scholarly journals An Optimized Adsorbent Sampling Combined to Thermal Desorption GC-MS Method for Trimethylsilanol in Industrial Environments

2012 ◽  
Vol 2012 ◽  
pp. 1-10 ◽  
Author(s):  
Jae Hwan Lee ◽  
Chunrong Jia ◽  
Yong Doo Kim ◽  
Hong Hyun Kim ◽  
Tien Thang Pham ◽  
...  
Keyword(s):  
Thermal Desorption ◽  
Semiconductor Industry ◽  
Mass Range ◽  
Laboratory Method ◽  
Semiconductor Wafer ◽  
Satisfactory Precision ◽  
Method Optimization ◽  
And Control ◽  
Wafer Manufacturing ◽  
Dual Bed

Trimethylsilanol (TMSOH) can cause damage to surfaces of scanner lenses in the semiconductor industry, and there is a critical need to measure and control airborne TMSOH concentrations. This study develops a thermal desorption (TD)-gas chromatography (GC)-mass spectrometry (MS) method for measuring trace-level TMSOH in occupational indoor air. Laboratory method optimization obtained best performance when using dual-bed tube configuration (100 mg of Tenax TA followed by 100 mg of Carboxen 569), n-decane as a solvent, and a TD temperature of 300°C. The optimized method demonstrated high recovery (87%), satisfactory precision (<15% for spiked amounts exceeding 1 ng), good linearity (R2=0.9999), a wide dynamic mass range (up to 500 ng), low method detection limit (2.8 ng m−3for a 20-L sample), and negligible losses for 3-4-day storage. The field study showed performance comparable to that in laboratory and yielded first measurements of TMSOH, ranging from 1.02 to 27.30 μg/m3, in the semiconductor industry. We suggested future development of real-time monitoring techniques for TMSOH and other siloxanes for better maintenance and control of scanner lens in semiconductor wafer manufacturing.

scholarly journals Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

2019 ◽  
Vol 11 (2) ◽  
pp. 87-105
Author(s):  
Mithun Sharma ◽  
Sanjeev P. Sahni ◽  
Shilpi Sharma
Keyword(s):  
Silicon Wafer ◽  
Six Sigma ◽  
Semiconductor Industry ◽  
Stability Control ◽  
Thickness Variation ◽  
Root Cause ◽  
Six Sigma Methodology ◽  
And Control ◽  
Wafer Manufacturing

Abstract Aiming to reduce flatness (Total Thickness Variation, TTV) defects in the lapping process of the silicon wafer manufacturing, it is crucial to understand and eliminate the root cause(s). Financial losses resulting from TTV defects make the lapping process unsustainable. DMAIC (Define, Measure, Analyse, Improve and Control), which is a Six Sigma methodology, was implemented to improve the quality of the silicon wafer manufacturing process. The study design and the choice of procedures were contingent on customer requirements and customised to ensure maximum satisfaction; which is the underlying principle of the rigorous, statistical technique of Six Sigma. Previously unknown causes of high TTV reject rates were identified, and a massive reduction in the TTV reject rate was achieved (from 4.43% to 0.02%). Also, the lapping process capability (Ppk) increased to 3.87 (beyond the required standard of 1.67), suggesting sustainable long-term stability. Control procedures were also effectively implemented using the techniques of poka yoke and control charts. This paper explores the utility of Six Sigma, a quality management technique, to improve the quality of a process used in the semiconductor industry. The application of the Six Sigma methodology in the current project provides an example of the root cause investigation methodology that can be adopted for similar processes or industries. Some of the statistical tools and techniques were used for the first time in this project, thereby providing new analysis and quality improvement platform for the future. The article offers a deeper understanding of the factors that impact on the silicon wafer flatness in the lapping process. It also highlights the benefits of using a structured problem-solving methodology like Six Sigma.

scholarly journals A Laboratory Method to Measure Skin Surface Staining by Cigarette Smoke, Tobacco Heating Products and E-Cigarettes

2021 ◽  
Vol 30 (4) ◽  
pp. 158-166
Author(s):  
Annette Dalrymple ◽  
Emma-Jayne Bean ◽  
Jesse Thissen ◽  
Holger Behrsing ◽  
Steven Coburn ◽  
...  
Keyword(s):  
Cigarette Smoke ◽  
Skin Surface ◽  
Laboratory Method ◽  
Porcine Skin ◽  
Skin Sample ◽  
Side Stream ◽  
Air Control ◽  
And Control ◽  
Skin Samples

Summary Exhaled or side-stream cigarette smoke (CS) may visually stain a consumer's skin over time. Tobacco heating products (THPs) and e-cigarettes (ECs) have reduced staining potential because they do not produce side-stream aerosols and their exhaled aerosols have significantly reduced levels of toxicants, particles and odour. Here we assess discolouration of porcine skin in vitro after exposure to particulate matter (PM) or aerosols from CS (3R4F), two THPs (glo and glo sens) and an EC (iSwitch Maxx). PM was prepared by capturing aerosols on Cambridge filter pads and eluting with dimethyl sulfoxide (DMSO). Abattoir-obtained porcine skin samples were incubated with PM or DMSO control at 37 °C between 0 and 6.0 h. For aerosol assessment, porcine skin samples were exposed to between 50 and 400 puffs of the products, or air control, using a smoking machine. Colour profiles and staining levels of each skin sample were measured at different timepoints and puff thresholds using a spectrophotometer. Staining increased with time and dose, the greatest changes being observed following exposure to aerosols and PM from CS. THP, EC and control values were significantly different from CS after 0.5 h exposure to PM or 50 puffs of aerosols. The minimal staining induced by THPs and EC was comparable to controls. These data suggest that THPs and ECs could offer hygiene benefits to consumers who switch from smoking cigarettes. Further studies are required to assess the longer-term effects of THPs and ECs on skin discoloration. [Contrib. Tob. Nicotine Res. 30 (2021) 158–166]

Modeling, Simulation and Control of Single Wafer Process in Cluster Tool Base on Ft-Ir In-Line Sensor

1995 ◽  
Vol 389 ◽  
Author(s):  
Shaohua Liu ◽  
Peter Solomon ◽  
R. Carpio ◽  
B. Fowler ◽  
D. Simmons ◽  
...  
Keyword(s):  
Thin Film ◽  
Semiconductor Industry ◽  
Current Approach ◽  
Infrared Reflectance ◽  
Film Properties ◽  
Reflectance Measurement ◽  
Infrared Spectrometer ◽  
Ft Ir ◽  
And Control ◽  
Cluster Tool

ABSTRACTThis paper outlines our current approach to utilize infrared reflectance spectroscopy for thin film measurement in the semiconductor industry. The multi-layer thickness and doping concentration of IC wafers can be determined by a single angle, unpolarized infrared reflectance measurement performed using Fourier transform infrared spectrometer. A computer algorithm, which matches theoretical to measured infrared reflectance spectra, was successfully employed to determine multiple thin film properties.

Elman Neural Network–Based Dynamic Scheduling of Wafer Photolithography Process

2011 ◽  
Vol 186 ◽  
pp. 36-40 ◽  
Author(s):  
Bing Hai Zhou
Keyword(s):  
Neural Network ◽  
Manufacturing System ◽  
Dynamic Scheduling ◽  
Learning Algorithm ◽  
Semiconductor Wafer ◽  
Simulation Experiments ◽  
Elman Neural Network ◽  
Scheduling Method ◽  
Photolithography Process ◽  
Wafer Manufacturing

Photolithography area is usually a bottleneck area in a semiconductor wafer manufacturing system (SWMS). It is difficult to schedule photolithography area on real-time optimally. Here, an Elman neural network (ENN)-based dynamic scheduling method is proposed. An ENN-based sample learning algorithm is proposed for selecting best combination of scheduling rules. To illustrate the feasibility and practicality of the presented method, the simulation experiment is developed. A numerical example is use to evaluate the proposed method. Results of simulation experiments show that the proposed method is effective to schedule a complex wafer photolithography process.

scholarly journals Ergonomics in Semiconductor Wafer Manufacturing

2013 ◽  
Vol 10 ◽  
pp. 231-235
Author(s):  
Wai Yi Foong ◽  
Amir Hamzah bin Hassan
Keyword(s):  
Preventive Maintenance ◽  
Material Handling ◽  
Automated Guided Vehicle ◽  
Lot Size ◽  
Semiconductor Wafer ◽  
Manual Material Handling ◽  
The Impact ◽  
Wafer Manufacturing

In semiconductor wafer manufacturing, there are only a few processes but many steps. Each wafer must go through the processes multiple times (steps) and sometimes not in the same sequence. All the wafers in lot size of 25 pieces are transferred between the processes using an Automated Guided Vehicle from stocker to stocker. Then, the wafers are manually transferred to the processing tool. Although the tools are designed per SEMI S2/S8 standards [1,, the equipment technician can get into awkward postures when performing the preventive maintenance. Both the manual material handling between the tools and awkward postures during preventive maintenance can pose an ergonomic challenge. However, some techniques can be used to minimize the impact. This paper shares the techniques which can ease ergonomic problems in semiconductor wafer manufacturing

scholarly journals How to Succeed in the Presence of Financial and Technological Gaps: From the Perspective of Governance Innovation

2013 ◽  
Vol 14 (2) ◽  
pp. 1-16
Author(s):  
Hannah Jun ◽  
Wonseok Woo ◽  
Hyoung-Goo Kang
Keyword(s):  
Semiconductor Industry ◽  
Conventional Wisdom ◽  
High Tech ◽  
Technological Capabilities ◽  
Semiconductor Memory ◽  
High Tech Sector ◽  
Specific Factors ◽  
And Control ◽  
Governance Innovation ◽  
Practical Implications

Conventional wisdom would predict firms with little financial and technological capabilities to fail. This is especially true for such firms in the high-tech sector during periods of industry downturn. In this paper, we ask how firms experiencing financial and technological gaps can succeed by transforming current challenges into opportunities via governance innovation. We select Hynix and the semiconductor industry for the investigation. Hynix emerged from near bankruptcy become the number two player in the global semiconductor memory market. We find that Hynix’s case requires extending prevailing theory to focus on governance and control. We pinpoint specific factors that contributed to Hynix’s success from the perspective of governance innovation for the theoretical extension and suggest practical implications.

Statistical modeling of significant diagnostic methods used in the treatment ofprimary forms of inflammatory periodontal diseases

10.12737/6674 ◽  
2014 ◽  
Vol 8 (1) ◽  
pp. 0-0
Author(s):  
Коровкина ◽  
A. Korovkina
Keyword(s):  
Inflammatory Diseases ◽  
Periodontal Diseases ◽  
Laboratory Method ◽  
Diagnostic Methods ◽  
Laser Doppler ◽  
Doppler Flowmetry ◽  
Clinical Methods ◽  
Microsoft Office ◽  
And Control ◽  
Initial Forms

In the article the ground of choice of meaningful methods of diagnostics is carried out on the basis of statistical analysis of data got during realization of photo-radiotherapy of initial forms of inflammatory diseases of paradontium. For this purpose inspection was conducted in 100 patients with gingivitis of easy and middle degree, periodontitis of easy degree by means of an offer algorithm of diagnostics – clinical and laboratory me-thods. The clinical methods were indexes, stomatoscopy and the laboratory method was the laser Doppler flow-metry. All patients were divided into 2 groups: basic (50 patients), which was applied photo-radiotherapy using a device Uzor-А-2К by power 18 W; and control (50 patients) to them medical treatment was recommended. Sta-tistical analysis of data, obtained in the study, was performed using SAS 9.3. and Microsoft Office 2010 - analysis of contingency tables and logistic regression.Significant diagnostic methods when conducting contin-gency tables were stomatoscope and the CPITN index. Laser Doppler flowmetry and significant parameters of microcirculation were determined using the method of logical regression. This is testified to optimally proposed algorithm for diagnosis of early forms of inflammatory periodontal diseases.

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