A Novel Darlington-Based 8T CNTFET SRAM Cell for Low Power Applications

2021 ◽  
pp. 2150213
Author(s):  
M. Elangovan
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Simulation Tool ◽  
Stanford University ◽  
Memory Cells ◽  
Power Performance ◽  
Dynamic Power ◽  
Memory Design ◽  
Noise Margin ◽  
Sram Cell

The design of low power memory cells is the dream of engineers in memory design. A Darlington-based 8T CNTFET SRAM cell is suggested in this paper. It is called the proposed P_CNTFET Darlington 8T SRAM Cell. Compared with that of the traditional 6T and 8T CNTFET SRAM cells, the power and noise performances of the proposed SRAM cell are comparable. Compared to the traditional SRAM cells, the write, hold, read and dynamic power consumption of the proposed cell is much lower. The CNTFET parameters are optimized to boost the noise margin performance of the suggested bit cell. For optimized parameters, the power consumption and SNM of the proposed cell are compared with conventional cells. In contrast to the conventional cells, the HSNM and WSNM of the proposed cell are improved by 6.25% and 66.6%. The proposed cell’s RSNM is 38% greater than the traditional 6T SRAM cell. The proposed cell’s RSNM is 3.33% less than the traditional 8T SRAM cell. MOSFET is also used to implement the proposed SRAM cell and its noise margin and power performance are compared with traditional MOSFET-based SRAM cells. As with the conventional cells, the MOSFET-based implementation of the proposed cell power and SNM performance is also very good. The simulation is done with the HSPICE simulation tool using the Stanford University 32[Formula: see text]nm CNTFET model.

High Stable and Low Power 10T CNTFET SRAM Cell

2019 ◽  
Vol 29 (10) ◽  
pp. 2050158
Author(s):  
M. Elangovan ◽  
K. Gunavathi
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Large Scale ◽  
Supply Voltage ◽  
Memory Cell ◽  
Vlsi Circuits ◽  
Order Effects ◽  
Power Performance ◽  
Sram Cell ◽  
Nanoscale Range

The ultimate aim of a memory designer is to design a memory cell which could consume low power with high data stability in the deep nanoscale range. The implementation of Very Large-Scale Integration (VLSI) circuits using MOSFETs in nanoscale range faces many issues such as increasing of leakage power and second-order effects that are easily affected by the PVT variation. Hence, it is essential to find the best alternative of MOSFET for deep submicron design. The Carbon Nanotube Field Effect Transistor (CNTFET) can eradicate all the demerits of MOSFET and be the best replacement of MOSFET for nanoscale range design. In this paper, a 10T CNTFET Static Random Access Memory (SRAM) cell is proposed. The power consumption and Static Noise Margin (SNM) are analyzed. The power consumption and stable performance of the proposed 10T CNTFET SRAM cell are compared with that of conventional 10T CNTFET SRAM cell. The power and stability analyses of the proposed 10T and conventional 10T CNTFET SRAM cells are carried out for the CNTFET parameters such as pitch and chiral vector ([Formula: see text]). The power and SNM analyses are carried out for [Formula: see text]20% variation of oxide thickness (Hox), different dielectric constant (Kox). The supply voltage varies from 0.9[Formula: see text]V to 0.6[Formula: see text]V and temperature varies from 27∘C to 125∘C. The simulation results show that the proposed 10T CNTFET SRAM cell consumes lesser power than conventional 10T CNTFET SRAM cell during the write, hold and read modes. The write, hold and read stability of the proposed 10T CNTFET SRAM cell are higher as compared with that of conventional 10T CNTFET SRAM. The conventional and proposed 10T SRAM cells are also implemented using MOSFET. The stability and power performance of proposed 10T SRAM cell is also as good as conventional 10T SRAM for MOSFET implementation. The proposed 10T SRAM cell consumes lesser power and gives higher stability than conventional 10T SRAM cell in both CNTFET and MOSFET implementation. The simulation is carried out using Stanford University 32[Formula: see text]nm CNTFET model in HSPICE simulation tool.

Analysis of 6T SRAM Cell in Different Technologies

2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda
Keyword(s):  
Low Power ◽  
Data Storage ◽  
Low Voltage ◽  
Random Access ◽  
Storage Device ◽  
Cmos Process ◽  
Process Technology ◽  
Digital Devices ◽  
Noise Margin ◽  
Sram Cell

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).

scholarly journals Restoration circuits for Low power Reduce Swing of 6T and 8T SRAM Cell With Improved Read and Write Margins

2021 ◽  
Vol 7 ◽  
pp. 22-34
Author(s):  
Vinod Kumar ◽  
Ram Murti Rawat
Keyword(s):  
Low Power ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Equivalent Time ◽  
Sram Cell ◽  
Section Viii ◽  
Static Noise

A paper that examines the factors thataffect the Static Noise Margin (SNM) of a StaticRandom Access memories. At an equivalent time,they specialise in optimizing Read and Writeoperation of 8T SRAM cell which is best than 6TSRAM cell Using Swing Restoration Dual NodeVoltage. The read and Write operation and improveStability analysis. This SRAM technique on thecircuit or architecture level is required to improveread and write operation. during this paperComparative Analysis of 6T and 8T SRAM Cellswith Improved Read and Write Margin is completedfor 180 nm Technology with Cadence Virtuososchematics Tool.This Paper is organized as follows: thecharacteristics of 6T SRAM cell are described arerepresented in section VIII. In section IX, proposed8T SRAM cell is described. In section X, Standard8T SRAM cell is described. Section XI includes thesimulation results which give comparison of variousparameters of 6T and 8T SRAM cells. In Section XIISimulation Results and DC analysis and sectionXIII conclusion the work.

scholarly journals Encoding Schemes for Reducing Transition Activity and Power Consumption in VLSI Interconnects-A Review

2018 ◽  
Vol 7 (3.1) ◽  
pp. 34
Author(s):  
Vithyalakshmi. N ◽  
Nagarajan P ◽  
Ashok Kumar.N ◽  
Vinoth. G.S
Keyword(s):  
Energy Dissipation ◽  
Power Consumption ◽  
Low Power ◽  
Vlsi Design ◽  
Low Power Design ◽  
System Size ◽  
Vlsi Circuits ◽  
Portable Devices ◽  
Dynamic Power ◽  
Transition Activity

Low power design is a foremost challenging issue in recent applications like mobile phones and portable devices. Advances in VLSI technology have enabled the realization of complicated circuits in single chip, reducing system size and power utilization. In low power VLSI design energy dissipation has to be more significant. So to minimize the power consumption of circuits various power components and their effects must be identified. Dynamic power is the major energy dissipation in micro power circuits. Bus transition activity is the major source of dynamic power consumption in low power VLSI circuits. The dynamic power of any complex circuits cannot be estimated by the simple calculations. Therefore this paper review different encoding schemes for reduction of transition activity and power dissipation. 

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