Analysis of 6T SRAM Cell in Different Technologies

2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).

Sensors ◽  
2021 ◽  
Vol 21 (19) ◽  
pp. 6591
Author(s):  
Ming-Hwa Sheu ◽  
Chang-Ming Tsai ◽  
Ming-Yan Tsai ◽  
Shih-Chang Hsia ◽  
S. M. Salahuddin Morsalin ◽  
...  

An innovative and stable PNN based 10-transistor (10T) static random-access memory (SRAM) architecture has been designed for low-power bit-cell operation and sub-threshold voltage applications. The proposed design belongs to the following features: (a) pulse control based read-assist circuit offers a dynamic read decoupling approach for eliminating the read interference; (b) we have utilized the write data-aware techniques to cut off the pull-down path; and (c) additional write current has enhanced the write capability during the operation. The proposed design not only solves the half-selected problems and increases the read static noise margin (RSNM) but also provides low leakage power performance. The designed architecture of 1-Kb SRAM macros (32 rows × 32 columns) has been implemented based on the TSMC-40 nm GP CMOS process technology. At 300 mV supply voltage and 10 MHz operating frequency, the read and write power consumption is 4.15 μW and 3.82 μW, while the average energy consumption is only 0.39 pJ.


2021 ◽  
Vol 3 (4) ◽  
Author(s):  
S. Chrisben Gladson ◽  
Adith Hari Narayana ◽  
V. Thenmozhi ◽  
M. Bhaskar

AbstractDue to the increased processing data rates, which is required in applications such as fifth-generation (5G) wireless networks, the battery power will discharge rapidly. Hence, there is a need for the design of novel circuit topologies to cater the demand of ultra-low voltage and low power operation. In this paper, a low-noise amplifier (LNA) operating at ultra-low voltage is proposed to address the demands of battery-powered communication devices. The LNA dual shunt peaking and has two modes of operation. In low-power mode (Mode-I), the LNA achieves a high gain ($$S21$$ S 21 ) of 18.87 dB, minimum noise figure ($${NF}_{min.}$$ NF m i n . ) of 2.5 dB in the − 3 dB frequency range of 2.3–2.9 GHz, and third-order intercept point (IIP3) of − 7.9dBm when operating at 0.6 V supply. In high-power mode (Mode-II), the achieved gain, NF, and IIP3 are 21.36 dB, 2.3 dB, and 13.78dBm respectively when operating at 1 V supply. The proposed LNA is implemented in UMC 180 nm CMOS process technology with a core area of $$0.40{\mathrm{ mm}}^{2}$$ 0.40 mm 2 and the post-layout validation is performed using Cadence SpectreRF circuit simulator.


Author(s):  
Mohd Tafir Mustaffa

Comparator is one of the main blocks that play a vital task in the performance of analog to digital converters (ADC) in all modern technology devices. High-speed devices with low voltage and low power are considered essential for industrial applications. The design of a low-power comparator with high speed is required to accomplish the requirements mostly in electronic devices that are necessary for high-speed ADCs. However, a high-speed device that leads the scaling down of CMOS process technology will consume more power. Thus, power reduction techniques such as multi-threshold super cut-off stack (MTSCStack), dual-threshold transistor stacking (DTTS), a bulk-driven, and a bulk-driven differential pair were studied in this work. This study aims to find and build the combination of these techniques to produce a comparator that can operate in low power without compromising existing performance using the 0.13-µm CMOS process. A comparator with a combination of MTSCStack, DTTS, and NMOS bulk-driven differential pair shows the most promising result of 6.29 µW for static power, 17.15 µW for dynamic power, and 23.44 µW for total power.


2021 ◽  
Author(s):  
Pratibha Aggarwal ◽  
Bharat Garg

Abstract Adders are one of the most important digital components used in any arithmetic applications. Many improvements in past have been made to improve its architecture. In this paper, we present two new symmetric designs for Energy efficient full adder cells featuring GDI (Gate-Diffusion Input) logic. The main design objectives for these adder modules are to operate at Low-Power with reduced area but also provide full-voltage swing. In the first (AEG-FA) design, a new approach of Inverted and Non-Inverted Carry-ins were taken to give complementary Carry-out and Sum with desired performance. These were then applied in different combinations to form higher bit width Adder architecture. This provides a higher degree of design freedom to target a wide range of applications, hence reducing design efforts. The second (PEG-FA) design is based on conventional approach which tries to reduce the critical path delay and lower switching activity in GDI circuit, providing Low-Power and high speed digital component at full voltage swing circuit. Many of the previously reported adders in literature suffered from the problems of low-swing and high noise when operated at low supply voltages. These two new designs successfully operate at low voltage with high signal integrity and driving capability. In order to evaluate the performance of proposed full adders, we incorporated 8-bit ripple carry adders. The studied circuits are optimized for energy efficiency using 45 nm CMOS process technology. The comparison between these novel circuits with standard full adder cells shows improvement in terms of Area, Delay, Power and Power-Delay-Product (PDP), Area-Delay Product (ADP), Area-Power Product (APP). At architecture level proposed adder shows 12.8% over CMOS, 14.8% over hybrid and 11.4% over other GDI logic power savings, by having almost 55% reduction in area.


2019 ◽  
Vol 8 (4) ◽  
pp. 10650-10653

The main aim of electronics is to design low power devices due to the prevalent usage of powered gadget. Ultra low voltage operation of memory cells has become a subject of a lot of interest because of its applications in terribly low energy computing. The stable operation of static random access memory (SRAM) is important for the success of low voltage SRAM and it is achieved by parameter variations of scaled technologies. The power consumption and access time of the SRAM is also a complex parameter due to the unavoidable switching activities of the number of transistors used for different blocks like, SRAM cell, access transistors, pre-charge circuit, sense amplifier and decoders. It has been shown that conventional 6T SRAM fail to achieve low power and delay operation. The proposed 10T SRAM design gives an approach towards the hold power dissipation. The designed circuit has 10 transistors out of that 2 transistors are used as sleep transistor. The sleep transistors are used as switches. Such as header and footer switches and the switches are turned on during active mode of operations and turned off during idle or standby mode of operations. The designed SRAM cell also has conducting pMOS circuit, which can reduces the total power dissipation. The SRAM cell is simulated by using Cadence tool. A supply voltage of 1.8V is used which makes it enough for low power applications. The power obtained as 761.7mW, which reduces 15% of conventional 6T SRAM design. The delay obtained as 125.6ns, which reduces 45% of conventional 6T SRAM.


Author(s):  
Vinod Kumar ◽  
Ram Murti Rawat

This paper examines the factors that affect the static noise margin (SNM) of static random access memories which focus on optimizing read and write operation of 8T SRAM cell which is better than 6T SRAM cell using swing restoration for dual node voltage. New 8T SRAM technique on the circuit or architecture level is required. In this paper, comparative analysis of 6T and 8T SRAM cells with improved read and write margin is done for 130nm technology with cadence virtuoso schematics tool.


The presentation of the proposed FinFET based 6T SRAM cell has been assessed for its activity in low control space, indicating less SCEs, ultra little access time and high steadiness. The static clamor edge, spillage current, control dissemination and sub-limit current of FinFET based 6T SRAM cell at 32nm has been contrasted and MOSFET based 6T SRAM cell at 32nm innovation hub. It has been seen during the reproduction that the deferral among compose and read and power dissipation of FinFET based 6T SRAM cell is radically decreased when contrasted and regular MOSFET based 6T SRAM cell. The static power dissemination with differing width of Load, Driver and Access transistor of FinFET based model has additionally been weighed against MOSFET based model. At last, control dissemination and static clamor edge at 32nm for both MOSFET and FinFET based 6T SRAM cell have been contrasted all together with comprehend the subjectively conduct of the cell at various innovation hubs of the proposed FinFET model. It tends to be valued that the gadgets without anyone else's input don't add to the current joining period. Yet, until, a circuit investigation utilizing the proposed gadgets is attempted, the full advantages of joining can't be caught. Rationale and memory circuit plan in Nano scale system requires power over spillage flows with gadget level parameter varieties. After the wonderful decrease in Leakage current and power dissemination, a similar methodology is then executed to cutting edge SRAM cells. We have thought about different progressed proposed FinFET based SRAM cells with the customary progressed MOSFET based SRAM cells. The huge spillage decrease has been seen when we have changed from traditional MOSFET models to FinFET models. Finally, process parametric varieties at circuit level, gadget level and material level on FinFET based 6T SRAM cell is talked about and the instrument to control these varieties is introduced in the proposal. Procedure parametric varieties like word line, bit line, control supply tweaks is appeared and examined. Temperature impact is likewise appeared and talked about in the postulation. Every one of the recreations have been performed on Cadence Virtuoso at 45 nm innovation. Our investigation demonstrates that, utilization of FinFET gadget with characteristic body decreases spillage current and improves the driving capacity. Consequently, we presume that FinFET can develop as one of the promising possibility for decreasing spillage segments making it effective for low power and superior SRAM cell structure in nanoscale system. In this paper SRAM investigation as far as Static Noise Margin, Data Retention Voltage,


In the digital world, Static Random Access Memory (SRAM) is one of the efficient core component for electronics design, it consumes huge amount of power and die area. In this research, the SRAM design analysis in terms of read margin, write margin and Static Noise Margin (SNM) for low power application is considered. In SRAM memory, both read and write operation affect by noise margin. So, read and write noise margins are considered as the significant challenges in designing SRAM cell. In this research, robust 6T-SRAM cell is designed to decrease the power utilization. The Auto Awake Mode is developed to control the entire 6T-SRAM cell design. The proposed 6T-SRAM- Auto Awake Mode (6T-SRAM-AAM) was implemented to reduce power utilization of understand and write down operation inside the 20 nm FinFET library. The experimental results showed the proposed 6T-SRAM-AAM design reduced power consumption of read & write operation up to 25% to 33.33% compared to existing Static RAM cells design


2021 ◽  
Vol 13 ◽  
Author(s):  
Vijay Kumar Sharma ◽  
Masood Ahmad Malik

Background: As the Technology node scales down to deep sub-micron regime, the design of static random-access memory (SRAM) cell becomes a critical issue because of increased leakage current components. These leakage current components prevent to design a low power processor as large of the processor power is consumed by the memory part. Objective: In this paper, a SRAM cell is designed based on ON/OFF logic (ONOFIC) approach. Static noise margin (SNM) of the cell for the different states are calculated and evaluated by using butterfly as well as noise (N) curves with the help of Cadence tools at 45 nm technology node. Methods: ONOFIC approach helps to reduce the leakage current components which makes a low power memory cell. A performance comparison is made between the conventional six-transistor (6T) SRAM cell and memory cell using ONOFIC approach. Results: Low value of power delay product (PDP) is the outcome of ONOFIC approach as compared to conventional cell. ONOFIC approach decreases PDP by 99.99% in case of hold state. Conclusions: ONOFIC approach improves the different performance metrics for the different states of the SRAM cell.


Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 685
Author(s):  
Ming-Hwa Sheu ◽  
S M Salahuddin Morsalin ◽  
Chang-Ming Tsai ◽  
Cheng-Jie Yang ◽  
Shih-Chang Hsia ◽  
...  

To incur the memory interface and faster access of static RAM for near-threshold operation, a stable local bit-line static random-access memory (SRAM) architecture has been proposed along with the low-voltage pre-charged and negative local bit-line (NLBL) scheme. In addition to the low-voltage pre-charged and NLBL scheme being operated by the write bit-line column to work out for the write half-select condition. The proposed local bit-line SRAM design reduces variations and enhances the read stability, the write capacity, prevents the bit-line leakage current, and the designed pre-charged circuit has achieved an optimal pre-charge voltage during the near-threshold operation. Compared to the conventional 6 T SRAM design, the optimal pre-charge voltage has been improved up to 15% for the read static noise margin (RSNM) and the write delay enriched up to 22% for the proposed NLBL SRAM design which is energy-efficient. At 400 mV supply voltage and 25 MHz operating frequency, the read and write energy consumption is 0.22 pJ and 0.23 pJ respectively. After comparing with the related works, the access average energy (AAE) is lower than in other works. The overall performance for the proposed local bit-line SRAM has achieved the highest figure of merit (FoM). The designed architecture has been implemented based on the 1-Kb SRAM macros and TSMC−40 nm GP process technology.


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