Icp Torch

In this article, electrical characteristics of a high-power inductively-coupled plasma (ICP) torch operating at 3 MHz are determined by direct measurement of radio-frequency (RF) current and voltage together with energy balance in the system. The variation of impedance with two parameters, namely the input power and the sheath gas flow rate for a 50 kW ICP is studied. The ICP torch system is operated at near atmospheric pressure with argon as plasma gas. It is observed that the plasma resistance increases with an increase in the RF-power. Further, the torch inductance decreases with an increase in the RF-power. In addition, plasma resistance and torch inductance decrease with an increase in the sheath gas flow rate. The oscillator efficiency of the ICP system ranges from 40% to 80% with the variation of the Direct current (DC) powers. ICP has also been numerically simulated using Computational Fluid Dynamics (CFD) to predict the impedance profile. A good agreement was found between the CFD predictions and the impedance experimental data published in the literature.

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